Abstract: The present invention discloses an encapsulation layer structure including a first organic layer, an inorganic thin film, and a second organic layer. The first organic layer has a bottom surface and a first wavy surface opposite to the bottom surface. The first wavy surface has a plurality of peak portions and a plurality of valley portions, and the peak portions and valley portions are alternately arranged with each other. The inorganic thin film is conformally disposed on the first wavy surface of the first organic layer, and the inorganic thin film has a second wavy surface opposite to the first wavy surface. The second organic layer is over the second wavy surface of the inorganic thin film. This encapsulation layer structure may prevent the penetration of oxygen and moisture effectively.

Abstract: A display panel includes an active device array substrate, an opposite substrate, a display medium and a sealant. The active device array substrate includes a substrate, an active device array, a passivation layer and an enhancement layer. A material of the enhancement layer is different from a material of the passivation layer. The opposite substrate is disposed opposite to the active device array substrate. The display medium is disposed between the active device array substrate and the opposite substrate. The sealant is disposed between the active device array substrate and the opposite substrate and surrounds the display medium. An end of the sealant directly contacts the enhancement layer, and a material of the enhancement layer is the same as a material of the sealant.

Abstract: A method for forming a thermoelectric film having a micro groove includes the following steps: A) forming a plurality of parallel sacrificing wires by electrospinning, a diameter of each sacrificing wire being 100-500 nm; B) coating a thermoelectric film having a thickness of 80-200 nm on a part of a surface of each sacrificing wire; and C) removing the sacrificing wires from the thermoelectric films and thus obtaining the thermoelectric films each having the micro groove, a radio side of each thermoelectric film being open to the surroundings. The thermoelectric films finally prepared can have higher size uniformity without the disadvantage of catalyst residual. Further, the thermoelectric films each have a size smaller than the mean free path of phonons in one dimension, and thus the thermoelectric properties of the thermoelectric films can be improved.