Patents by Inventor Yi-Hsin Lin
Yi-Hsin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240321731Abstract: A semiconductor device includes a dummy fin structure disposed over a substrate, a dummy gate structure disposed over a part of the dummy fin structure, a first interlayer dielectric layer in which the dummy gate structure is embedded, a second interlayer dielectric layer disposed over the first interlayer dielectric layer, and a resistor wire formed of a conductive material and embedded in the second interlayer dielectric layer. The resistor wire overlaps the dummy gate structure in plan view.Type: ApplicationFiled: June 5, 2024Publication date: September 26, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hsin HU, Yu-Chiun LIN, Yi-Hsuan CHUNG, Chung-Peng HSIEH, Chung-Chieh YANG, Po-Nien CHEN
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Publication number: 20240319560Abstract: An operation method of electronic device, comprising providing a first panel, wherein the first panel comprises first substrate, first medium layer disposed on the first substrate, a first electrode layer disposed between the first substrate and the first medium layer, and a second electrode layer disposed between the first electrode layer and the first medium layer; providing a second panel overlapped with the first panel, providing an adhesive layer, wherein the first panel is attached to the second panel through the adhesive layer, and the first panel and the second panel present a mirror-symmetrical structure with the adhesive layer as the axis of symmetry; applying a first voltage to the first electrode layer; applying a second voltage to the second electrode layer; applying a third voltage to the first electrode layer.Type: ApplicationFiled: June 6, 2024Publication date: September 26, 2024Applicant: Innolux CorporationInventors: Mei-Wen Jao, Chang-Chiang Cheng, Yung-Hsun Wu, Rui-An Yu, Yi-Hsin Lin
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Patent number: 12085834Abstract: An electrically tunable liquid crystal lens includes a carrier substrate, a common electrode layer disposed on the carrier substrate, a liquid crystal unit, a patterned electrode layer, a terminal electrode layer, a dielectric insulating layer, and a cover. The liquid crystal unit is disposed on the common electrode layer opposite to the carrier substrate, and includes a plurality of liquid crystal molecules. The patterned electrode layer is disposed on the liquid crystal unit opposite to the common electrode layer, and has a plurality of aperture patterns located within a projection of the liquid crystal unit on the patterned electrode layer. The terminal electrode layer is disposed on the patterned electrode layer opposite to the liquid crystal unit. The dielectric insulating layer is disposed between the patterned electrode layer and the terminal electrode layer. The cover is disposed on the terminal electrode layer opposite to the dielectric insulating layer.Type: GrantFiled: June 12, 2023Date of Patent: September 10, 2024Assignee: National Yang Ming Chiao Tung UniversityInventors: Yi-Hsin Lin, Ting-Wei Huang, Wei-Cheng Cheng, Chang-Nien Mao
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Patent number: 12087579Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.Type: GrantFiled: May 4, 2021Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chung-Yang Huang, Hao-Ming Chang, Ming Che Li, Yu-Hsin Hsu, Po-Cheng Lai, Kuan-Shien Lee, Wei-Hsin Lin, Yi-Hsuan Lin, Wang Cheng Shih, Cheng-Ming Lin
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Patent number: 12069811Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.Type: GrantFiled: July 27, 2022Date of Patent: August 20, 2024Assignee: AUO CORPORATIONInventors: Yi-Hsin Lin, Wen-Lung Chen
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Patent number: 12064430Abstract: The present invention relates to cabozantinib lauryl sulfate salt and methods of use.Type: GrantFiled: January 13, 2023Date of Patent: August 20, 2024Assignee: Handa Oncology, LLCInventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
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Patent number: 12064428Abstract: The present invention relates to capsules comprising dasatinib lauryl sulfate salt.Type: GrantFiled: May 17, 2021Date of Patent: August 20, 2024Assignee: HANDA ONCOLOGY, LLCInventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
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Publication number: 20240274100Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.Type: ApplicationFiled: January 18, 2024Publication date: August 15, 2024Inventors: Chung-Yang CHEN, Chia-Chun HSU, Jei-Feng LI, Yi-Hsin SHEN, Guo LI, Ta-Chang LIAO, Yu-Chia CHANG, Hung-Hao CHANG, Po-Ting CHEN, Yu-Hsien LIN
