Patents by Inventor Yi-Hsin Lin
Yi-Hsin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240404588Abstract: A semiconductor device includes a first memory cell, a second memory cell, a third memory cell, and a fourth memory cell operatively arranged along a first one of a plurality of columns, and operatively arranged in a first one, a second one, a third one, and a fourth one of a plurality of rows, respectively. The first column operatively corresponds to a first pair of bit lines and a second pair of bit lines. The first to fourth rows operatively correspond to a first word line, a second word line, a third word line, and a fourth word line, respectively. The first pair of bit lines are operatively coupled to the first and second memory cells. The second pair of bit lines are operatively coupled to the third and fourth memory cells.Type: ApplicationFiled: June 2, 2023Publication date: December 5, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Hsin Nien, Chih-Yu Lin, Hidehiro Fujiwara, Yen-Huei Chen
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Publication number: 20240395508Abstract: A semiconductor manufacturing apparatus for performing a process is disclosed. An apparatus includes a chamber configured to receive a wafer for an etching process; a conductive focus ring disposed within the chamber and configured to focus an electric field to control an etch direction of the etching process; and an insulative cover ring disposed within the chamber, wherein the insulative cover ring is configured to modify the electric field, wherein the insulative cover ring has an inner annular insulative portion and outer annular insulative portion, and wherein a gap is defined between the inner annular insulative portion and the outer annular insulative portion.Type: ApplicationFiled: May 25, 2023Publication date: November 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hao Chen, Chung Chuan Huang, Yi-Tsang Hsieh, Yu-Chi Lin, Cha-Hsin Chao, Che-En Tsai
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Publication number: 20240386945Abstract: A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.Type: ApplicationFiled: July 30, 2024Publication date: November 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsin NIEN, Hidehiro FUJIWARA, Chih-Yu LIN, Yen-Huei CHEN
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Patent number: 12140816Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion for holding an optical element, a fixed portion, a driving assembly used for driving the movable portion to move relative to the fixed portion, and an adhesive element. The movable portion is movable relative to the fixed portion, and the fixed portion includes a case and a bottom affixed on the case. The case has a top wall and a side wall. The top wall is plate-shaped and is perpendicular to a main axis, and the side wall is not parallel to the top wall. An accommodating space for accommodating the movable portion is formed between the case and the bottom. The adhesive element is in direct contact with the bottom, the case, and the driving assembly.Type: GrantFiled: February 7, 2022Date of Patent: November 12, 2024Assignee: TDK TAIWAN CORP.Inventors: Kun-Shih Lin, Yu-Sheng Li, Shih-Ting Huang, Yi-Hsin Nieh, Yu-Huai Liao
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Publication number: 20240366603Abstract: The present invention relates methods for treating chronic myeloid leukemia and/or lymphoblastic leukemia by orally administering to a patient in need of such a therapeutic amount of dasatinib lauryl sulfate salt, preferably in a tablet, capsule or suspension form. The method allows the administration of the therapeutic amount of dasatinib lauryl sulfate salt a fed state or a fasted state and the administration does not exhibit a food effect.Type: ApplicationFiled: July 19, 2024Publication date: November 7, 2024Applicant: Handa Oncology, LLCInventors: Fang-Yu Liu, K.C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
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Publication number: 20240372046Abstract: A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emitting diodes are electrically connected to the electrodes.Type: ApplicationFiled: November 2, 2023Publication date: November 7, 2024Applicant: AUO CorporationInventors: Yi-Hsin Lin, Wen-Lung Chen
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Patent number: 12136952Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.Type: GrantFiled: August 10, 2022Date of Patent: November 5, 2024Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTDInventors: Min-Sheng Kao, ChunFu Wu, Chung-Hsin Fu, QianBing Yan, LinChun Li, Chih-Wei Yu, Chien-Tzu Wu, Yi-Tseng Lin
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Patent number: 12137548Abstract: A memory device includes active regions and gate structures, each of the gate structures is electrically coupled to a first portion of a corresponding active region of the active regions. The memory device includes contact-to-transistor-component structures (MD structures), each of the MD structures is over a second portion of a corresponding active region, and a first MD structure is between adjacent gate structures. The memory device includes via-to-gate/MD (VGD) structures, each of the VGD structures is over to a corresponding gate electrode and MD structure. The memory device includes conductive segments, each of the conductive segments is over and electrically coupled to a corresponding VGD structure. The memory device includes buried contact-to-transistor-component structures (BVD) structures, each of the BVD structures is under a third portion of a corresponding active region.Type: GrantFiled: January 18, 2023Date of Patent: November 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventors: Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen, Wei-Chang Zhao, Yi-Hsin Nien
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Patent number: 12128781Abstract: The invention discloses a vessel automatic berthing wireless charging integrated system and operating method thereof. The invention comprises a charging barge and at least one vessel. The charging barge comprises a power, a distribution board and a locking module control system, and every vessel comprises an automatic pilot system, a vessel controlling system and a wireless power receiving module. A bow berthing module of the present invention moors the vessel. After a guiding structure of the bow berthing module straightly aligns bow direction of the vessel, a wireless power supplying module of a side berthing module matches with the wireless power receiving module then charges the vessel.Type: GrantFiled: December 10, 2021Date of Patent: October 29, 2024Assignee: SHIP AND OCEAN INDUSTRIES R&DCENTERInventors: Min-Long Tsai, Han-Chun Kao, Hung-Hsi Lin, Ta-Hsiu Tseng, Bing-Xian Chen, Cheng-Hsien Hsueh, Yi-Hsin Chan
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Patent number: 12125523Abstract: A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.Type: GrantFiled: January 27, 2022Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Hsin Nien, Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen
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Publication number: 20240319560Abstract: An operation method of electronic device, comprising providing a first panel, wherein the first panel comprises first substrate, first medium layer disposed on the first substrate, a first electrode layer disposed between the first substrate and the first medium layer, and a second electrode layer disposed between the first electrode layer and the first medium layer; providing a second panel overlapped with the first panel, providing an adhesive layer, wherein the first panel is attached to the second panel through the adhesive layer, and the first panel and the second panel present a mirror-symmetrical structure with the adhesive layer as the axis of symmetry; applying a first voltage to the first electrode layer; applying a second voltage to the second electrode layer; applying a third voltage to the first electrode layer.Type: ApplicationFiled: June 6, 2024Publication date: September 26, 2024Applicant: Innolux CorporationInventors: Mei-Wen Jao, Chang-Chiang Cheng, Yung-Hsun Wu, Rui-An Yu, Yi-Hsin Lin
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Publication number: 20240321731Abstract: A semiconductor device includes a dummy fin structure disposed over a substrate, a dummy gate structure disposed over a part of the dummy fin structure, a first interlayer dielectric layer in which the dummy gate structure is embedded, a second interlayer dielectric layer disposed over the first interlayer dielectric layer, and a resistor wire formed of a conductive material and embedded in the second interlayer dielectric layer. The resistor wire overlaps the dummy gate structure in plan view.Type: ApplicationFiled: June 5, 2024Publication date: September 26, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hsin HU, Yu-Chiun LIN, Yi-Hsuan CHUNG, Chung-Peng HSIEH, Chung-Chieh YANG, Po-Nien CHEN
