Patents by Inventor Yi-Feng Chiang

Yi-Feng Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11520452
    Abstract: The present invention discloses a noise reduction touch light adjustment device including a light adjustment film, a capacitive touch panel, a noise reduction film, a glass substrate, a control circuit module, and an alternating current (AC) transformer. The noise reduction film is disposed between the light adjustment film and the capacitive touch panel to lower noise inputted from the AC transformer into the light adjustment film such that the capacitive touch panel is ensured to be operated precisely.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: December 6, 2022
    Assignee: Silicon Integrated Systems Corp.
    Inventors: Yi-Feng Chiang, Cheng-Yi Huang
  • Publication number: 20220179521
    Abstract: The present invention discloses a noise reduction touch light adjustment device including a light adjustment film, a capacitive touch panel, a noise reduction film, a glass substrate, a control circuit module, and an alternating current (AC) transformer. The noise reduction film is disposed between the light adjustment film and the capacitive touch panel to lower noise inputted from the AC transformer into the light adjustment film such that the capacitive touch panel is ensured to be operated precisely.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 9, 2022
    Applicant: Silicon Integrated Systems Corp.
    Inventors: Yi-Feng CHIANG, Cheng-Yi HUANG
  • Patent number: 7757118
    Abstract: A method and a system for detecting and recovering a failure command are provided. The method is used in a native command queuing (NCQ) and at least includes the following steps. In step (a), several commands are executed on a disk simultaneously according to the NCQ. In step (b), whether a request time of the commands is longer than a waiting time is measured: if the request time is not longer than the waiting time, then step (a) is executed. In step (c), one command is chosen. In step (d), whether the chosen command is executed successfully is determined: if the chosen command is executed successfully, then step (f) is executed. In step (e), the chosen command is recovered. In step (f), whether all the commands of the NCQ are chosen is determined: if not all the commands are chosen, then another command is chosen and step (d) is repeated.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: July 13, 2010
    Assignee: Quanta Computer Inc.
    Inventors: Yi-Feng Chiang, Ching-Hsiang Chan, Ting-Hao Yang
  • Publication number: 20090070620
    Abstract: A method and a system for detecting and recovering a failure command are provided. The method is used in a native command queuing (NCQ) and at least includes the following steps. In step (a), several commands are executed on a disk simultaneously according to the NCQ. In step (b), whether a request time of the commands is longer than a waiting time is measured: if the request time is not longer than the waiting time, then step (a) is executed. In step (c), one command is chosen. In step (d), whether the chosen command is executed successfully is determined: if the chosen command is executed successfully, then step (f) is executed. In step (e), the chosen command is recovered. In step (f), whether all the commands of the NCQ are chosen is determined: if not all the commands are chosen, then another command is chosen and step (d) is repeated.
    Type: Application
    Filed: November 29, 2007
    Publication date: March 12, 2009
    Applicant: Quanta Computer Inc.
    Inventors: Yi-Feng Chiang, Ching-Hsiang Chan, Ting-Hao Yang