Patents by Inventor Yi Dinghai

Yi Dinghai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12342448
    Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: June 24, 2025
    Assignee: NVIDIA Corp.
    Inventors: Joey Cai, Tiger Yan, Zhu Hao, Yi Dinghai
  • Publication number: 20250048532
    Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 6, 2025
    Applicant: NVIDIA Corp.
    Inventors: Joey Cai, Tiger Yan, Zhu Hao, Yi Dinghai
  • Publication number: 20230337350
    Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Applicant: NVIDIA Corp.
    Inventors: Joey Cai, Tiger Yan, Zhu Hao, Yi Dinghai