Patents by Inventor Yi Hsu
Yi Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250228532Abstract: A sample collection device is provided, including: a container, having a chamber, including an opening and an outlet which are disposed on two opposite sides thereof, the opening, the outlet and the chamber communicated with one another, an inner wall of the container having a plurality of protrusion portions, the plurality of protrusion portions radially protruding into the chamber; a filtration unit, disposed within the container and between the chamber and the outlet; and a sampling unit, including a main body and a sample collection member made of deformed absorbent material, the sample collection member disposed on the main body, and the sample collection member being insertable into the chamber and radially squeezed by the plurality of protrusion portions.Type: ApplicationFiled: January 17, 2024Publication date: July 17, 2025Inventors: KUAN-CHIAO LIAO, YA-CHIEH YU, CHIH-YI HSU
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Publication number: 20250203785Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a ceramic board, a thick circuit layer formed on the ceramic board, and a thin circuit layer that is formed on the ceramic board. The thick circuit layer has a thickness being greater than or equal to 200 ?m, and the thin circuit layer has a thickness being within a range from 1 ?m to 150 ?m. The thin circuit layer includes a sputtering layout segment connected to the ceramic board and an electroplating layer that is connected to the sputtering layout segment. The material of the electroplating layer is different from that of the sputtering layout segment.Type: ApplicationFiled: March 19, 2024Publication date: June 19, 2025Inventors: CHUNG-HO WEI, CHIH-WEI MAO, Yi-Lun Chu, TSUNG-YING CHANG, MING-YI HSU, CHI-WEN HUANG
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Publication number: 20250188395Abstract: A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.Type: ApplicationFiled: February 18, 2025Publication date: June 12, 2025Inventors: HSIN-YI HSU, YANG-CHENG LIN, CHAO-HONG HSU, YU-BING LIOU, LI-HSIN LIN, HSIN-HSIN SHEN, YU-CHI WANG, CHANG-CHOU LI, CHIH-HUNG HUANG
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Patent number: 12315750Abstract: A gas curtain device for a front opening unified pod has a casing. At least one first gas guide plate is disposed in the casing. The first gas guide plate has a first gas guide region. The first gas guide region has a plurality of first gas guide holes. A second gas guide plate is disposed at a distal end of the casing. The second gas guide plate has a second gas guide region. The second gas guide region has a plurality of second gas guide holes. The area of the first gas guide region is less than the area of the second gas guide region. The number of the second gas guide holes is greater than the number of the first gas guide holes. The total area of the second gas guide holes is greater than the total area of the first gas guide holes.Type: GrantFiled: November 8, 2022Date of Patent: May 27, 2025Assignees: Avex-SG Technology Inc.Inventors: Jin-Bor Chen, Tsan-Hua Huang, Shun-Yi Hsu, Tzu-Hung Hsu
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Publication number: 20250162280Abstract: An active metal brazing substrate and a method for manufacturing the same are provided. The active metal brazing substrate includes a ceramic substrate layer, an active metal layer, and a conductive metal layer. The active metal layer is disposed between the ceramic substrate layer and the conductive metal layer. The active metal layer is formed from an active metal solder and an organic dispersion medium. The active metal solder includes silver, copper, and an active metal. Based on a total weight of the active metal solder being 100 wt %, an amount of the silver ranges from 10 wt % to 60 wt %. A tensile strength of the active metal brazing substrate ranges from 165 N/cm to 270 N/cm.Type: ApplicationFiled: February 5, 2024Publication date: May 22, 2025Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
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Publication number: 20250155609Abstract: An optical module is provided. The optical module includes a resin package, a lens and a light emitting element. The resin package has a receiving groove. The lens is disposed on the resin package, and the lens includes a light emitting surface, a light entering surface, and a central axis, wherein the light entering surface has an asymmetric structure. The light emitting element is disposed in the receiving groove, wherein the light emitting element is disposed deviated from the central axis of the lens.Type: ApplicationFiled: November 5, 2024Publication date: May 15, 2025Inventors: Kai-Hung CHENG, Ku-Cheng LIN, Chun-Min LIN, Wei-Yi HSU
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Publication number: 20250155815Abstract: A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.Type: ApplicationFiled: January 17, 2025Publication date: May 15, 2025Inventors: Yung-Yao LEE, Chen Yi HSU
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Publication number: 20250129316Abstract: This disclosure relates to a biological tissue forming method includes the following steps: providing a biological tissue forming package with a base, a membrane, a sliding assembly and a sealing film that seals a chamber of the base used for receiving the membrane and the sliding assembly with one of the base and the sealing film being light-transmitting; passing a biological tissue fluid through the sealing film and the sliding assembly so as to be dispensed on the membrane; moving the sliding assembly away from a covering position used for covering the membrane via at least one passive magnetic element so as to expose the biological tissue fluid on the membrane; and emitting the biological tissue fluid exposed on the membrane by a curing light transmitting through the one of the base and the sealing film so as to cure the biological tissue fluid into a biological tissue.Type: ApplicationFiled: December 15, 2023Publication date: April 24, 2025Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Hong HSU, Teng-Yen WANG, Yang-Cheng LIN, Hsin-Yi HSU, Yu-Bing LIOU, Chang-Chou LI, Chih-Hung HUANG, Tung-Ying LIN, Li-Hsin LIN, Yuchi WANG, Hsin-Hsin SHEN
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Publication number: 20250102725Abstract: The present pertains to an optical module including an optical shell, a plurality of first light-emitting diodes, a plurality of light guide plates, and a plurality of second light-emitting diodes. The optical shell includes a plurality of recessed portions and a flat portion surrounding the recessed portions. One of the first light-emitting diodes is disposed in the recessed portions. Each of the light guide plates has a top surface and a sidewall, and the top surface of the light guide plate is substantially at the same level as the flat portion of the optical shell. One of the second light-emitting diodes is disposed below the top surface of the light guide plates and is adjacent to the sidewall of the light guide plates.Type: ApplicationFiled: September 23, 2024Publication date: March 27, 2025Inventors: Jia-Jie PAN, Wei-Yi HSU, Jung-Tang CHU, Ming-Jing LEE
