Abstract: The present disclosure relates to a method for fabricating a semiconductor structure. The method includes providing a substrate with a gate structure, an insulating structure over the gate structure, and a S/D region; depositing a titanium silicide layer over the S/D region with a first chemical vapor deposition (CVD) process. The first CVD process includes a first hydrogen gas flow. The method also includes depositing a titanium nitride layer over the insulating structure with a second CVD process. The second CVD process includes a second hydrogen gas flow. The first and second CVD processes are performed in a single reaction chamber and a flow rate of the first hydrogen gas flow is higher than a flow rate of the second hydrogen gas flow.

Abstract: A gas detection and cleaning system for a vehicle is disclosed and includes an external modular base, a gas detection module and a cleaning device. The gas detection module is connected to a first external connection port of the external modular base to detect a gas in the vehicle and output the information datum. The information datum is transmitted through the first external connection port to a driving and controlling module of the external modular base, processed and converted into an actuation information datum for being externally outputted through a second external connection port of the external modular base. The cleaning device is connected with the second external connection port through an external port to receive the actuation information datum outputted from the second external connection port to actuate or close the cleaning device.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

Abstract: A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

Abstract: A salt of a neuroceutical and of an acid, wherein the neuroceutical is a substituted benzodiazepine, a substituted benzothiazepine, a substituted pyridopyrimidines or a substituted amino-cyclohexaneacetic acid; and the acid is benzoic acid, nicotinic acid, pantothenic acid and tannic acid. The molar ratio of the neuroceutical and the acid in the salt ranges from about 6:1 to about 1:5. Also disclosed herein are compositions comprising the neuroceutical salt and therapeutic uses thereof for treating a central nervous system (CNS) disorder or a metabolic disorder associated with the CNS disorder.

Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Abstract: An electronic make-up mirror device and a background switching method thereof are provided. The electronic make-up mirror device includes a screen, an image capturing device and a gesture sensor. The method includes following steps. An initial image is captured by using the image capturing device, and an initial frame including the initial image is displayed through the screen. The initial image is analyzed to obtain a foreground object and a background image, where the foreground object includes a face image. A background selection frame is displayed through the screen in response to a first operation according to whether the first operation performed to the initial frame is received. The foreground object and a predetermined background image are integrated in response to reception of a second operation performed to the background selection frame, so as to generate an integrated image, and a switched result frame including the integrated image is displayed.

Abstract: A method includes depositing an acid over a portion of a buffer layer of a solar cell substrate. A front contact material is deposited over the buffer layer, such that the front contact material does not bond to the portion of the buffer layer having the acid on it. Thus, the front contacts of adjacent solar cells of the solar cell substrate are formed with a separation between them.

Abstract: A method for encapsulating solar cells includes a curing step that renders CIGS or other types of solar cell absorber layers resistant to degradation by high-temperature lamination processes. The curing process takes place after IV test and prior to the lamination of an encapsulant film. The curing step is carried out in conjunction with a light soaking step that takes place prior to the IV test. The curing process takes place for a time that may range from 10 minutes to two days and at a high relative humidity, RH. Relative humidities of 20-90% are used and have been effective in passivating selenium vacancy defects associated with the absorber layers. The cured absorber layers are resistant to degradation and produce a solar cell with a high solar cell efficiency.

Abstract: An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Abstract: A 3-D chip stacked structure is disclosed. Each chip layer is provided with plural single-layered conductive members where among the same chip layer the two adjacent conductive members are structurally formed in mirror symmetric way with each other along a chip longitudinal direction and the arrangements of the single-layered conductive members of the two adjacent chip layers are shifted by a test pad distance. The single-layered conductive members of the two adjacent chip layers are communicated through a vertical TSV (through silicon via). Therefore, a selection signal or an enabling signal might be transferred through this specific metal layer and related TSV to reach targeting chip layer and targeting circuit.

Abstract: A multi-band antenna includes a substrate and a conductive layer. The conductive layer covered on a top surface of the substrate includes a ground element, a first radiating element and a second radiating element. The ground element is connected with a bottom side edge of the substrate. The first radiating element is connected with one end of a lower top edge of the ground element. The first radiating element includes a connection portion, a first coupling portion, a first radiating portion and a first inductance portion. The second radiating element is connected with the other end of the lower top edge of the ground element. The second radiating element includes a second inductance portion, a second coupling portion, a second radiating portion and a third radiating portion.

Abstract: An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Abstract: A method for encapsulating solar cells includes a curing step that renders CIGS or other types of solar cell absorber layers resistant to degradation by high-temperature lamination processes. The curing process takes place after IV test and prior to the lamination of an encapsulant film. The curing step is carried out in conjunction with a light soaking step that takes place prior to the IV test. The curing process takes place for a time that may range from 10 minutes to two days and at a high relative humidity, RH. Relative humidities of 20-90% are used and have been effective in passivating selenium vacancy defects associated with the absorber layers. The cured absorber layers are resistant to degradation and produce a solar cell with a high solar cell efficiency.

Abstract: A multi-step scribing operation is provided for forming scribe lines in solar panels to form multiple interconnected cells on a solar panel substrate. The multi-step scribing operation includes at least one step utilizing a nanosecond laser cutting operation. The nanosecond laser cutting operation is followed by a mechanical cutting operation or a subsequent nanosecond laser cutting operation. In some embodiments, the multi-step scribing operation produces a two-tiered scribe line profile and the method prevents local shunting and minimizes active area loss on the solar panel.

Abstract: A 3-D chip stacked structure is disclosed. Each chip layer is provided with plural single-layered conductive members where among the same chip layer the two adjacent conductive members are structurally formed in minor symmetric way with each other along a chip longitudinal direction and the arrangements of the single-layered conductive members of the two adjacent chip layers are shifted by a test pad distance. The single-layered conductive members of the two adjacent chip layers are communicated through a vertical TSV (through silicon via). Therefore, a selection signal or an enabling signal might be transferred through this specific metal layer and related TSV to reach targeting chip layer and targeting circuit.

Abstract: A multi-band antenna includes a base plate of which a feeding portion, a connection section and a ground portion are connected with rear, front and left edges of the base plate respectively, a first radiating element connected with a right edge of the base plate and coplanar with the base plate, a second radiating element coplanar with the base plate and the connection section and connected with an upper portion of a left rim of the connection section with a free end thereof adjacent to the ground portion, and a third radiating element connected with a lower end of the left rim of the connection section. Wherein the second radiating element is apart located between the ground portion and the third radiating element.

Abstract: A multi-band antenna includes a base portion, a substantially lying U-shaped first radiating portion, a substantially lying L-shaped second radiating portion and a third radiating portion. A rear edge of the base portion extends rearward to form a ground portion with a ground point being defined thereon. A top of the base portion defines a feeding point. The first radiating portion of which one end is connected with a first side edge of the base portion and the mouth faces to the first side edge of the base portion. The second radiating portion is connected with a second side edge of the base portion. The third radiating portion tortuously extends downward from a front edge of the base portion, then extends transversely, and further circuitously extends rearward to be located substantially near under a free arm of the second radiating portion.