Patents by Inventor Yi Heng Lin

Yi Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12209734
    Abstract: A light emitting panel includes a circuit substrate, a plurality of first light emitting components, a plurality of second light emitting components, and a plurality of third light emitting components. The circuit substrate has a plurality of main pixel areas. Each main pixel area is divided into a first subpixel area, a second subpixel area, and a third subpixel area. The first light emitting components, the second light emitting components and the third light emitting components are located in the first subpixel areas, the second subpixel areas and the third subpixel areas respectively. The first light emitting components in two adjacent first subpixel areas are electrically connected in series. The size of each of the first light emitting components is larger than the size of each of the second light emitting components and the third light emitting components.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: January 28, 2025
    Assignee: AUO CORPORATION
    Inventors: Yu-Hsin Huang, Kuan-Heng Lin, Yi-Hong Chen, Chia-An Lee, Seok-Lyul Lee
  • Patent number: 7697259
    Abstract: A novel vehicle which is suitable for transporting and/or temporarily storing objects such as masks or reticles and is effective in eliminating or preventing electrostatic discharges on the masks, reticles or other objects. The vehicle includes a frame for receiving the objects and at least one ESD eliminator provided on the frame for neutralizing electrostatic charges on the objects. Neutralization of the electrostatic charges prevents electrostatic discharges from damaging microelectronic circuits, for example, on the masks, reticles or other objects.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: April 13, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chian-Chen Chiou, Chi-Chien Chang, Shun Chih Hsieh, Yi Heng Lin, Hsiao-Lung Sun, Nien-Hua Chang