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Publication number: 20240264405Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: ApplicationFiled: April 16, 2024Publication date: August 8, 2024Inventors: Chao-Chang HU, Liang-Ting HO, Chen-Er HSU, Yi-Liang CHAN, Fu-Lai TSENG, Fu-Yuan WU, Chen-Chi KUO, Ying-Jen WANG, Wei-Han HSIA, Yi-Hsin TSENG, Wen-Chang LIN, Chun-Chia LIAO, Shou-Jen LIU, Chao-Chun CHANG, Yi-Chieh LIN, Shang-Yu HSU, Yu-Huai LIAO, Shih-Wei HUNG, Sin-Hong LIN, Kun-Shih LIN, Yu-Cheng LIN, Wen-Yen HUANG, Wei-Jhe SHEN, Chih-Shiang WU, Sin-Jhong SONG, Che-Hsiang CHIU, Sheng-Chang LIN
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Publication number: 20240268053Abstract: Securing a riser cage and/or electronic components coupled thereto within an information handling system can be accomplished using a riser cage apparatus. The riser cage may be configured to removably secure the electronic components to a surface of the information handling system using one or more fasteners configured to couple the riser cage to a surface of a chassis. The one or more fasteners may comprise a protrusion configured to engage a pin coupled to the surface. The protrusion of the one or more fasteners may be movable relative to the riser cage between a first locked position in which the pin coupled to the surface is engaged by the protrusion and a second unlocked position in which the pin coupled to the surface is not engaged by the protrusion.Type: ApplicationFiled: April 16, 2024Publication date: August 8, 2024Applicant: Dell Products L.P.Inventors: Hsiang-Yin Hung, Kuang-Hsi Lin, Yi-Hsin Kuan
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Publication number: 20240176205Abstract: An electrically tunable liquid crystal lens includes a carrier substrate, a common electrode layer disposed on the carrier substrate, a liquid crystal unit, a patterned electrode layer, a terminal electrode layer, a dielectric insulating layer, and a cover. The liquid crystal unit is disposed on the common electrode layer opposite to the carrier substrate, and includes a plurality of liquid crystal molecules. The patterned electrode layer is disposed on the liquid crystal unit opposite to the common electrode layer, and has a plurality of aperture patterns located within a projection of the liquid crystal unit on the patterned electrode layer. The terminal electrode layer is disposed on the patterned electrode layer opposite to the liquid crystal unit. The dielectric insulating layer is disposed between the patterned electrode layer and the terminal electrode layer. The cover is disposed on the terminal electrode layer opposite to the dielectric insulating layer.Type: ApplicationFiled: June 12, 2023Publication date: May 30, 2024Applicant: National Yang Ming Chiao Tung UniversityInventors: Yi-Hsin LIN, Ting-Wei HUANG, Wei-Cheng CHENG, Chang-Nien MAO
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Publication number: 20240145453Abstract: A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.Type: ApplicationFiled: December 6, 2022Publication date: May 2, 2024Applicant: AUO CorporationInventors: Yi-Hsin Lin, Wen-Lung Chen
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Publication number: 20240061312Abstract: An electronic device including a first panel and a second panel overlapped with the first panel is provided. The first panel includes a substrate, a first medium layer, a first electrode layer and a second electrode layer. The first medium layer is disposed on the substrate. The first electrode layer is disposed between the substrate and the first medium layer. The second electrode layer is disposed between the first electrode layer and the first medium layer. A first voltage is applied to the first electrode layer, a second voltage is applied to the second electrode layer, and the first voltage is different from the second voltage.Type: ApplicationFiled: August 18, 2022Publication date: February 22, 2024Applicant: Innolux CorporationInventors: Mei-Wen Jao, Chang-Chiang Cheng, Yung-Hsun Wu, Rui-An Yu, Yi-Hsin Lin
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Patent number: 11860470Abstract: A flexible optical element adopting liquid crystals (LCs) as the materials for realizing electrically tunable optics is foldable. A method for manufacturing the flexible element includes patterned photo-polymerization. The LC optics can include a pair of LC layers with orthogonally aligned LC directors for polarizer-free properties, flexible polymeric alignment layers, flexible substrates, and a module for controlling the electric field. The lens power of the LC optics can be changed by controlling the distribution of electric field across the optical zone.Type: GrantFiled: November 20, 2020Date of Patent: January 2, 2024Assignee: COOPERVISION INTERNATIONAL LIMITEDInventors: Yi-Hsin Lin, Ming-Syuan Chen, Yu-Jen Wang
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Publication number: 20230359032Abstract: An optical display system includes an augmented reality device and a lens device. The augmented reality device has an output surface which is disposed to permit a combined image from the augmented reality device to be direct to an eye of a viewer. The lens device is disposed between the output surface and the eye of the viewer, and includes a focus lens unit and a variable focus lens. The focus lens unit is disposed proximate to the output surface, and is configured to shift a focus of a combined light contributed to the combined image. The variable focus lens is disposed distal from the output surface, and is configured to continuously shift the focus of the combined light that is being focused by the focus lens unit.Type: ApplicationFiled: July 22, 2022Publication date: November 9, 2023Inventors: Yi-Hsin LIN, Chang-Nien MAO, Wei-Cheng CHENG
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Patent number: 11809027Abstract: A pancake lens assembly includes a partially reflective mirror, a reflective polarizer, a quarter waveplate, a polarization-dependent optical device, and at least one polarization controller. When a light beam is introduced into the pancake lens assembly along an optical axis in a Z direction to pass through the polarization controller in a first state, a polarization direction of the light beam is converted by the polarization controller. When the light beam is introduced into the pancake lens assembly along the optical axis to pass through the polarization controller in a second state, the polarization direction of the light beam is prevented from being converted by the polarization controller.Type: GrantFiled: May 9, 2022Date of Patent: November 7, 2023Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Yi-Hsin Lin, Ting-Wei Huang, Yu-Jen Wang
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Patent number: 11747680Abstract: A display panel includes a first substrate, pixel structures, a second substrate, a display medium, a first sealant, and a second sealant. The first substrate includes an active area and a peripheral area outside the active area. The pixel structures are disposed on the active area of the first substrate. The second substrate is disposed opposite to the first substrate. The first sealant is disposed between the first substrate and the second substrate, and is located on the peripheral area of the first substrate. The second sealant is disposed on a side wall of the first substrate and a side wall of the second substrate. The second sealant includes a convex surface overlapped with the side wall of the first substrate and the side wall of the second substrate.Type: GrantFiled: April 8, 2021Date of Patent: September 5, 2023Assignee: Au Optronics CorporationInventors: Yi-Hsin Lin, Chao-Wei Huang
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Publication number: 20230253409Abstract: A display panel includes a first substrate, a second substrate, a plurality of light-emitting components, a bonding layer and a driving component. The first substrate includes a planar portion and a bending portion. The second substrate is disposed on the first substrate. The light-emitting components are disposed on the second substrate. The bonding layer is disposed between the planar portion of the first substrate and the second substrate. The driving component is disposed on a first surface of the bending portion of the first substrate and electrically connected to the light-emitting components. The first surface of the bending portion extends from a surface of the planar portion adjacent to the second substrate, and a projection of the bending portion in a vertical direction falls within the second substrate. A tiled display device including multiple display panels and a manufacturing method of the display panel are also provided.Type: ApplicationFiled: December 30, 2022Publication date: August 10, 2023Inventors: Yi-Hsin LIN, Wen-Lung CHEN, Wei-Lung LIAU
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Publication number: 20230254981Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.Type: ApplicationFiled: July 27, 2022Publication date: August 10, 2023Inventors: Yi-Hsin LIN, Wen-Lung CHEN
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Publication number: 20230246142Abstract: A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.Type: ApplicationFiled: December 7, 2022Publication date: August 3, 2023Inventors: Fu-Wei CHAN, Kuan-Hsun CHEN, Yi-Hsin LIN