Patents by Inventor Yi-Chyng Fang
Yi-Chyng Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8053960Abstract: An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.Type: GrantFiled: March 17, 2009Date of Patent: November 8, 2011Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Yeu-Lih Lin, Yi-Chyng Fang
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Patent number: 7755897Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.Type: GrantFiled: December 27, 2007Date of Patent: July 13, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Fei Chen, Di-Qiong Zhao, Yi-Chyng Fang, Yue-Bin Wang
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Patent number: 7745967Abstract: A cooling fan includes a fan housing (10) having a central tube (102) extending upwardly therefrom, a bearing (40) received in the central tube, a stator (20) mounted around the central tube, a rotor (30), and a cover (50). The bearing defines a bearing hole (47) therein. The rotor includes a hub (32), a plurality of blades (34) extending outwardly from the hub, and a shaft (36) extending downwardly from the hub into the bearing hole of the bearing. The cover is mounted around the shaft and arranged on the bearing to seal a top end of the bearing. The cover is made of powders by sintering and thus has a plurality of pores to generate capillary force to absorb lubricant oil leaking out of the bearing.Type: GrantFiled: December 18, 2007Date of Patent: June 29, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Qiang Zhang, Zhi-Ya Yang, Wun-Chang Shih, Yi-Chyng Fang
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Publication number: 20100020494Abstract: A heat dissipation device includes a heat sink and a fan. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The first fin assembly includes a plurality of parallel first fins arranged side by side. A first airflow channel is formed between each two neighboring first fins and communicates with a top side of the heat sink. Each of the second fin assemblies includes a plurality of parallel second fins. A second airflow channel is formed between each two neighboring second fins and communicates with the top side of the heat sink. The first fins are perpendicular to the second fins with the first airflow channels and the second airflow channels communicating with four sides of the heat sink, respectively.Type: ApplicationFiled: December 5, 2008Publication date: January 28, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: QING-LEI GUO, SHOU-LI ZHU, YI-CHYNG FANG
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Publication number: 20090321050Abstract: A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly.Type: ApplicationFiled: April 3, 2009Publication date: December 31, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: QING-LEI GUO, SHOU-LI ZHU, YI-CHYNG FANG
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Publication number: 20090261707Abstract: An LED illumination device includes an optical section disposed at a bottom end of the LED illumination device, and in which a light source is provided. A heat dissipation section located adjacent to the optical section includes a plurality of fins thermally contacting the light source. The electrical section is disposed at a top end of the LED illumination device and electrically connects with the light source. The heat dissipation section is disposed between the optical section and the electrical section. The electrical section defines a plurality of air exchanges communicating the inside of the electrical section with the heat dissipation section and a plurality of exhaust ports communicating the inside of the electrical section with an external environment of the LED illumination device.Type: ApplicationFiled: March 17, 2009Publication date: October 22, 2009Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, YEU-LIH LIN, YI-CHYNG FANG
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Publication number: 20090168356Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.Type: ApplicationFiled: December 27, 2007Publication date: July 2, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: FEI CHEN, DI-QIONG ZHAO, YI-CHYNG FANG, YUE-BIN WANG
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Publication number: 20090079303Abstract: A cooling fan includes a fan housing (10) having a central tube (102) extending upwardly therefrom, a bearing (40) received in the central tube, a stator (20) mounted around the central tube, a rotor (30), and a cover (50). The bearing defines a bearing hole (47) therein. The rotor includes a hub (32), a plurality of blades (34) extending outwardly from the hub, and a shaft (36) extending downwardly from the hub into the bearing hole of the bearing. The cover is mounted around the shaft and arranged on the bearing to seal a top end of the bearing. The cover is made of powders by sintering and thus has a plurality of pores to generate capillary force to absorb lubricant oil leaking out of the bearing.Type: ApplicationFiled: December 18, 2007Publication date: March 26, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: QIANG ZHANG, ZHI-YA YANG, WUN-CHANG SHIH, YI-CHYNG FANG
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Patent number: 7142426Abstract: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.Type: GrantFiled: December 17, 2004Date of Patent: November 28, 2006Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Gen-Cai Wang, Di-Qiong Zhao, Yi-Chyng Fang
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Patent number: 7139171Abstract: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.Type: GrantFiled: December 21, 2004Date of Patent: November 21, 2006Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Gen-Cai Wang, Yi-Chyng Fang
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Publication number: 20060124205Abstract: A method for combining two components together includes the following steps: a) surface treating the two components; b) placing them within a heating apparatus while they contact with each other, a force being applied to the two components to push then against each other on the contacting surfaces thereof; c) heating the two components to a predetermined temperature which is hold for a predetermined period time to cause the two components to diffuse at the contacting interface to thereby combine the two components together; d) cooling the combined two components and taking them out of the heating apparatus.Type: ApplicationFiled: October 18, 2005Publication date: June 15, 2006Inventors: Chu-Wan Hong, Chang-Ting Lo, Yi-Chyng Fang, Jung-Yuan Wu, Yeu-Lih Lin, Peng-Peng Zhang
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Publication number: 20060034058Abstract: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.Type: ApplicationFiled: December 17, 2004Publication date: February 16, 2006Applicant: HON HAI Precision Industry CO., LTD.Inventors: Gen-Cai Wang, Di-Qiong Zhao, Yi-Chyng Fang
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Patent number: 6973962Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.Type: GrantFiled: July 16, 2004Date of Patent: December 13, 2005Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Ching-Bai Hwang, Yi-Chyng Fang, Yeu-Lih Lin
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Publication number: 20050207118Abstract: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.Type: ApplicationFiled: December 21, 2004Publication date: September 22, 2005Applicant: HON HAI Precision Industry CO., LTD.Inventors: Gen-Cai Wang, Yi-Chyng Fang
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Publication number: 20050082034Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.Type: ApplicationFiled: July 16, 2004Publication date: April 21, 2005Applicant: HON HAI Precision Industry CO., LTD.Inventors: Ching-Bai Hwang, Yi-Chyng Fang, Yeu-Lih Lin