Abstract: A method of fabricating a device includes forming a dummy gate over a plurality of fins. Thereafter, a first portion of the dummy gate is removed to form a first trench that exposes a first hybrid fin and a first part of a second hybrid fin. The method further includes filling the first trench with a dielectric material disposed over the first hybrid fin and over the first part of the second hybrid fin. Thereafter, a second portion of the dummy gate is removed to form a second trench and the second trench is filled with a metal layer. The method further includes etching-back the metal layer, where a first plane defined by a first top surface of the metal layer is disposed beneath a second plane defined by a second top surface of a second part of the second hybrid fin after the etching-back the metal layer.

Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.

Abstract: The present invention provides a package structure. The package structure includes a substrate, an electronic component layer disposed on the substrate, and an organic polymer layer disposed on the electronic component layer, wherein the organic polymer layer has a fluorine content greater than 55 percent by weight and less than or equal to 85 percent by weight. The present invention further provides another package structure. The package structure includes a substrate, an electronic component layer disposed on the substrate, an organic polymer layer disposed on the electronic component layer, an optical function layer disposed on the organic polymer layer, and an adhesive layer disposed between the organic polymer layer and the optical function layer and configured to adhere the optical function layer to the organic polymer layer.

Abstract: An electrical connector includes a connector body having an electrically insulative base block with a front vertical stop wall and a locating notch on the middle of front vertical stop wall, an electrically insulative front extension portion forwardly extended from the electrically insulative base block and conducting terminals mounted in the electrically insulative base block and the electrically insulative front extension portion, and a metal shielding shell surrounding the connector body and having a positioning block downwardly protruded from the top wall thereof and engaged into the locating notch of the electrically insulative base block of the connector body to assure connection stability between the connector body and the metal shielding shell and positive contact between the conducting terminals and an inserted external electrical connector.