Abstract: A method includes steps of: performing preparation-phase measurements on a spindle of a machine tool to generate normal-condition signals; establishing a reference model based on the normal-condition signals; generating abnormal-condition signals based on the reference model and a preset damage value; utilizing principal components analysis (PCA) to characterize the normal-condition and abnormal-condition signals to obtain normal and abnormal probabilistic models, determining normal-condition and abnormal-condition reference curves based on the normal and abnormal probabilistic models; determining an alert-triggering line based on the abnormal-condition reference curve; determining a permissible range between the alert-triggering line and the normal-condition reference curve; and generating a warning signal when it is determined that a detection value falls outside of the permissible range, wherein the detection value is obtained based on application-phase measurements performed on the spindle.

Abstract: An organic film is patterned without applying a hard mask or photolithography. A hydrophilic solvent-soluble resist is placed and arranged on the organic film using a non-lithography process. The hydrophilic solvent-soluble resist is placed and arranged using a printing or lamination process. The organic film is patterned using a wet etchant that is selective to the organic film but non-selective to the hydrophilic solvent-soluble resist. The hydrophilic solvent-soluble resist protects the underlying organic film from contamination and damage, prevents undercutting, and assists in providing a desired taper profile during patterning.

Abstract: This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, the light guide has a light input edge into which light is injected and transverse edges transverse to the light input edge. The transverse edges are smooth and act as specular reflectors. The light input edge is rough and provides a diffusive interface. The light emitters are adjacent and centered along the light input edge, with the pitch of the light emitters being about ?L, where ?L is the distance between the transverse edges divided by the number of light emitters. The light guide can be provided with light turning features that redirect light out of the light guide. In some implementations, the redirected light can be applied to illuminate a display.

Abstract: A MEMS comprising a sacrificial structure, which comprises a faster etching portion and a slower etching portion, exhibits reduced damage to structural features when in forming a cavity in the MEMS by etching away the sacrificial structure. The differential etching rates mechanically decouple structural layers, thereby reducing stresses in the device during the etching process. Methods and systems are also provided.

Abstract: An improved spacer in an apparatus comprising a MEMS device that is packaged between a substrate and cover plate, where the improved spacer protects traces running on the substrate and under the spacer. The improved spacer reduces the amount of force or pressure on the traces or wires, which reduces line out damage when an array of packaged MEMS devices are separated by pressure or force into one packaged MEMS device. In one embodiment, the improved spacer comprises a softer, deformable, elastic, or malleable material that does not crush the traces. This softer material can be an elastic polymeric spacer. In another embodiment, the improved spacer can protect these traces by having a shape with a smaller contact surface which minimizes the amount of traces being affected. This surface can be a sphere or a ball.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: An FPD encapsulation apparatus at least comprises a chamber and a pressing mechanism. In this case, the chamber has an airtight space to provide a low-pressure environment, and the low-pressure environment is located inside the airtight space. The pressing mechanism is disposed within the chamber, and the pressing mechanism is operated in the low-pressure environment for pressing a second substrate to bind a first substrate and the second substrate. Furthermore, a method for encapsulating an FPD is disclosed. The method comprises providing a first substrate, forming an adhesive on the first substrate, providing a second substrate to align the first substrate and face to the adhesive, providing a low-pressure environment for the first and second substrates, and binding the first and second substrates to form the FPD.

Abstract: An organic light-emitting device having a porous desiccant layer therein and a method for fabricating the same is provided. The porous desiccant layer is manufactured by spreading a liquid desiccant on a surface, forming air bubbles (by activating some vesicant or injecting gas into the liquid desiccant) and curing the liquid desiccant. The porous desiccant comprises solidified hardening glue having bubbles and lots of desiccant particles or powder distributed evenly therein. Some residual vesicant may remain inside the solidified hardening glue after activation. The bubbles inside the porous desiccant enhance the absorption rate and efficiency of the desiccant so that moisture and gaseous oxygen inside the OLED package can be absorbed rapidly.