Abstract: Disclosed is an aluminum nitride electrostatic chuck, comprising: a positioning electrostatic chuck and a carrier structure. The positioning electrostatic chuck includes a groove structure layer, a dielectric insulation layer, and a heat conduction layer. In the groove structure layer on the surface of the electrostatic chuck is provided with cooling gas channels, to facilitate control of the temperature distribution of a wafer. The electrostatic chuck is especially designed for use in a semiconductor manufacturing process of high temperature and high plasma power density. The dielectric insulation layer is provided with embedded electrodes, such that voltage conversion can be carried out to effect wafer absorption/release. The cooling gas channels are used to control temperature of the absorbed wafer, by means of heat conduction of aluminum nitride electrostatic chuck. Therefore, wafer temperature distribution is controlled through aspect ratio and geometry of cooling gas channel.

Abstract: A method of forming a pattern with high aspect ratio on a polycrystalline aluminum nitride substrate comprises the steps of (A) providing an aluminum nitride substrate and forming a barrier layer on the aluminum nitride substrate; (B) etching the barrier layer with an energy beam to form at least one recess in the barrier layer; (C) plasma etching the substrate to deepen the recess into the aluminum nitride substrate; (D) removing the barrier layer to obtain the aluminum nitride substrate having at least one pattern with high aspect ratio. The method uses the energy beam to directly form a pattern on the barrier layer, and further employs plasma etching to prepare the aluminum nitride substrate having a pattern with high aspect ratio quickly and effectively.

Abstract: Disclosed is an aluminum nitride electrostatic chuck, comprising: a positioning electrostatic chuck and a carrier structure. The positioning electrostatic chuck includes a groove structure layer, a dielectric insulation layer, and a heat conduction layer. In the groove structure layer on the surface of the electrostatic chuck is provided with cooling gas channels, to facilitate control of the temperature distribution of a wafer. The electrostatic chuck is especially designed for use in a semiconductor manufacturing process of high temperature and high plasma power density. The dielectric insulation layer is provided with embedded electrodes, such that voltage conversion can be carried out to effect wafer absorption/release. The cooling gas channels are used to control temperature of the absorbed wafer, by means of heat conduction of aluminum nitride electrostatic chuck. Therefore, wafer temperature distribution is controlled through aspect ratio and geometry of cooling gas channel.

Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.

Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.

Abstract: A method of manufacturing a microencapsulated phase-change material-containing gypsum plate capable of flame retardation and temperature variation attenuation is introduced, such that an organic microencapsulated phase-change material is uniformly distributed in an inorganic gypsum plate. The method involves putting a microencapsulated phase-change material in a dispersing agent solution, blending the dispersing agent solution to form a first solution, putting the foaming agent in the first solution, putting gypsum powder and starch in the first solution, blending the first solution to form a microencapsulated phase-change material gypsum mixture solution, molding the microencapsulated phase-change material gypsum mixture solution to finalize the manufacturing of a microencapsulated phase-change material-containing gypsum plate capable of flame retardation and temperature variation attenuation.

Abstract: Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath.

Abstract: The present invention relates to a preparation of modified organic core materials and metallic shell composite microspheres, in which, the surface zeta potential of an organic core materials can attract the opposite zeta potential of the polyelectrolyte and form a polyelectrolyte layer so as to modify the surface of organic core materials. Moreover, the polyelectrolyte layer could attract a first metal ions, particles or complexes added later in suitable condition such that the surface of organic core materials could be metallized and covered with a first metal layer. Furthermore, the organic core materials could be covered with at least one surface metal layer. The first metal layer can be modified by second metal layer with redox-transmetalation® technology to obtain multi-metal layers organic-metallic composite structure.

Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.

Abstract: Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath.

Abstract: Disclosed is a method for making an antimicrobial material from 1D nanometer silver that does not accumulate in a human body. At first, 1D nanometer silver is mixed in hydrophilic solution to produce 1D nanometer silver solution. Then, adhesive is blended in the 1D nanometer silver solution to produce the antimicrobial material. The antimicrobial material may be used in antimicrobial liquid, antimicrobial dressing or antimicrobial composite. Human skin can easily block the 1D nanometer silver. Therefore, the 1D nanometer silver does not enter or accumulate in the human body. Yet, the antimicrobial material exhibits a high bactericidal rate.

Abstract: A thermo-interface material composite uses a thermo-interface material containing silver nanowires. The silver nanowires have high aspect ratios, high thermo-conductivity coefficients and good anti-oxidation capabilities. Hence, an amount of silver nanowires can be added fewer than that of a traditional metal or ceramic powder. In this way, defects on device surface can be speckled during a dispersal process for improving adhesion between devices. Thus, a thermo-interface material is fabricated to obtain a high thermo-conductivity coefficient for further forming a thermo-channel.

Abstract: A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.

Abstract: The invention discloses a method for continuously fabricating silver nanowires. The method mixes a glycol solution of a silver salt and a glycol solution of a polyvinyl pyrrolidone, and the mixed solution reacts in a temperature range and a time range to form the silver nanowires. The polyvinyl pyrrolidone has high boiling point and reduction ability so as to reduce the silver salt to the silver nanoparticles, and simultaneously, the polyvinyl pyrrolidone can provide barriers for limiting the particle growth. Besides, the oxygen functional groups on the long chains of the polyvinyl pyrrolidone can keep the stably one-dimensional growth of the silver nanoparticles to form the silver nanowires during the aging process.

Abstract: A nano-silver wound dressing consisting of a skin contact layer made from hydrophilic cloth and directly contacting a wound on the surface of the skin, a disinfecting (or bactericidal) antitoxic layer made from activated charcoal cloth impregnated with nanocrystalline silver, a blood absorbing and styptic layer made from a superabsorbent polymer non-woven cloth, an isolation layer made from a composite fabric with a pore size of less than 5 ?m, and an elastic bandage for fixing a main body on the site of wound. Edges of the isolation layer and the skin contact layer are integrated to form a main body while the disinfecting (or bactericidal) antitoxic layer as well as the blood absorbing and styptic layer are separated from each other and both enclosed inside the main body.

Abstract: A nano-silver wound dressing consists of a skin contact layer made from hydrophilic cloth and directly contacting wound on surface of skin, a disinfecting (or bactericidal) antitoxic layer made from activated charcoal cloth impregnated with nanocrystalline silver, a blood absorbing and styptic layer made from non-woven cloth with superabsorbent polymer, an isolation layer made from composite fabric with pore size less than 5 ?m, and an elastic bandage for fixing a main body on the site of wound. Edges of the isolation layer and the skin contact layer are integrated to form a main body while the disinfecting (or bactericidal) antitoxic layer as well as the blood absorbing and styptic layer are separated from each other and both enclosed inside the main body.