Patents by Inventor Yi-Hsiang Kung

Yi-Hsiang Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250097329
    Abstract: A method of configuring a signal transducer of a foldable UE includes: providing a first panel comprising a first conductor configured to provide a first portion of the signal transducer; providing a second panel comprising a second conductor configured to provide a second portion of the signal transducer; providing a hinge connected to the first panel and the second panel and configured to allow the first panel to rotate relative to the second panel about a pivot axis of the hinge, the hinge comprising a third conductor configured to provide a third portion of the signal transducer, the third conductor electrically coupling the first conductor to the second conductor; providing a fourth conductor that is physically separate from the first conductor, the second conductor, and the third conductor; and selectively causing the fourth conductor to provide a fourth portion of the signal transducer.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 20, 2025
    Inventors: Yi-Hsiang KUNG, Cheng-Fan WEI, Chao-Kuei CHANG
  • Publication number: 20240429592
    Abstract: Aspects described herein include millimeter wave integrated hinges. In one aspect, wireless communication apparatus includes a bracket, a first pivot structure attached to the bracket configured to pivot the bracket around a first line, and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line. A millimeter wave antenna array is mounted to the bracket such that the mmW antenna array is positioned between the first line and the second line.
    Type: Application
    Filed: June 23, 2023
    Publication date: December 26, 2024
    Inventors: Cheng-Fan WEI, Chao-Kuei CHANG, Yi-Hsiang KUNG
  • Patent number: 11955688
    Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: April 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Cheng-Fan Wei, Chao-Kuei Chang, Yi-Hsiang Kung
  • Patent number: 11929547
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: March 12, 2024
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Publication number: 20230246328
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
  • Patent number: 11664583
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: May 30, 2023
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Publication number: 20230096131
    Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Cheng-Fan WEI, Chao-Kuei CHANG, Yi-Hsiang KUNG
  • Patent number: 11362687
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: June 14, 2022
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Patent number: 11145958
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 12, 2021
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Publication number: 20210013590
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
  • Patent number: 10879588
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, a second feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second feeding element is directly or indirectly electrically connected to the second portion. A second antenna structure is formed by the second feeding element and the second portion. The RF module is electrically coupled to the first feeding element and the second feeding element, so as to excite the first antenna structure and second antenna structure.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: December 29, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Publication number: 20200303810
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Shen-Fu TZENG, Yi-Hsiang KUNG, Li-Yuan FANG
  • Publication number: 20200287572
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
  • Patent number: 10727569
    Abstract: A mobile device includes a first circuit board, a metal frame, an extension radiation element, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame includes a first portion coupled to the system ground plane. A clearance region is formed between the first portion and the system ground plane. The first portion and the extension radiation element are both coupled to a feeding point. An antenna structure is formed by the first portion and the extension radiation element. The second circuit board is coupled to the electronic component. The electronic component and the second circuit board are both adjacent to the first portion. The RF module is coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Patent number: 10714811
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
  • Patent number: 10700716
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 30, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Publication number: 20190148817
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Application
    Filed: January 14, 2019
    Publication date: May 16, 2019
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Yi-Hsiang KUNG
  • Publication number: 20190140671
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 9, 2019
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
  • Patent number: 10218053
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: February 26, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
  • Patent number: 10211858
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: February 19, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang