Patents by Inventor Yi-Hong Chiu

Yi-Hong Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11222784
    Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a silicon layer on the substrate, a titanium nitride (TiN) layer on the silicon layer, a titanium (Ti) layer between the TiN layer and the silicon layer, a metal silicide between the Ti layer and the silicon layer, a titanium silicon nitride (TiSiN) layer on the TiN layer, and a conductive layer on the TiSiN layer.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 11, 2022
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Tzu-Hao Liu, Yi-Wei Chen, Tsun-Min Cheng, Kai-Jiun Chang, Chia-Chen Wu, Yi-An Huang, Po-Chih Wu, Pin-Hong Chen, Chun-Chieh Chiu, Tzu-Chieh Chen, Chih-Chien Liu, Chih-Chieh Tsai, Ji-Min Lin
  • Publication number: 20190085205
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional group, (II) a surfactant comprising a polyoxyalkylene functional group and a sulfate functional group, (III) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfonate functional group, and (IV) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfate functional group, and (c) an aqueous carrier. The invention also provides a method of chemically-mechanically polishing a substrate comprising TiN and SiN with the inventive chemical-mechanical polishing composition.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 21, 2019
    Inventors: Chih-Hsien CHIEN, Yi-Hong CHIU, Hung-Tsung HUANG, Ming-Chih YEH
  • Publication number: 20170368251
    Abstract: A blood isolation and extraction method includes: providing a predetermined amount of blood; utilizing a platelet filter unit to filter the predetermined amount of blood to generate a filtered blood; utilizing a plasma separation unit to divide the filtered blood into a plasma layer and a blood cell layer for separating blood cells from blood plasma; and extracting the blood plasma from the plasma layer and the blood cells from the blood cell layer. In another embodiment, the blood isolation and extraction method further includes: providing a platelet-washing unit to wash the platelet filter unit with a solution to produce a platelet solution; and mixing the platelet solution with the blood plasma to produce a platelet and plasma mixed solution.
    Type: Application
    Filed: June 26, 2016
    Publication date: December 28, 2017
    Inventors: Yi-Chang Chung, Yi-Hong Chiu, Chia-Chune Wu, Che-Wen Chang, Kai-Ming Wu
  • Publication number: 20150240863
    Abstract: A microstructure sucker device includes a substrate, a microstructure and an operation surface. The microstructure is arranged on the first surface of the substrate to form a microstructure sucker layer. The operation surface is provided on the second surface of the substrate and corresponds to the surface sucker layer. An operation method of the microstructure sucker device includes: aligning the sucker layer with a predetermined surface; attaching the microstructure sucker layer to the predetermined surface; pressing the microstructure sucker layer to discharge an amount of air from the microstructure sucker layer to suck the predetermined surface; pulling an edge of the microstructure sucker layer to separate the microstructure sucker layer from the predetermined surface.
    Type: Application
    Filed: December 31, 2014
    Publication date: August 27, 2015
    Inventors: Yi-Chang Chung, Wang-Yi Chang, Yi-Hong Chiu