Patents by Inventor Yi Fang Cho

Yi Fang Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8550345
    Abstract: This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: October 8, 2013
    Assignee: Chipmos Technologies Inc.
    Inventors: Cheng-Fang Huang, Pin-Hsun Huang, Chih-Hsiang Wang, Wen-Cheng Hsu, Yi-fang cho, An-Hong Liu, Yi-Chang Lee
  • Patent number: 7609053
    Abstract: This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: October 27, 2009
    Assignee: Chipmos Technologies Inc
    Inventors: Wen Cheng Hsu, Min Ming Lo, Chao Chien Wang, Yi Fang Cho
  • Publication number: 20090237098
    Abstract: This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test.
    Type: Application
    Filed: April 3, 2008
    Publication date: September 24, 2009
    Inventors: Wen Cheng HSU, Min Ming Lo, Chao Chien Wang, Yi Fang Cho
  • Publication number: 20090114714
    Abstract: This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce.
    Type: Application
    Filed: May 15, 2008
    Publication date: May 7, 2009
    Inventors: Cheng-Fang Huang, Pin-Hsun Huang, Chih-Hsiang Wang, Wen-Cheng Hsu, Yi-fang Cho, An-Hong Liu, Yi-Chang Lee