Patents by Inventor Yi Hsieh Chiu

Yi Hsieh Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079483
    Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, a fin base disposed on the substrate, nanostructured channel regions disposed on a first portion of the fin base, a gate structure surrounding the nanostructured channel regions, a source/drain (S/D) region disposed on a second portion of the fin base, and an isolation structure disposed between the S/D region and the second portion of the fin base. The isolation structure includes an undoped semiconductor layer disposed on the second portion of the fin base, a silicon-rich dielectric layer disposed on the undoped semiconductor layer, and an air spacer disposed on the silicon-rich dielectric layer.
    Type: Application
    Filed: March 22, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Hung LIN, I-Hsieh WONG, Tzu-Hua CHIU, Cheng-Yi PENG, Chia-Pin LIN
  • Publication number: 20230244283
    Abstract: An electronics unit (EU) stand may include a base and a fan carrier. The base is to couple to an electronics unit having heat generating components. The fan carrier supports a fan. The fan carrier is movably coupled to the base to move the fan between a first position relative to the base and second position relative to the base.
    Type: Application
    Filed: July 17, 2020
    Publication date: August 3, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yi-Hsieh Chiu, Yu Wei Tan, Cheng-Yan Chiang
  • Publication number: 20230121942
    Abstract: Examples disclosed herein provide an enclosure of a computing device. One example enclosure includes a cover to provide access to components within the enclosure, and the cover is coupled to the enclosure via a shape memory material (SMM) structure. As an example, the SMM structure is to provide for removability of the cover according to a temperature of a heat generating component disposed within the enclosure.
    Type: Application
    Filed: March 27, 2020
    Publication date: April 20, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Yao-Wen Fan, Yu-Wei Tan, Jia-Hung Lai, Yi-Hsieh Chiu
  • Publication number: 20220382341
    Abstract: In one example in accordance with the present disclosure, a computing device mount is described. The computing device mount includes a stand to support a computing device and a spacer removably attached to the stand. The spacer is placed in a recess of the computing device to mount the computing device to a mounting surface. The spacer also aligns holes on the computing device with holes on the mounting surface.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 1, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Yi-Hsieh Chiu
  • Publication number: 20220341537
    Abstract: In some examples, an apparatus can include a body having a computing device stand structure for attachment of the body to a computing device and a display mount interface spacer structure for attachment of the body between a computing device and a display mount interface.
    Type: Application
    Filed: November 6, 2019
    Publication date: October 27, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Yi Hsieh Chiu