Abstract: The present disclosure, in some embodiments, relates to method. The method includes bonding a second wafer to a first wafer to form a multi-dimensional integrated chip structure. A first edge trimming cut is performed at a first lateral distance from a central region of the multi-dimensional integrated chip structure. A second edge trimming cut is performed at a second lateral distance from the central region of the multi-dimensional integrated chip structure. The second lateral distance is larger than the first lateral distance.

Abstract: The present disclosure relates to a semiconductor wafer structure including a semiconductor substrate and a plurality of semiconductor devices disposed along the semiconductor substrate. A dielectric stack including a plurality of dielectric layers is arranged over the semiconductor substrate. A conductive interconnect structure is within the dielectric stack. A seal ring layer is over the dielectric stack and laterally surrounds the dielectric stack along a first sidewall of the dielectric stack. The seal ring layer includes a first protrusion that extends into a first trench in the semiconductor substrate.

Abstract: A variable aperture module includes a blade assembly, a positioning element, a driving part and pressing structures. The blade assembly includes movable blades disposed around an optical axis to form a light passable hole with an adjustable size. Each movable blade has a positioning hole and a movement hole adjacent thereto. The positioning element includes positioning structures disposed respectively corresponding to the positioning holes. The driving part includes a rotation element disposed corresponding to the movement holes and is rotatable with respect to the positioning element. The pressing structures are disposed respectively corresponding to the movable blades. Each pressing structure is at least disposed into at least one of the positioning hole and the movement hole of the corresponding movable blade. Each pressing structure at least presses against at least one of the corresponding one positioning structure and the rotation element.

Abstract: The present disclosure provides a tissue imaging method, including: inserting an electronic probe into a lesion area of a patient and ablating tissue of the lesion area; capturing a first image including the lesion area by using an imaging apparatus; vibrating the electronic probe to generate displacement of at least a portion of the tissue of the lesion area, and capturing a second image including the lesion area by using the imaging apparatus; generating a correlation image according to a correlation between the first image and the second image; and computing an ablation boundary according to the correlation image.

Abstract: An array substrate has a geometric center and a virtual median line passing through the geometric center, and includes a substrate, a first metal layer, a second metal layer, active elements and a shielding pattern layer. The first metal layer is disposed on the substrate and includes first signal lines. The second metal layer is disposed on the first metal layer and includes second signal lines. The active elements are disposed on the substrate. Each active element is electrically connected to one of the first signal lines and one of the second signal lines and includes a channel layer. The shielding pattern layer is disposed between the first metal layer and the second metal layer, overlaps the virtual median line on the normal line of the substrate, and is formed by patterning the same layer as the channel layers.

Abstract: An image capturing module includes an imaging lens system, an image sensor, a first circuit board, at least three passive components, and a second circuit board. The image sensor is at an image side of the imaging lens system and having a photosensitive area corresponding to the imaging lens system. The image sensor and the passive components are disposed on the first circuit board. Each passive component has a first lead and a second lead. The second circuit board corresponds to the first circuit board and includes a connector and multiple circuits electrically connected to the connector. The first leads and the image sensor are electrically connected and disposed on the first circuit board. The second leads form a contact on the first circuit board. The number of the contact is less than the number of the passive components. The contact is electrically connected to at least one circuit.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first substrate having a first horizontally extending surface and a second horizontally extending surface above the first horizontally extending surface as viewed in a cross-sectional view. The first horizontally extending surface continuously wraps around an outermost perimeter of the second horizontally extending surface in a closed loop as viewed in a plan-view. A second substrate is disposed over the first substrate and includes a third horizontally extending surface above the second horizontally extending surface as viewed in the cross-sectional view. The second horizontally extending surface continuously wraps around an outermost perimeter of the third horizontally extending surface in a closed loop as viewed in the plan-view.

Abstract: The present disclosure relates to a semiconductor wafer structure including a semiconductor substrate and a plurality of semiconductor devices disposed along the semiconductor substrate. A dielectric stack including a plurality of dielectric layers is arranged over the semiconductor substrate. A conductive interconnect structure is within the dielectric stack. A seal ring layer is over the dielectric stack and laterally surrounds the dielectric stack along a first sidewall of the dielectric stack. The seal ring layer includes a first protrusion that extends into a first trench in the semiconductor substrate.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a semiconductor substrate comprising a front-side surface opposite a back-side surface. A plurality of photodetectors is disposed in the semiconductor substrate. An isolation structure extends into the back-side surface of the semiconductor substrate and is disposed between adjacent photodetectors. The isolation structure includes a metal core, a conductive liner disposed between the semiconductor substrate and the metal core, and a first dielectric liner disposed between the conductive liner and the semiconductor substrate. The metal core comprises a first metal material and the conductive liner comprises the first metal material and a second metal material different from the first metal material.

