Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

Abstract: A system updating method and an electronic apparatus are provided. The electronic apparatus operates a first operating system (OS). In the method, an installation program is downloaded through an updater. The installation program includes one or more installation parameter used for an installation operation of target firmware. The target firmware includes a second OS. The installation operation is performed through the updater with the installation program according to the installation parameter provided by the installation program, to replace the first OS with the second OS. The installation program calls one or more function operated in the first OS and provided by the updater according to the installation parameter. Accordingly, the device utilization, installation efficiency, and installation flexibility may be increased.

Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

Abstract: Techniques pertaining to low-power enhanced multi-link single radio (EMLSR) listen in wireless communications are described. A first multi-link device (MLD) reduces power consumption while supporting a latency-sensitive application by performing certain operations. The first MLD first listens at a lower power in a narrower bandwidth to receive an initial physical-layer protocol data unit (PPDU) from a second MLD as part of a frame exchange. In response to receiving the initial PPDU, the first MLD switches from the narrower bandwidth to a wider bandwidth to complete the frame exchange with the second MLD in the wider bandwidth. In reducing the power consumption, the first MLD reduces its power consumption to the lower power when operating in the narrower bandwidth compared to a higher power used by the first MLD when operating in the wider bandwidth.

Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

Abstract: An electronic apparatus and a light-emitting module driving circuit thereof are provided. The electronic apparatus includes a light-emitting module and a driving circuit. The driving circuit is coupled to the light-emitting module and is configured to generate a driving signal set to drive the light-emitting module. The driving circuit includes a first driver, a second driver, and a switching circuit. The first driver receives a control signal related to an operation status of the electronic apparatus and generates a first signal set according to the control signal. The second driver includes at least one resistor which receives system power and accordingly generates a second signal set. The switching circuit is coupled to the first driver and the second driver to receive the first signal set and the second signal set, respectively. When the switching circuit does not receive the first signal set, the switching circuit takes the second signal set as the driving signal set.

Abstract: An electronic apparatus and a light-emitting module driving circuit thereof are provided. The electronic apparatus includes a light-emitting module and a driving circuit. The driving circuit is coupled to the light-emitting module and is configured to generate a driving signal set to drive the light-emitting module. The driving circuit includes a first driver, a second driver, and a switching circuit. The first driver receives a control signal related to an operation status of the electronic apparatus and generates a first signal set according to the control signal. The second driver includes at least one resistor which receives system power and accordingly generates a second signal set. The switching circuit is coupled to the first driver and the second driver to receive the first signal set and the second signal set, respectively. When the switching circuit does not receive the first signal set, the switching circuit takes the second signal set as the driving signal set.

Abstract: A wireless communication calibration system has a radio chipset, an analog circuit set, and a calibration path. The radio chipset has a transmitter and a receiver. The analog circuit set is external to the radio chipset and coupled to the transmitter, and receives an output signal of the transmitter and generates a transmission signal according to the output signal. The calibration path is external to the radio chipset and coupled to the analog circuit set, and guides an input signal to the receiver, wherein the input signal is derived from the transmission signal, and a first delay is calculated after the input signal is received by the receiver.

Abstract: A wireless communication calibration system has a radio chipset, an analog circuit set, and a calibration path. The radio chipset has a transmitter and a receiver. The analog circuit set is external to the radio chipset and coupled to the transmitter, and receives an output signal of the transmitter and generates a transmission signal according to the output signal. The calibration path is external to the radio chipset and coupled to the analog circuit set, and guides an input signal to the receiver, wherein the input signal is derived from the transmission signal, and a first delay is calculated after the input signal is received by the receiver.

Abstract: A method for creating a comic strip includes selecting a background image from a number of background images for a number of comic cells of the comic strip, selecting a character from a number of characters to appear in the comic cells, selecting a character expression from a number of character expressions for the character to make, inputting text speech corresponding to the at least one character, and inputting audio for the character to speak. The comic cells can include different background images and different characters. The comic strip can be created by one user or a number of users.

Abstract: A phosphor has a chemical formula of: A(B1-mEum2+)PO4, wherein A is at least one of the group consisting of Li, Na and K, and B is at least one of the group consisting of Ca, Sr and Ba, and 0.0001?m?0.8.

Abstract: A system and method is disclosed for providing service negotiation during a hard handoff of a mobile station to a target base station in a wireless communication system. The target base station negotiates a Service Option with the mobile station using service negotiation messages. The mobile station receives the Service Option from the target base station and uses the Service Option to communicate with the target base station. The target base station and the mobile station each comprise a service negotiation controller that is capable of exchanging service negotiation messages to negotiate the Service Option for the mobile station.

Abstract: A new Clear Reject message (or, equivalently, a new cause value indicating “Call on Hold” for the Clear Command) is defined for IS-2001 wireless communications to prevent resource deallocation prior to re-paging of a mobile station terminating connections with a call on hold. In response to receiving the new message from a mobile switching center, the serving base station maintains resource allocations for the mobile station and notifies the mobile station of the holding call, causing a ring tone to sound at the mobile station. State transition and paging channel monitoring by the mobile station, use of paging resources by the mobile switching center, and resource tear-down and reassignment by the base station are all avoided.