Abstract: The present invention provides a package structure. The package structure includes a substrate, an electronic component layer disposed on the substrate, and an organic polymer layer disposed on the electronic component layer, wherein the organic polymer layer has a fluorine content greater than 55 percent by weight and less than or equal to 85 percent by weight. The present invention further provides another package structure. The package structure includes a substrate, an electronic component layer disposed on the substrate, an organic polymer layer disposed on the electronic component layer, an optical function layer disposed on the organic polymer layer, and an adhesive layer disposed between the organic polymer layer and the optical function layer and configured to adhere the optical function layer to the organic polymer layer.

Abstract: An electrical connector includes a connector body having an electrically insulative base block with a front vertical stop wall and a locating notch on the middle of front vertical stop wall, an electrically insulative front extension portion forwardly extended from the electrically insulative base block and conducting terminals mounted in the electrically insulative base block and the electrically insulative front extension portion, and a metal shielding shell surrounding the connector body and having a positioning block downwardly protruded from the top wall thereof and engaged into the locating notch of the electrically insulative base block of the connector body to assure connection stability between the connector body and the metal shielding shell and positive contact between the conducting terminals and an inserted external electrical connector.