Patents by Inventor Yi-Hsiang Pan

Yi-Hsiang Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation module for a BGA IC
    Patent number: 6486564
    Abstract: An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: November 26, 2002
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
  • Heat dissipation module for a BGA IC
    Publication number: 20020020926
    Abstract: An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
    Type: Application
    Filed: August 15, 2001
    Publication date: February 21, 2002
    Inventors: Wen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
  • Lead frame structure
    Patent number: 6204553
    Abstract: A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: March 20, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Hui-Ping Liu, Jung-Jie Liou, Yi-Hsiang Pan, Sheng-Tung Tsai