Patents by Inventor Yi-Hsiang Kung
Yi-Hsiang Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250097329Abstract: A method of configuring a signal transducer of a foldable UE includes: providing a first panel comprising a first conductor configured to provide a first portion of the signal transducer; providing a second panel comprising a second conductor configured to provide a second portion of the signal transducer; providing a hinge connected to the first panel and the second panel and configured to allow the first panel to rotate relative to the second panel about a pivot axis of the hinge, the hinge comprising a third conductor configured to provide a third portion of the signal transducer, the third conductor electrically coupling the first conductor to the second conductor; providing a fourth conductor that is physically separate from the first conductor, the second conductor, and the third conductor; and selectively causing the fourth conductor to provide a fourth portion of the signal transducer.Type: ApplicationFiled: September 20, 2023Publication date: March 20, 2025Inventors: Yi-Hsiang KUNG, Cheng-Fan WEI, Chao-Kuei CHANG
-
Publication number: 20240429592Abstract: Aspects described herein include millimeter wave integrated hinges. In one aspect, wireless communication apparatus includes a bracket, a first pivot structure attached to the bracket configured to pivot the bracket around a first line, and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line. A millimeter wave antenna array is mounted to the bracket such that the mmW antenna array is positioned between the first line and the second line.Type: ApplicationFiled: June 23, 2023Publication date: December 26, 2024Inventors: Cheng-Fan WEI, Chao-Kuei CHANG, Yi-Hsiang KUNG
-
Patent number: 11955688Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.Type: GrantFiled: September 24, 2021Date of Patent: April 9, 2024Assignee: QUALCOMM IncorporatedInventors: Cheng-Fan Wei, Chao-Kuei Chang, Yi-Hsiang Kung
-
Patent number: 11929547Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.Type: GrantFiled: April 7, 2023Date of Patent: March 12, 2024Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
-
Publication number: 20230246328Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.Type: ApplicationFiled: April 7, 2023Publication date: August 3, 2023Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
-
Patent number: 11664583Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.Type: GrantFiled: September 30, 2020Date of Patent: May 30, 2023Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
-
Publication number: 20230096131Abstract: Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.Type: ApplicationFiled: September 24, 2021Publication date: March 30, 2023Inventors: Cheng-Fan WEI, Chao-Kuei CHANG, Yi-Hsiang KUNG
-
Patent number: 11362687Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.Type: GrantFiled: May 21, 2020Date of Patent: June 14, 2022Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
-
Patent number: 11145958Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.Type: GrantFiled: June 8, 2020Date of Patent: October 12, 2021Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
-
Publication number: 20210013590Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.Type: ApplicationFiled: September 30, 2020Publication date: January 14, 2021Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
-
Patent number: 10879588Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, a second feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second feeding element is directly or indirectly electrically connected to the second portion. A second antenna structure is formed by the second feeding element and the second portion. The RF module is electrically coupled to the first feeding element and the second feeding element, so as to excite the first antenna structure and second antenna structure.Type: GrantFiled: October 2, 2017Date of Patent: December 29, 2020Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
-
Publication number: 20200303810Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Shen-Fu TZENG, Yi-Hsiang KUNG, Li-Yuan FANG
-
Publication number: 20200287572Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.Type: ApplicationFiled: May 21, 2020Publication date: September 10, 2020Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
-
Patent number: 10727569Abstract: A mobile device includes a first circuit board, a metal frame, an extension radiation element, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame includes a first portion coupled to the system ground plane. A clearance region is formed between the first portion and the system ground plane. The first portion and the extension radiation element are both coupled to a feeding point. An antenna structure is formed by the first portion and the extension radiation element. The second circuit board is coupled to the electronic component. The electronic component and the second circuit board are both adjacent to the first portion. The RF module is coupled to the feeding point, so as to excite the antenna structure.Type: GrantFiled: October 3, 2017Date of Patent: July 28, 2020Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
-
Patent number: 10714811Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.Type: GrantFiled: January 14, 2019Date of Patent: July 14, 2020Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
-
Patent number: 10700716Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.Type: GrantFiled: January 4, 2019Date of Patent: June 30, 2020Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
-
Publication number: 20190148817Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.Type: ApplicationFiled: January 14, 2019Publication date: May 16, 2019Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Yi-Hsiang KUNG
-
Publication number: 20190140671Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.Type: ApplicationFiled: January 4, 2019Publication date: May 9, 2019Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
-
Patent number: 10218053Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.Type: GrantFiled: September 15, 2015Date of Patent: February 26, 2019Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
-
Patent number: 10211858Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.Type: GrantFiled: September 24, 2018Date of Patent: February 19, 2019Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang