Abstract: A method for producing an outer shell includes steps of a) stacking a second plate on a first plate, the second plate having an accommodation space that is recessed toward the first plate; b) disposing a filling material in the accommodation space; c) stacking a third plate on the second plate so as to cover the filling material and to form a composite structure; and d) stamping the composite structure such that a peripheral portion of the composite structure is bent, thereby forming an outer shell. In step b), a weight of the filling material is lower than that of the first plate, that of the second plate, and that of the third plate, or rigidity of the filling material is higher than that of the first plate, that of the second plate, and that of the third plate.

Abstract: A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

Abstract: A method for molding a composite component, which includes step (a) of providing a forming mold and a preformed substrate, in which the forming mold includes a lower mold and an upper mold matched with each other; step (b) of disposing the preformed substrate into an accommodating space, and clamping the upper mold against the lower mold such that a mold cavity is formed between the preformed substrate and the upper mold; step (c) of injecting a polymer material into the mold cavity from a sprue of the upper mold under an injecting pressure, while pushing the preformed substrate by the polymer material which is formed by the injecting pressure, thereby forming a first deformed portion; and step (d) of further clamping the upper mold against the lower mold using a molding pressure, while pushing the polymer material and the first deformed portion, thereby obtaining a semi-finished product.

Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Abstract: A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

Abstract: A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

Abstract: A salt of a neuroceutical and of an acid, wherein the neuroceutical is a substituted benzodiazepine, a substituted benzothiazepine, a substituted pyridopyrimidines or a substituted amino-cyclohexaneacetic acid; and the acid is benzoic acid, nicotinic acid, pantothenic acid and tannic acid. The molar ratio of the neuroceutical and the acid in the salt ranges from about 6:1 to about 1:5. Also disclosed herein are compositions comprising the neuroceutical salt and therapeutic uses thereof for treating a central nervous system (CNS) disorder or a metabolic disorder associated with the CNS disorder.

Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Abstract: An electronic make-up mirror device and a background switching method thereof are provided. The electronic make-up mirror device includes a screen, an image capturing device and a gesture sensor. The method includes following steps. An initial image is captured by using the image capturing device, and an initial frame including the initial image is displayed through the screen. The initial image is analyzed to obtain a foreground object and a background image, where the foreground object includes a face image. A background selection frame is displayed through the screen in response to a first operation according to whether the first operation performed to the initial frame is received. The foreground object and a predetermined background image are integrated in response to reception of a second operation performed to the background selection frame, so as to generate an integrated image, and a switched result frame including the integrated image is displayed.

Abstract: A method includes depositing an acid over a portion of a buffer layer of a solar cell substrate. A front contact material is deposited over the buffer layer, such that the front contact material does not bond to the portion of the buffer layer having the acid on it. Thus, the front contacts of adjacent solar cells of the solar cell substrate are formed with a separation between them.

Abstract: A method for encapsulating solar cells includes a curing step that renders CIGS or other types of solar cell absorber layers resistant to degradation by high-temperature lamination processes. The curing process takes place after IV test and prior to the lamination of an encapsulant film. The curing step is carried out in conjunction with a light soaking step that takes place prior to the IV test. The curing process takes place for a time that may range from 10 minutes to two days and at a high relative humidity, RH. Relative humidities of 20-90% are used and have been effective in passivating selenium vacancy defects associated with the absorber layers. The cured absorber layers are resistant to degradation and produce a solar cell with a high solar cell efficiency.

Abstract: An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Abstract: A 3-D chip stacked structure is disclosed. Each chip layer is provided with plural single-layered conductive members where among the same chip layer the two adjacent conductive members are structurally formed in mirror symmetric way with each other along a chip longitudinal direction and the arrangements of the single-layered conductive members of the two adjacent chip layers are shifted by a test pad distance. The single-layered conductive members of the two adjacent chip layers are communicated through a vertical TSV (through silicon via). Therefore, a selection signal or an enabling signal might be transferred through this specific metal layer and related TSV to reach targeting chip layer and targeting circuit.

Abstract: A multi-band antenna includes a substrate and a conductive layer. The conductive layer covered on a top surface of the substrate includes a ground element, a first radiating element and a second radiating element. The ground element is connected with a bottom side edge of the substrate. The first radiating element is connected with one end of a lower top edge of the ground element. The first radiating element includes a connection portion, a first coupling portion, a first radiating portion and a first inductance portion. The second radiating element is connected with the other end of the lower top edge of the ground element. The second radiating element includes a second inductance portion, a second coupling portion, a second radiating portion and a third radiating portion.

Abstract: An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Abstract: A multi-step scribing operation is provided for forming scribe lines in solar panels to form multiple interconnected cells on a solar panel substrate. The multi-step scribing operation includes at least one step utilizing a nanosecond laser cutting operation. The nanosecond laser cutting operation is followed by a mechanical cutting operation or a subsequent nanosecond laser cutting operation. In some embodiments, the multi-step scribing operation produces a two-tiered scribe line profile and the method prevents local shunting and minimizes active area loss on the solar panel.

Abstract: A method for encapsulating solar cells includes a curing step that renders CIGS or other types of solar cell absorber layers resistant to degradation by high-temperature lamination processes. The curing process takes place after IV test and prior to the lamination of an encapsulant film. The curing step is carried out in conjunction with a light soaking step that takes place prior to the IV test. The curing process takes place for a time that may range from 10 minutes to two days and at a high relative humidity, RH. Relative humidities of 20-90% are used and have been effective in passivating selenium vacancy defects associated with the absorber layers. The cured absorber layers are resistant to degradation and produce a solar cell with a high solar cell efficiency.

Abstract: A 3-D chip stacked structure is disclosed. Each chip layer is provided with plural single-layered conductive members where among the same chip layer the two adjacent conductive members are structurally formed in minor symmetric way with each other along a chip longitudinal direction and the arrangements of the single-layered conductive members of the two adjacent chip layers are shifted by a test pad distance. The single-layered conductive members of the two adjacent chip layers are communicated through a vertical TSV (through silicon via). Therefore, a selection signal or an enabling signal might be transferred through this specific metal layer and related TSV to reach targeting chip layer and targeting circuit.

Abstract: A multi-band antenna includes a base plate of which a feeding portion, a connection section and a ground portion are connected with rear, front and left edges of the base plate respectively, a first radiating element connected with a right edge of the base plate and coplanar with the base plate, a second radiating element coplanar with the base plate and the connection section and connected with an upper portion of a left rim of the connection section with a free end thereof adjacent to the ground portion, and a third radiating element connected with a lower end of the left rim of the connection section. Wherein the second radiating element is apart located between the ground portion and the third radiating element.

Abstract: A multi-band antenna includes a base portion, a substantially lying U-shaped first radiating portion, a substantially lying L-shaped second radiating portion and a third radiating portion. A rear edge of the base portion extends rearward to form a ground portion with a ground point being defined thereon. A top of the base portion defines a feeding point. The first radiating portion of which one end is connected with a first side edge of the base portion and the mouth faces to the first side edge of the base portion. The second radiating portion is connected with a second side edge of the base portion. The third radiating portion tortuously extends downward from a front edge of the base portion, then extends transversely, and further circuitously extends rearward to be located substantially near under a free arm of the second radiating portion.