Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A composition for preparing polyamide powders, includes polyamide granules, a nucleating agent and an organic solvent having a boiling point ranging from 190° C. to 209° C. The weight ratio of the polyamide granules to the organic solvent ranges from 0.11 to saturation solubility of the polyamide granules is the organic solvent, and the weight ratio of the polyamide granules to the nucleating agent is 100:1.

Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.?Tm?T2?33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.

Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.?Tm?T2?33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.

Abstract: This invention discloses a method of selective plastic insert molding on metal component and its product. A metal joint component is bonded with a metal component. After which, the joint component is submerged in plastic so that the molded plastic can be secured on the metal component firmly. Hence, a desired plastic structure can be formed on the metal component. This invention can shorten the manufacturing process and reduce the cost. In addition, it solves the traditional bonding problem between the plastic and the metal component as well as the problem concerning processing time and high cost.

Abstract: A monitor attitude adjustment apparatus used in an electronic apparatus comprises a mount base; an attitude adjusting mechanism consisting of a plurality of actuating devices, each actuating device comprising a driver and a displacement mechanism, the driver being the force source for driving the movement of corresponding displacement mechanism, and each displacement mechanism having a constrained degree of freedom for mechanical motion; and a suspension mount with one end mechanically connected to the attitude adjusting mechanism and the other end securing the electronic apparatus; wherein the actuating devices in the attitude adjusting mechanism constitute an integrated mechanical state and the position or orientation of the electronic apparatus corresponds to the integrated mechanical state of the attitude adjusting mechanism.

Abstract: The present invention relates to a cantilever structure of mounting frame that uses mainly the arc tracks of a first through-slot member and a second through-slot member on a flange to produce different tensile elongations of the elastic element such that the mounting frame can stay firmly at the adjusted position under the bearing created by different angles.

Abstract: The present invention relates to a mounting frame structure for flat panel display device that allows the user to conveniently mount or dismount a flat panel display device on or from a wall and adjust the tilt of the flat panel display device with ease to a degree comfortable for viewing by the user.

Abstract: An electrical connector (1) used in high frequency signal transmission filed includes an insulative housing (2), an immovable contact (5) retained in the housing. The immovable contact includes a main body (50), a cantilevered arm (51) longitudinally extending from the main body, a soldering portion (53) backwardly extending from the main body. The cantilevered arm forms an angle to the main body. The main body is a substantially “Z” shape to prolong the current path of the immovable contact and to cut the area of the immovable contact, thereby decreasing the capacity of the immovable contact.

Abstract: An electrical connector (1) used in high frequency signal transmission filed includes an insulative housing (2), an immovable contact (5) retained in the housing. The immovable contact includes a main body (50), a cantilevered arm (51) longitudinally extending from the main body, a soldering portion (53) backwardly extending from the main body. The cantilevered arm forms an angle to the main body. The main body is a substantially “Z” shape to prolong the current path of the immovable contact and to cut the area of the immovable contact, thereby decreasing the capacity of the immovable contact.