Patents by Inventor Yi-Chung Huang
Yi-Chung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955401Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.Type: GrantFiled: March 13, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Publication number: 20230215774Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.Type: ApplicationFiled: March 13, 2023Publication date: July 6, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Patent number: 11626341Abstract: A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°<?<90°. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.Type: GrantFiled: March 24, 2022Date of Patent: April 11, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Publication number: 20220216123Abstract: A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°<?<90°. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.Type: ApplicationFiled: March 24, 2022Publication date: July 7, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Patent number: 11289398Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<?<90°. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.Type: GrantFiled: March 2, 2020Date of Patent: March 29, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Publication number: 20210098330Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<?<90°. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.Type: ApplicationFiled: March 2, 2020Publication date: April 1, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
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Publication number: 20160139401Abstract: A glass phosphor color wheel includes a wheel body made of a glass phosphor formed by sintering a glass material and fluorescent powder. The fluorescent powder is a fluorescent material selected from the group consisting of yttrium aluminum garnet, nitride, silicate, aluminate, and oxynitride. The glass material is selected from the group consisting of a silicate system, a phosphor system, a borate system, and a tellurate system. A method for producing a glass phosphor color wheel includes concentrically placing an inner tube into an outer tube. The glass material and the fluorescent powder are placed between the outer and inner tubes and are formed into a wheel body. In another method, the glass material and the fluorescent powder are sintered at a temperature of 500-1000° C. to form at least one glass phosphor color block that is subsequently coupled to a substrate to form a glass phosphor color wheel.Type: ApplicationFiled: November 14, 2014Publication date: May 19, 2016Inventors: Wood-Hi Cheng, Yung-Peng Chang, Chun-Chin Tsai, Yi-Chung Huang, Wei-Chih Cheng
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Publication number: 20160139300Abstract: A method for producing a low temperature glass phosphor lens includes dry mixing a glass material and fluorescent powder to form a powdery or particulate mixture. The mixture is grinded to a diameter of 15-20 ?m, obtaining uniformly mixed glass fluorescent powder. The glass fluorescent powder is hot pressed into a glass phosphor at a temperature of 500-1000° C. The glass phosphor is grinded and polished into a lens. The fluorescent powder can be a fluorescent material selected from the group consisting of yttrium aluminum garnet, nitride, and silicate. The glass material can be selected from the group consisting of a silicate system, a phosphor system, a borate system, and a tellurate system. The glass phosphor includes characteristics of both of glass and fluorescence. The glass phosphor can keep efficiency under the high heat generated by the chip of an LED.Type: ApplicationFiled: November 14, 2014Publication date: May 19, 2016Inventors: Wood-Hi Cheng, Yung-Peng Chang, Li-Yin Chen, Chun-Chin Tsai, Yi-Chung Huang, Wei-Chih Cheng, Jin-Kai Chang
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Publication number: 20150370155Abstract: A projector using glass phosphor as a color mixing element includes: a laser light source capable of producing light; an optical system, the color mixing member, a reflection element and an imaging system disposed on a light transmission path. The optical system includes a color wheel, the light will be converted into light beams of different colors when passing through the color wheel. The color mixing element is located between the laser light source and the optical system and made of glass phosphor, and a glass transition temperature of the glass phosphor being higher than 500° C. The imaging system serves to convert the light beams into an image. The use of the heat-resistant glass phosphor as the color mixing element enables the projector to have a wide color gamut and an adjustable color gamut.Type: ApplicationFiled: June 23, 2014Publication date: December 24, 2015Inventors: Wood-Hi CHENG, Yung-Peng Chang, Chun-Chin Tsai, Ming-Chang Shih, Wen-How Lan, Yi-Chung Huang, Wei-Chih Cheng
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Patent number: 7882986Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.Type: GrantFiled: August 24, 2007Date of Patent: February 8, 2011Inventors: Yi-Chung Huang, Yu-Jung Huang
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Publication number: 20090050652Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Inventors: Yi-Chung Huang, Yu-Jung Huang
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Patent number: 6551078Abstract: A pump assembly for an aquarium includes a water circulation pump having a first casing and an aeration pump having a second casing, wherein the aeration pump is operated by the magnetic field of a rotating magnetic shaft that is rotatably mounted in the water circulation pump. The first casing and the second casing are connected to each other. A lever in the aeration pump is reciprocated continually to draw air into the pump and discharge air into the aquarium due to the magnetic field of the rotating magnetic shaft so that the coil is unnecessary in the aeration pump. Consequently, the pump assembly can be marketed for a lower price and save energy when used.Type: GrantFiled: May 11, 2001Date of Patent: April 22, 2003Inventor: Yi-Chung Huang
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Publication number: 20020168276Abstract: A pump assembly for an aquarium includes a water circulation pump having a first casing and an aeration pump having a second casing, wherein the aeration pump is operated by the magnetic field of a rotating magnetic shaft that is rotatably mounted in the water circulation pump. The first casing and the second casing are connected to each other. A lever in the aeration pump is reciprocated continually to draw air into the pump and discharge air into the aquarium due to the magnetic field of the rotating magnetic shaft so that the coil is unnecessary in the aeration pump. Consequently, the pump assembly can be marketed for a lower price and save energy when used.Type: ApplicationFiled: May 11, 2001Publication date: November 14, 2002Inventor: Yi-Chung Huang
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Patent number: 6461122Abstract: A water circulation pump for an aquarium includes a shaft centrally engaged to the impeller. The free end of the shaft includes a pinion securely mounted to drive a reduction device. The reduction device includes a gear set having a final output gear that has an output shaft mounted to provide an extra power source. For example, the output shaft can drive a decorative device to make the aquarium looking more vivid and vigorous.Type: GrantFiled: October 24, 2000Date of Patent: October 8, 2002Inventor: Yi-Chung Huang
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Patent number: 5736672Abstract: A magnetic noise eliminator mounted around the signal line of a computer or the like to stabilize the magnetic field produced by the signal line and to protect it against outside noise. The magnetic noise eliminator has two symmetrical cover shells connected together by forcing the longitudinal teeth and longitudinal grooves of one cover shell into engagement with the longitudinal grooves and longitudinal teeth of the other, and two longitudinally grooved magnetic blocks abutted together by forcing the longitudinal flange and longitudinal recess of one magnetic block into engagement with the longitudinal recess and longitudinal flange of the other.Type: GrantFiled: January 29, 1996Date of Patent: April 7, 1998Inventor: Yi-Chung Huang