Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

Abstract: A movement detection method, applied to a navigation input device with a navigation pattern comprising a center pattern and a radial pattern. The movement detection method comprises: (a)capturing a sensing image comprising a center pattern image and at least portion of a radial pattern image by an image sensor, wherein the center pattern image corresponds to the center pattern and the radial pattern image corresponding to the radial pattern; (b)computing a translation of the navigation input device according to shift of the center pattern image; and (c)computing a rotation angle of the navigation input device according to a first pattern relation between the center pattern image and a first portion of the radial pattern image. The translation and the rotation angle can be precisely and sensitively detected even if the joystick device is miniaturized, since the translation and the rotation angle are computed according to the navigation pattern.

Abstract: A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, a magnetic tunneling junction (MTJ) on the MTJ region and a first metal interconnection on the MTJ. Preferably, a top view of the MTJ includes a circle and a top view of the first metal interconnection includes an ellipse overlapping the circle.

Abstract: A detection method for a malicious domain name in a domain name system (DNS) and a detection device are provided. The method includes: obtaining network connection data of an electronic device; capturing log data related to at least one domain name from the network connection data; analyzing the log data to generate at least one numerical feature related to the at least one domain name; inputting the at least one numerical feature into a multi-type prediction model, which includes a first data model and a second data model; and predicting whether a malicious domain name related to a malware or a phishing website exists in the at least one domain name by the multi-type prediction model according to the at least one numerical feature.

Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. The display may have a number of independently controllable viewing zones. Each viewing zone displays a respective two-dimensional image. Each eye of the viewer may receive a different one of the two-dimensional images, resulting in a perceived three-dimensional image. The electronic device may include display pipeline circuitry that generates and processes content to be displayed on the lenticular display. Content generating circuitry may generate content that includes a plurality of two-dimensional images, each two-dimensional image corresponding to a respective viewing zone. Pixel mapping circuitry may be used to map the two-dimensional images to the array of pixels in the lenticular display. The array of pixels may have a diagonal layout. An offset map may be used by the pixel mapping circuitry to account for the diagonal layout.

Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. A plurality of lenticular lenses may extend across the length of the display. The lenticular lenses may be configured to enable stereoscopic viewing of the display such that a viewer perceives three-dimensional images. The display may have a number of independently controllable viewing zones. The viewer may be particularly susceptible to artifacts caused by crosstalk at the edge viewing zones within the primary field of view of the display. Certain types of content may also be more vulnerable to crosstalk than other types of content. Therefore, to mitigate crosstalk artifacts, the pixel value for each pixel may be adjusted based on the viewing zone of the respective pixel and content information (such as texture information or brightness information) associated with the respective pixel.

Abstract: A signal calibration method, a memory storage device, and a memory control circuit unit are provided. The signal calibration method includes: generating a clock signal and a data strobe signal according to an internal clock signal; respectively transmitting the clock signal and the data strobe signal to a target volatile memory module among multiple volatile memory modules through a first signal path and a second signal path; obtaining a shift value between the data strobe signal and the clock signal at the target volatile memory module; and storing an initial delay setting of the data strobe signal according to delay information of the data strobe signal in response to the shift value being greater than a threshold value.

Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.

Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.

Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°<?<90°. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°<?<90°. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<?<90°. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle ? is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°<?<90°. The heat spreader is disposed over the substrate, wherein the semiconductor device is disposed between the heat spreader and the substrate. The adhesive layer is surrounding the semiconductor device and attaching the heat spreader onto the substrate, wherein the adhesive layer has a first opening misaligned with one of corners of the semiconductor device closest to the first opening.

Abstract: A method for producing a low temperature glass phosphor lens includes dry mixing a glass material and fluorescent powder to form a powdery or particulate mixture. The mixture is grinded to a diameter of 15-20 ?m, obtaining uniformly mixed glass fluorescent powder. The glass fluorescent powder is hot pressed into a glass phosphor at a temperature of 500-1000° C. The glass phosphor is grinded and polished into a lens. The fluorescent powder can be a fluorescent material selected from the group consisting of yttrium aluminum garnet, nitride, and silicate. The glass material can be selected from the group consisting of a silicate system, a phosphor system, a borate system, and a tellurate system. The glass phosphor includes characteristics of both of glass and fluorescence. The glass phosphor can keep efficiency under the high heat generated by the chip of an LED.

Abstract: A glass phosphor color wheel includes a wheel body made of a glass phosphor formed by sintering a glass material and fluorescent powder. The fluorescent powder is a fluorescent material selected from the group consisting of yttrium aluminum garnet, nitride, silicate, aluminate, and oxynitride. The glass material is selected from the group consisting of a silicate system, a phosphor system, a borate system, and a tellurate system. A method for producing a glass phosphor color wheel includes concentrically placing an inner tube into an outer tube. The glass material and the fluorescent powder are placed between the outer and inner tubes and are formed into a wheel body. In another method, the glass material and the fluorescent powder are sintered at a temperature of 500-1000° C. to form at least one glass phosphor color block that is subsequently coupled to a substrate to form a glass phosphor color wheel.

Abstract: A projector using glass phosphor as a color mixing element includes: a laser light source capable of producing light; an optical system, the color mixing member, a reflection element and an imaging system disposed on a light transmission path. The optical system includes a color wheel, the light will be converted into light beams of different colors when passing through the color wheel. The color mixing element is located between the laser light source and the optical system and made of glass phosphor, and a glass transition temperature of the glass phosphor being higher than 500° C. The imaging system serves to convert the light beams into an image. The use of the heat-resistant glass phosphor as the color mixing element enables the projector to have a wide color gamut and an adjustable color gamut.

Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.

Abstract: A liquid dispenser is mounted on a container and has a shell, a spout assembly, an injection assembly, a power pack and an activating assembly. The shell is mounted on the container and has an injection tube. The spout assembly is formed on and protrudes from the shell. The injection assembly is mounted in the shell pumps air into the injection tube to force liquid from the spout assembly. The activating assembly selectively activates the injection assembly and selectively seals or opens an air passage to the injection tube.