Patents by Inventor Yi-Hsin HUA

Yi-Hsin HUA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9510098
    Abstract: A method for recording and reconstructing a three-dimensional (3D) sound field, wherein a microphone array is established in a 3D sound field to track and locate sound sources in the 3D sound field and retrieve corresponding sound source signals. A plurality of control points is established inside an area where the 3D sound field is to be reconstructed. The control points are used to establish relational expressions of the sound source signals, the 3D sound field, a reconstructed sound field, and reconstructed sound source signals. The reconstructed sound source signals are obtained via solving the relational expressions and input into a speaker array arranged outside the area to establish the reconstructed sound field in the area. The present invention truly records the 3D sound field without using any extra transformation process and replays the reconstructed sound field with a larger sweet spot in higher fidelity.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: November 29, 2016
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Mingsian R. Bai, Yi-Hsin Hua
  • Publication number: 20160057539
    Abstract: A method for recording and reconstructing a three-dimensional (3D) sound field, wherein a microphone array is established in a 3D sound field to track and locate sound sources in the 3D sound field and retrieve corresponding sound source signals. A plurality of control points is established inside an area where the 3D sound field is to be reconstructed. The control points are used to establish relational expressions of the sound source signals, the 3D sound field, a reconstructed sound field, and reconstructed sound source signals. The reconstructed sound source signals are obtained via solving the relational expressions and input into a speaker array arranged outside the area to establish the reconstructed sound field in the area. The present invention truly records the 3D sound field without using any extra transformation process and replays the reconstructed sound field with a larger sweet spot in higher fidelity.
    Type: Application
    Filed: December 16, 2014
    Publication date: February 25, 2016
    Inventors: Mingsian R. BAI, Yi-Hsin HUA