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Publication number: 20250105546Abstract: An electrical connector is configured to be assembled with a joint. The electrical connector includes an outer casing, a seat body and a plurality of insulation-displacement contacts. The outer casing includes a first casing and a second casing. The first casing includes an accommodation portion, a threaded portion and a connection portion, the accommodation portion and the threaded portion are integrally connected to each other via the connection portion. The accommodation portion is configured to be assembled with the joint, the threaded portion and the second casing are screwed with each other, and the first casing and the second casing together form an accommodation space. The seat body is disposed in the accommodation space. The insulation-displacement contacts are fixed to the seat body and extend to the accommodation portion.Type: ApplicationFiled: November 15, 2023Publication date: March 27, 2025Applicant: TELEBOX INDUSTRIES CORP.Inventors: Ching-Yi HSU, Hung Yu WU
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Publication number: 20250100868Abstract: Disclosed is a manually operated dual-action suction/delivery fluid pump and component assembly thereof. The dual-action fluid pump has a fluid container, a cover, a pump unit, and a control valve, wherein the fluid container serves as a reservoir for containing fluid connected to a fluid-conducting pipe. The cover is removably attached to the fluid container connecting the pump unit having a cylinder chamber with a piston. The control valve is horizontally positioned on the cover. By manipulating the control valve to reciprocate, it can be actuated to either draw air out of the fluid container or pump air into the fluid container, facilitating the fluid to enter the fluid container via the fluid-conducting pipe or pump it out of the fluid container.Type: ApplicationFiled: September 26, 2023Publication date: March 27, 2025Inventor: Heng-Yi HSU
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Patent number: 12261388Abstract: An electrical connector is provided, including an insulating body, multiple terminals, and a metallic plate. The insulating body has a base portion and a tongue portion. The terminals are disposed at the insulating body and extending from the base portion to the tongue portion, respectively. Portions of the terminals exposed from the tongue portion are configured to be mated with terminals of another electrical connector. The metallic plate is disposed in the insulating body. The terminals are divided into two groups by the metallic plate. The metallic plate has at least one strip connecting portion, and the strip connecting portion exposes at the base portion of the insulating body.Type: GrantFiled: April 21, 2022Date of Patent: March 25, 2025Assignee: Advanced Connectek Inc.Inventors: Shu-Fen Wang, Yu-Chai Yeh, Yi Hsu
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Patent number: 12258546Abstract: A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.Type: GrantFiled: December 23, 2021Date of Patent: March 25, 2025Assignee: Industrial Technology Research InstituteInventors: Hsin-Yi Hsu, Yang-Cheng Lin, Chao-Hong Hsu, Yu-Bing Liou, Li-Hsin Lin, Hsin-Hsin Shen, Yu-Chi Wang, Chang-Chou Li, Chih-Hung Huang
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Patent number: 12235582Abstract: A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.Type: GrantFiled: July 24, 2023Date of Patent: February 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Yao Lee, Chen Yi Hsu
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Publication number: 20250010390Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material. The second metal composite material includes a low melting point metal element (e.g., Sn), copper (Cu), and a second active metal element, but does not include silver. A melting point of the low melting metal element is between 130° C. and 350° C.Type: ApplicationFiled: October 13, 2023Publication date: January 9, 2025Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
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Publication number: 20250010408Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material, which includes aluminum (Al), copper (Cu), and a second active metal element, but does not contain silver. Based on a total weight of the second metal composite material being 100 parts by weight, an aluminum content is not less than 40 parts by weight.Type: ApplicationFiled: October 12, 2023Publication date: January 9, 2025Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
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Patent number: 12191146Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.Type: GrantFiled: August 9, 2022Date of Patent: January 7, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yung-Yao Lee, Chen Yi Hsu, Wei-Hsiang Tseng
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Publication number: 20250006531Abstract: A gas curtain device for a front opening unified pod has a casing. The casing has an interior space. The interior space defines a transverse gas space, a curved gas space and a vertical gas space. At least one first gas guide plate is disposed in the transverse gas space and/or the curved gas space. The first gas guide plate has a plurality of first gas guide holes. A second gas guide plate is disposed at one end of the vertical gas space. The second gas guide plate has a plurality of second gas guide holes.Type: ApplicationFiled: August 18, 2022Publication date: January 2, 2025Inventors: JIN-BOR CHEN, TSAN-HUA HUANG, SHUN-YI HSU, TZU-HUNG HSU
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Publication number: 20250006530Abstract: A gas curtain device for a front opening unified pod has a casing. At least one first gas guide plate is disposed in the casing. The first gas guide plate has a first gas guide region. The first gas guide region has a plurality of first gas guide holes. A second gas guide plate is disposed at a distal end of the casing. The second gas guide plate has a second gas guide region. The second gas guide region has a plurality of second gas guide holes. The area of the first gas guide region is less than the area of the second gas guide region. The number of the second gas guide holes is greater than the number of the first gas guide holes. The total area of the second gas guide holes is greater than the total area of the first gas guide holes.Type: ApplicationFiled: November 8, 2022Publication date: January 2, 2025Inventors: JIN-BOR CHEN, TSAN-HUA HUANG, SHUN-YI HSU, TZU-HUNG HSU
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Patent number: D1060456Type: GrantFiled: November 27, 2019Date of Patent: February 4, 2025Inventor: Roger Wen Yi Hsu