Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional group, (II) a surfactant comprising a polyoxyalkylene functional group and a sulfate functional group, (III) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfonate functional group, and (IV) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfate functional group, and (c) an aqueous carrier. The invention also provides a method of chemically-mechanically polishing a substrate comprising TiN and SiN with the inventive chemical-mechanical polishing composition.

Abstract: A blood isolation and extraction method includes: providing a predetermined amount of blood; utilizing a platelet filter unit to filter the predetermined amount of blood to generate a filtered blood; utilizing a plasma separation unit to divide the filtered blood into a plasma layer and a blood cell layer for separating blood cells from blood plasma; and extracting the blood plasma from the plasma layer and the blood cells from the blood cell layer. In another embodiment, the blood isolation and extraction method further includes: providing a platelet-washing unit to wash the platelet filter unit with a solution to produce a platelet solution; and mixing the platelet solution with the blood plasma to produce a platelet and plasma mixed solution.

Abstract: A microstructure sucker device includes a substrate, a microstructure and an operation surface. The microstructure is arranged on the first surface of the substrate to form a microstructure sucker layer. The operation surface is provided on the second surface of the substrate and corresponds to the surface sucker layer. An operation method of the microstructure sucker device includes: aligning the sucker layer with a predetermined surface; attaching the microstructure sucker layer to the predetermined surface; pressing the microstructure sucker layer to discharge an amount of air from the microstructure sucker layer to suck the predetermined surface; pulling an edge of the microstructure sucker layer to separate the microstructure sucker layer from the predetermined surface.