Patents by Inventor Yi-Heng Li

Yi-Heng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130257
    Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.
    Type: Application
    Filed: April 21, 2023
    Publication date: April 18, 2024
    Inventors: Fu-Hai LI, Yi Ching ONG, Hsin Heng WANG, Tsung-Hao YEH, Yu-Wei TING, Kuo-Pin CHANG, Hung-Ju LI, Kuo-Ching HUANG
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Patent number: 11942556
    Abstract: A device includes a first channel layer, a second channel layer, a gate structure, a source/drain epitaxial structure, and a source/drain contact. The first channel layer and the second channel layer are arranged above the first channel layer in a spaced apart manner over a substrate. The gate structure surrounds the first and second channel layers. The source/drain epitaxial structure is connected to the first and second channel layers. The source/drain contact is connected to the source/drain epitaxial structure. The second channel layer is closer to the source/drain contact than the first channel layer is to the source/drain contact, and the first channel layer is thicker than the second channel layer.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Ru Lin, Shu-Han Chen, Yi-Shao Li, Chun-Heng Chen, Chi On Chui
  • Patent number: 11923436
    Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The method can include forming a fin structure over a substrate. The fin structure can include a channel layer and a buffer layer between the channel layer and the substrate. The method can further include forming a recess structure in the channel layer. The recess structure can include a bottom surface over the buffer layer. The method can further include forming a first epitaxial layer over the bottom surface of the recess structure. The first epitaxial layer can include a first atomic concentration of germanium. The method can further include forming a second epitaxial layer over the first epitaxial layer. The second epitaxial layer can include a second atomic concentration of germanium greater than the first atomic concentration of germanium.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Heng Li, Yi-Jing Li, Chia-Der Chang
  • Patent number: 10036823
    Abstract: A method for monitoring and early warning of structural collapse, having following steps of: installing at least one electric field sensor in a monitoring area, wherein the at least one electric field sensor is used for measuring an electric field signal of the monitoring area; receiving the electric field signal and applying a signal analysis to the electric field signal; and issuing a warning signal when a critical transition feature occurs in the electric field signal to which the signal analysis is applied.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: July 31, 2018
    Assignee: National Central University
    Inventors: Chien-Chih Chen, Yi-Heng Li
  • Publication number: 20170146678
    Abstract: A method for monitoring and early warning of structural collapse, comprising following steps of: installing at least one electric field sensor in a monitoring area, wherein the at least one electric field sensor is used for measuring an electric field signal of the monitoring area; receiving the electric field signal and applying a signal analysis to the electric field signal; and issuing a warning signal when a critical transition feature occurs in the electric field signal to which the signal analysis is applied.
    Type: Application
    Filed: June 6, 2016
    Publication date: May 25, 2017
    Inventors: Chien-Chih Chen, Yi-Heng Li