Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A gas detection and cleaning system for a vehicle is disclosed and includes an external modular base, a gas detection module and a cleaning device. The gas detection module is connected to a first external connection port of the external modular base to detect a gas in the vehicle and output the information datum. The information datum is transmitted through the first external connection port to a driving and controlling module of the external modular base, processed and converted into an actuation information datum for being externally outputted through a second external connection port of the external modular base. The cleaning device is connected with the second external connection port through an external port to receive the actuation information datum outputted from the second external connection port to actuate or close the cleaning device.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A tool holding sheath structure, mainly including a first accommodation body, a plurality of first accommodation spaces allowing tools to be passed through, a second accommodation body pivotally coupled to the first accommodation body through two pivoting portions, a plurality of second accommodation spaces interlaced with the first accommodation spaces, a pushing recess adapted to open the second accommodation body, and a plurality of notches adapted to accommodate partial volumes of tools. Whereby, a user can accommodate wrenches in a well-regulated manner and pivot the second accommodation body away easily to have access to tools. Furthermore, the present invention has a convenient portability while being not in use due to a simple structure and smaller volume thereof.

Abstract: The present invention is related to a structure of a tool holding sheath which comprises: a first accommodation body defined by a plurality of first accommodation spaces; and a second accommodation body pivoted with the first accommodation body; wherein the second accommodation body is defined by a plurality of second accommodation spaces set with the first accommodation spaces interlacedly. Through the above-mentioned structure, a user may receive the wrench tools in order and fit into the first accommodation spaces and the second accommodation spaces to have better positioning and holding functions. And, the interlaced design of the present invention can hold the wrench tools having versatile specifications and sizes and can facilitate a user to take and use the wrench tools, such that the present invention has the practical objectives of convenient using and holding for the wrench tools.