Patents by Inventor Yi-Hsiang Pan

Yi-Hsiang Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081857
    Abstract: A spin orbit torque magnetoresistive random access memory (SOT MRAM) includes at least a spin current source alloy layer, a ferromagnetic free layer, and an insulation layer. The spin current source alloy layer is a nickel-tungsten alloy layer. The ferromagnetic free layer is located on the spin current source alloy layer. The insulation layer is located on the ferromagnetic free layer. Since the nickel-tungsten alloy layer has favorable perpendicular magnetic anisotropic and can maintain a high spin Hall angle, it is suitable as a spin current source for the SOT MRAM.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 6, 2025
    Applicant: National Tsing Hua University
    Inventors: Chih-Huang Lai, Tsung-Yu Pan, Chih-Hsiang Tseng, Yi-Cheng Tsou, Yu-Shen Yen, Rong-Zhi Chen
  • Patent number: 6486564
    Abstract: An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: November 26, 2002
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
  • Publication number: 20020020926
    Abstract: An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
    Type: Application
    Filed: August 15, 2001
    Publication date: February 21, 2002
    Inventors: Wen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
  • Patent number: 6204553
    Abstract: A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: March 20, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Hui-Ping Liu, Jung-Jie Liou, Yi-Hsiang Pan, Sheng-Tung Tsai