Patents by Inventor Yi-Feng Pu
Yi-Feng Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11805617Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.Type: GrantFiled: April 21, 2022Date of Patent: October 31, 2023Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Cheng-Hsuen Chien, Yi-Feng Pu, Chen-Yuan Liu, Pei-Hsuan Huang
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Publication number: 20220346263Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.Type: ApplicationFiled: April 21, 2022Publication date: October 27, 2022Inventors: Cheng-Hsuen CHIEN, Yi-Feng PU, Chen-Yuan LIU, Pei-Hsuan HUANG
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Publication number: 20210204438Abstract: A server includes a first server unit, a second server unit, a hinge and a connecting element. The second server unit is disposed on the first server unit and is electrically connected to the first server unit. The second server unit is pivoted to the first server unit through the hinge. The connecting element is disposed between the first server unit and the second server unit. The connecting element has a first connection end and a second connection end, wherein the first connection end is connected to the first server unit, and the second connection end is connected to the second server unit. A server system including a rack and at least one server is also provided.Type: ApplicationFiled: October 27, 2020Publication date: July 1, 2021Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Wei-Ming Shieh, Yi-Feng Pu, Chien-Wen Yeh, Hung-Hsing Chiu, Pei-Hsuan Huang
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Patent number: 10718497Abstract: An electronic product with a light emitting function is provided. The electronic product includes a supporting structure, a light emitting structure and a cavity. The light emitting structure is bonded on the supporting structure. The light emitting structure includes a film, a conductive circuit and a light emitting device. The conductive circuit is formed on the film. The conductive circuit is enclosed between the supporting structure and the film. The light emitting device is disposed on the conductive circuit. The cavity is formed between the supporting structure and the light emitting structure, and the light emitting device is received in the cavity.Type: GrantFiled: September 6, 2017Date of Patent: July 21, 2020Assignees: LITE-ON ELECTRONICS (GUANZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Yi-Feng Pu, Tzu-Shu Lin
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Patent number: 10716219Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.Type: GrantFiled: January 12, 2018Date of Patent: July 14, 2020Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Yi-Feng Pu, Tzu-Shu Lin, Pei-Hsuan Huang
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Patent number: 10349522Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.Type: GrantFiled: October 2, 2018Date of Patent: July 9, 2019Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
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Publication number: 20190184085Abstract: An end cap of a dialyzer and a fabricating method thereof, and a dialyzer are provided. The end cap includes a main body and a sealing element. The main body has a blood port. The sealing element is integrally connected on an inner wall of the main body.Type: ApplicationFiled: December 18, 2018Publication date: June 20, 2019Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
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Publication number: 20190184084Abstract: A dialyzer and a fabricating method thereof are provided. The dialyzer includes a housing, a hydrophilic layer, a fixing layer, a plurality of hollow fiber membranes, and two end caps. The housing has a first opening and a second opening, and is provided with a dialysate inlet and a dialysate outlet, wherein an entire peripheral surface of the housing located between the first opening and the dialysate inlet is a first portion, and an entire peripheral surface of the housing located between the second opening and the dialysate outlet is a second portion. The hydrophilic layer is disposed on the inner wall of the first portion and the second portion, wherein the hydrophilic layer and the housing are different materials. The fixing layer is disposed on the hydrophilic layer and fixes the hollow fiber membranes to the inner wall of the housing.Type: ApplicationFiled: December 14, 2018Publication date: June 20, 2019Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
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Patent number: 10290514Abstract: An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.Type: GrantFiled: September 6, 2017Date of Patent: May 14, 2019Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
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Publication number: 20190037698Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.Type: ApplicationFiled: October 2, 2018Publication date: January 31, 2019Inventors: Wei-Ming SHIEH, Yi-Feng PU, Pei-Hsuan HUANG
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Publication number: 20190037699Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.Type: ApplicationFiled: October 2, 2018Publication date: January 31, 2019Inventors: Wei-Ming SHIEH, Yi-Feng PU, Pei-Hsuan HUANG
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Patent number: 10194532Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.Type: GrantFiled: October 2, 2018Date of Patent: January 29, 2019Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
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Patent number: 10123423Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.Type: GrantFiled: January 12, 2018Date of Patent: November 6, 2018Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
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Publication number: 20180280628Abstract: A syringe and needle assembly includes an elongated hollow barrel, a needle unit, and a plunger assembly. The hollow barrel has a connecting portion. The needle unit is disposed at the connecting portion and has an engaging structure, and the engaging structure is located in the hollow barrel. A plunger rod of the plunger assembly is movably disposed in the hollow barrel and has a pushing portion and an operating portion formed in front and rear ends of the plunger rod respectively, and the pushing portion faces the connecting portion and has a plurality of elastic hooks. The plunger assembly is adapted to move towards the connecting portion to push a liquid in the hollow barrel to be injected through a needle of the needle unit, and the plunger assembly is adapted to keep moving towards the connecting portion, such that the elastic hooks are engaged with the engaging structure.Type: ApplicationFiled: March 28, 2018Publication date: October 4, 2018Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology CorporationInventors: Po-Yu Cheng, Yi-Feng Pu
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Patent number: 10076040Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.Type: GrantFiled: March 16, 2017Date of Patent: September 11, 2018Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
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Publication number: 20180213651Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.Type: ApplicationFiled: January 12, 2018Publication date: July 26, 2018Inventors: Yi-Feng PU, Tzu-Shu LIN, Pei-Hsuan HUANG
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Publication number: 20180209615Abstract: An electronic product with a light emitting function is provided. The electronic product includes a supporting structure, a light emitting structure and a cavity. The light emitting structure is bonded on the supporting structure. The light emitting structure includes a film, a conductive circuit and a light emitting device. The conductive circuit is formed on the film. The conductive circuit is enclosed between the supporting structure and the film. The light emitting device is disposed on the conductive circuit. The cavity is formed between the supporting structure and the light emitting structure, and the light emitting device is received in the cavity.Type: ApplicationFiled: September 6, 2017Publication date: July 26, 2018Inventors: Yi-Feng Pu, Tzu-Shu Lin
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Publication number: 20180211848Abstract: An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.Type: ApplicationFiled: September 6, 2017Publication date: July 26, 2018Inventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
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Publication number: 20180184528Abstract: A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.Type: ApplicationFiled: March 16, 2017Publication date: June 28, 2018Inventors: Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin