Patents by Inventor Yi Eok KWON

Yi Eok KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FAN-OUT SEMICONDUCTOR PACKAGE
    Publication number: 20190229070
    Abstract: A fan-out semiconductor package includes: a semiconductor chip; a redistribution portion disposed below the semiconductor chip; a reinforcing member disposed on the redistribution portion and surrounding the semiconductor chip; and an encapsulant disposed on the redistribution portion to embed the semiconductor chip and the reinforcing member therein.
    Type: Application
    Filed: August 20, 2018
    Publication date: July 25, 2019
    Inventors: Yi Eok KWON, Jae Ean LEE, Hak Young LEE