Abstract: An electronic device includes a substrate, a driving element, a first insulating layer, a pixel electrode layer, and a common electrode layer. The driving element is disposed on the substrate. The first insulating layer is disposed on the driving element. The pixel electrode layer is disposed on the first insulating layer. The first insulating layer comprises a hole, and the pixel electrode layer is electrically connected to the driving element through the hole. The common electrode layer is disposed on the pixel electrode layer. The common electrode layer comprises a slit, and the slit has an edge, and the edge is disposed in the hole.

Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: An access control system includes a mobile device, a control device and an electronic lock module. The mobile device includes an input module, an identification module, a display module, a storage module, a battery module, a wireless transmission module and a central processor. The control device connects with the mobile device wirelessly and includes a wireless transceiver module, a power module, a memory module, an electronic control module and a microcontroller. The electronic control module of the control device is electrically connected with the electronic lock device. The identification module captures the biological characteristic of the user so as to make the identification module identify the biological characteristic of the user, so as to lower an identification burden of the access control system and ensure a usage security of the access control system.

Abstract: A failure alarm system adapted for monitoring an instrument includes a BUS transmitting data and control logics inside the failure alarm system, a recording device connected to the BUS for recording operating sounds of the instrument, a voice processing unit connected to the BUS for converting the operating sounds into a voice eigenvector, a storage unit connected to the BUS for storing the voice eigenvector at the normal working state of the instrument as historical data and also storing the voice eigenvector at the abnormal working state of the instrument therein, a comparing unit connected to the BUS for comparing the new voice eigenvector with the previous voice eigenvector saved as the historical data to judge whether the instrument is at the abnormal working state, and a warning unit connected to the BUS for warning the monitoring personnel when the abnormal state is detected.

Abstract: A failure alarm system adapted for monitoring an instrument includes a BUS transmitting data and control logics inside the failure alarm system, a recording device connected to the BUS for recording operating sounds of the instrument, a voice processing unit connected to the BUS for converting the operating sounds into voice eigenvector, a storage unit connected to the BUS for storing the voice eigenvector at the normal working state of the instrument as historical data and also storing the voice eigenvector at the abnormal working state of the instrument therein, a comparing unit connected to the BUS for comparing new voice eigenvector with the pervious voice eigenvector saved as the historical data to judge whether the instrument is at abnormal working state, and a warning unit connected to the BUS for warning the monitoring personnel when abnormal state is detected.

Abstract: An access control system includes a mobile device, a control device and an electronic lock module. The mobile device includes an input module, an identification module, a display module, a storage module, a battery module, a wireless transmission module and a central processor. The control device connects with the mobile device wirelessly and includes a wireless transceiver module, a power module, a memory module, an electronic control module and a microcontroller. The electronic control module of the control device is electrically connected with the electronic lock device. The identification module captures the biological characteristic of the user so as to make the identification module identify the biological characteristic of the user, so as to lower an identification burden of the access control system and ensure a usage security of the access control system.