Patents by Inventor Yi-Geng Li

Yi-Geng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11067606
    Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: July 20, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Yi-Geng Li, Ming-Chia Wu, Siao-Wei Syu, Chun-Chuan Chen
  • Publication number: 20200064380
    Abstract: A current sensing module for measuring a current includes a conductive substrate, a frame, a circuit board and a magnetic sensor. The conductive substrate has two terminals and at least one slot. The frame has two side portions and a bottom portion, wherein the bottom portion connects the two side portions to form an opening ring-shape. At least one of the two side portions is disposed in the at least one slot, such that the two side portions surround a partial path of the current. A gap exists between two top ends of the two side portions. The circuit board is disposed with respect to the conductive substrate. The magnetic sensor is connected to the circuit board and located in a space between the two side portions rather than in the gap. The magnetic sensor senses the current and generates a first current sensing signal correspondingly.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 27, 2020
    Inventors: Yi-Geng Li, Ming-Chia Wu, Siao-Wei Syu, Chun-Chuan Chen
  • Patent number: 9420705
    Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: August 16, 2016
    Assignee: CYNTEC CO., LTD.
    Inventors: Yi-Geng Li, Chung-Hsiung Wang, Hung-Ming Lin
  • Publication number: 20140327031
    Abstract: A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.
    Type: Application
    Filed: August 13, 2013
    Publication date: November 6, 2014
    Applicant: CYNTEC CO., LTD.
    Inventors: Yi-Geng Li, Chung-Hsiung Wang, Hung-Ming Lin