Abstract: An optical lens module includes an adjustable aperture assembly including rotatable blades, a driving part and an attractive force mechanism. The rotatable blades surround an optical axis of a lens element and form a light pass aperture. The driving part includes a rotatable component, a fixed component, a driving magnet and a coil. The rotatable component rotates the rotatable blades for adjusting an aperture size of the light pass aperture. The driving magnet is disposed on the rotatable component. The coil corresponds to the driving magnet to rotate the rotatable component. The attractive force mechanism provides an attractive force between the rotatable component and the fixed component and provides a driving force exerted on the rotatable blades for maintaining the light pass aperture in an enlarged state. The attractive force includes a magnetic force exerted by the rotatable component on a first magnetic element fixed on the fixed component.

Abstract: The present disclosure provides a high-throughput 3D cell spheroid culture chip, the preparation process and uses thereof. Through various efficacy experiments in the present disclosure, first evidence of using hydrogels derived from decellularized liver tissue as a self-healing biomaterial to reduce damage to damaged hepatocytes and enhance liver function in vitro is provided. Integrating endothelial cell-covered hepatocyte spheroids into DLM-CP hydrogels is a promising approach to develop microbial liver tissue, providing a potential solution for liver fibrosis recovery and promoting cell-level therapy. DLM-CP hydrogels show great potential for cell encapsulation for therapeutic purposes in future clinical settings and may be applied to ultra-high-throughput three-dimensional cell spheroid culture chips. It is used to create artificial tissues and organs, becoming a high-value tool widely used in biomedical research and pharmaceutical fields.

Abstract: The present disclosure for wafer bonding, including forming an epitaxial layer on a top surface of a first wafer, forming a sacrificial layer over the epitaxial layer, trimming an edge of the first wafer, removing the sacrificial layer, forming an oxide layer over the top surface of the first wafer subsequent to removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer.

Abstract: The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.

Abstract: An imaging lens assembly module includes an imaging lens element set, a light folding element and a plate-shaped light blocking element. The imaging lens element set has an optical axis, and includes a lens element. The light folding element is configured to fold the optical axis at least once, and includes an incident surface, an exit surface and an optical reflecting surface. The plate-shaped light blocking element keeps an air distance between the plate-shaped light blocking element and the light folding element, and includes two layered structures and columnar air structures. The layered structures are corresponding to the light folding element. The columnar air structures are farther away from the light folding element than a surface of the plate-shaped light blocking element from the light folding element, and the surface of the plate-shaped light blocking element faces toward the light folding element.

Abstract: Disclosed is a pixel sensor circuit including a photodiode element and a transistor element. The photodiode element is configured to sense an X-ray to generate a photocurrent signal. The photodiode element has a first end and a second end. A bias voltage is applied to the first end of the photodiode element. The transistor element is coupled to the second end of the photodiode element. The transistor element is configured to control the photocurrent signal to be read out. The voltage value of the bias voltage is adjusted according to the intensity of the X-ray.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a plurality of first photoelectric conversion elements and a plurality of second photoelectric conversion elements. The semiconductor device also includes a light-adjusting structure disposed on the substrate. The light-adjusting structure includes a patterned multi-film having a plurality of trenches that correspond to the first photoelectric conversion elements. The first photoelectric conversion elements are used for sensing near infrared light, and the second photoelectric conversion elements are used for sensing visible light.

Abstract: A thread-rolling apparatus includes a base, a feeding unit, a thread-forming assembly, and a distance-sensing assembly. The base mainly includes a movable portion, a first body, and a second body between the movable portion and the first body. The thread-forming assembly includes cooperating first and second dies and a working passage formed between the dies. The distance-sensing assembly includes at least one sensing unit disposed on the first body and a processing module connected to the sensing unit. The cooperation between the sensing unit and the processing module senses changes in a first distance between the first body and the second body in a non-contact manner whereby abnormal variations can be quickly observed and properly coped, and a second distance of the working passage can be in a normal state. Accordingly, the yield rate of the thread-rolling apparatus can be efficiently increased.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a semiconductor substrate comprising a front-side surface opposite a back-side surface. A plurality of photodetectors is disposed in the semiconductor substrate. An isolation structure extends into the back-side surface of the semiconductor substrate and is disposed between adjacent photodetectors. The isolation structure includes a metal core, a conductive liner disposed between the semiconductor substrate and the metal core, and a first dielectric liner disposed between the conductive liner and the semiconductor substrate. The metal core comprises a first metal material and the conductive liner comprises the first metal material and a second metal material different from the first metal material.

Abstract: The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.

Abstract: Some implementations herein provide for a system and methods for in-line monitoring of a sealant being dispensed by a jet nozzle in a beveled region along a perimeter of a stack of semiconductor substrates. The system includes an automated optical inspection system. During the dispensing of the sealant by the jet nozzle, the automated optical inspection system may monitor an amount of an accumulation of the sealant within the beveled region.