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Patent number: 12085834Abstract: An electrically tunable liquid crystal lens includes a carrier substrate, a common electrode layer disposed on the carrier substrate, a liquid crystal unit, a patterned electrode layer, a terminal electrode layer, a dielectric insulating layer, and a cover. The liquid crystal unit is disposed on the common electrode layer opposite to the carrier substrate, and includes a plurality of liquid crystal molecules. The patterned electrode layer is disposed on the liquid crystal unit opposite to the common electrode layer, and has a plurality of aperture patterns located within a projection of the liquid crystal unit on the patterned electrode layer. The terminal electrode layer is disposed on the patterned electrode layer opposite to the liquid crystal unit. The dielectric insulating layer is disposed between the patterned electrode layer and the terminal electrode layer. The cover is disposed on the terminal electrode layer opposite to the dielectric insulating layer.Type: GrantFiled: June 12, 2023Date of Patent: September 10, 2024Assignee: National Yang Ming Chiao Tung UniversityInventors: Yi-Hsin Lin, Ting-Wei Huang, Wei-Cheng Cheng, Chang-Nien Mao
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Patent number: 12087579Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.Type: GrantFiled: May 4, 2021Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chung-Yang Huang, Hao-Ming Chang, Ming Che Li, Yu-Hsin Hsu, Po-Cheng Lai, Kuan-Shien Lee, Wei-Hsin Lin, Yi-Hsuan Lin, Wang Cheng Shih, Cheng-Ming Lin
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Patent number: 12064430Abstract: The present invention relates to cabozantinib lauryl sulfate salt and methods of use.Type: GrantFiled: January 13, 2023Date of Patent: August 20, 2024Assignee: Handa Oncology, LLCInventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
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Patent number: 12064428Abstract: The present invention relates to capsules comprising dasatinib lauryl sulfate salt.Type: GrantFiled: May 17, 2021Date of Patent: August 20, 2024Assignee: HANDA ONCOLOGY, LLCInventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
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Patent number: 12069811Abstract: A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.Type: GrantFiled: July 27, 2022Date of Patent: August 20, 2024Assignee: AUO CORPORATIONInventors: Yi-Hsin Lin, Wen-Lung Chen
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Publication number: 20240274100Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.Type: ApplicationFiled: January 18, 2024Publication date: August 15, 2024Inventors: Chung-Yang CHEN, Chia-Chun HSU, Jei-Feng LI, Yi-Hsin SHEN, Guo LI, Ta-Chang LIAO, Yu-Chia CHANG, Hung-Hao CHANG, Po-Ting CHEN, Yu-Hsien LIN
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Publication number: 20240264405Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: ApplicationFiled: April 16, 2024Publication date: August 8, 2024Inventors: Chao-Chang HU, Liang-Ting HO, Chen-Er HSU, Yi-Liang CHAN, Fu-Lai TSENG, Fu-Yuan WU, Chen-Chi KUO, Ying-Jen WANG, Wei-Han HSIA, Yi-Hsin TSENG, Wen-Chang LIN, Chun-Chia LIAO, Shou-Jen LIU, Chao-Chun CHANG, Yi-Chieh LIN, Shang-Yu HSU, Yu-Huai LIAO, Shih-Wei HUNG, Sin-Hong LIN, Kun-Shih LIN, Yu-Cheng LIN, Wen-Yen HUANG, Wei-Jhe SHEN, Chih-Shiang WU, Sin-Jhong SONG, Che-Hsiang CHIU, Sheng-Chang LIN
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Publication number: 20240268053Abstract: Securing a riser cage and/or electronic components coupled thereto within an information handling system can be accomplished using a riser cage apparatus. The riser cage may be configured to removably secure the electronic components to a surface of the information handling system using one or more fasteners configured to couple the riser cage to a surface of a chassis. The one or more fasteners may comprise a protrusion configured to engage a pin coupled to the surface. The protrusion of the one or more fasteners may be movable relative to the riser cage between a first locked position in which the pin coupled to the surface is engaged by the protrusion and a second unlocked position in which the pin coupled to the surface is not engaged by the protrusion.Type: ApplicationFiled: April 16, 2024Publication date: August 8, 2024Applicant: Dell Products L.P.Inventors: Hsiang-Yin Hung, Kuang-Hsi Lin, Yi-Hsin Kuan