Patents by Inventor Yi Hsu

Yi Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250129316
    Abstract: This disclosure relates to a biological tissue forming method includes the following steps: providing a biological tissue forming package with a base, a membrane, a sliding assembly and a sealing film that seals a chamber of the base used for receiving the membrane and the sliding assembly with one of the base and the sealing film being light-transmitting; passing a biological tissue fluid through the sealing film and the sliding assembly so as to be dispensed on the membrane; moving the sliding assembly away from a covering position used for covering the membrane via at least one passive magnetic element so as to expose the biological tissue fluid on the membrane; and emitting the biological tissue fluid exposed on the membrane by a curing light transmitting through the one of the base and the sealing film so as to cure the biological tissue fluid into a biological tissue.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 24, 2025
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Hong HSU, Teng-Yen WANG, Yang-Cheng LIN, Hsin-Yi HSU, Yu-Bing LIOU, Chang-Chou LI, Chih-Hung HUANG, Tung-Ying LIN, Li-Hsin LIN, Yuchi WANG, Hsin-Hsin SHEN
  • Publication number: 20250100868
    Abstract: Disclosed is a manually operated dual-action suction/delivery fluid pump and component assembly thereof. The dual-action fluid pump has a fluid container, a cover, a pump unit, and a control valve, wherein the fluid container serves as a reservoir for containing fluid connected to a fluid-conducting pipe. The cover is removably attached to the fluid container connecting the pump unit having a cylinder chamber with a piston. The control valve is horizontally positioned on the cover. By manipulating the control valve to reciprocate, it can be actuated to either draw air out of the fluid container or pump air into the fluid container, facilitating the fluid to enter the fluid container via the fluid-conducting pipe or pump it out of the fluid container.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Inventor: Heng-Yi HSU
  • Publication number: 20250105546
    Abstract: An electrical connector is configured to be assembled with a joint. The electrical connector includes an outer casing, a seat body and a plurality of insulation-displacement contacts. The outer casing includes a first casing and a second casing. The first casing includes an accommodation portion, a threaded portion and a connection portion, the accommodation portion and the threaded portion are integrally connected to each other via the connection portion. The accommodation portion is configured to be assembled with the joint, the threaded portion and the second casing are screwed with each other, and the first casing and the second casing together form an accommodation space. The seat body is disposed in the accommodation space. The insulation-displacement contacts are fixed to the seat body and extend to the accommodation portion.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 27, 2025
    Applicant: TELEBOX INDUSTRIES CORP.
    Inventors: Ching-Yi HSU, Hung Yu WU
  • Publication number: 20250102725
    Abstract: The present pertains to an optical module including an optical shell, a plurality of first light-emitting diodes, a plurality of light guide plates, and a plurality of second light-emitting diodes. The optical shell includes a plurality of recessed portions and a flat portion surrounding the recessed portions. One of the first light-emitting diodes is disposed in the recessed portions. Each of the light guide plates has a top surface and a sidewall, and the top surface of the light guide plate is substantially at the same level as the flat portion of the optical shell. One of the second light-emitting diodes is disposed below the top surface of the light guide plates and is adjacent to the sidewall of the light guide plates.
    Type: Application
    Filed: September 23, 2024
    Publication date: March 27, 2025
    Inventors: Jia-Jie PAN, Wei-Yi HSU, Jung-Tang CHU, Ming-Jing LEE
  • Patent number: 12261388
    Abstract: An electrical connector is provided, including an insulating body, multiple terminals, and a metallic plate. The insulating body has a base portion and a tongue portion. The terminals are disposed at the insulating body and extending from the base portion to the tongue portion, respectively. Portions of the terminals exposed from the tongue portion are configured to be mated with terminals of another electrical connector. The metallic plate is disposed in the insulating body. The terminals are divided into two groups by the metallic plate. The metallic plate has at least one strip connecting portion, and the strip connecting portion exposes at the base portion of the insulating body.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: March 25, 2025
    Assignee: Advanced Connectek Inc.
    Inventors: Shu-Fen Wang, Yu-Chai Yeh, Yi Hsu
  • Patent number: 12258546
    Abstract: A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: March 25, 2025
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Yi Hsu, Yang-Cheng Lin, Chao-Hong Hsu, Yu-Bing Liou, Li-Hsin Lin, Hsin-Hsin Shen, Yu-Chi Wang, Chang-Chou Li, Chih-Hung Huang
  • Patent number: 12235582
    Abstract: A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Yao Lee, Chen Yi Hsu
  • Publication number: 20250010390
    Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material. The second metal composite material includes a low melting point metal element (e.g., Sn), copper (Cu), and a second active metal element, but does not include silver. A melting point of the low melting metal element is between 130° C. and 350° C.
    Type: Application
    Filed: October 13, 2023
    Publication date: January 9, 2025
    Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
  • Publication number: 20250010408
    Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material, which includes aluminum (Al), copper (Cu), and a second active metal element, but does not contain silver. Based on a total weight of the second metal composite material being 100 parts by weight, an aluminum content is not less than 40 parts by weight.
    Type: Application
    Filed: October 12, 2023
    Publication date: January 9, 2025
    Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
  • Patent number: 12191146
    Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: January 7, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yung-Yao Lee, Chen Yi Hsu, Wei-Hsiang Tseng
  • Publication number: 20250006531
    Abstract: A gas curtain device for a front opening unified pod has a casing. The casing has an interior space. The interior space defines a transverse gas space, a curved gas space and a vertical gas space. At least one first gas guide plate is disposed in the transverse gas space and/or the curved gas space. The first gas guide plate has a plurality of first gas guide holes. A second gas guide plate is disposed at one end of the vertical gas space. The second gas guide plate has a plurality of second gas guide holes.
    Type: Application
    Filed: August 18, 2022
    Publication date: January 2, 2025
    Inventors: JIN-BOR CHEN, TSAN-HUA HUANG, SHUN-YI HSU, TZU-HUNG HSU
  • Publication number: 20250006530
    Abstract: A gas curtain device for a front opening unified pod has a casing. At least one first gas guide plate is disposed in the casing. The first gas guide plate has a first gas guide region. The first gas guide region has a plurality of first gas guide holes. A second gas guide plate is disposed at a distal end of the casing. The second gas guide plate has a second gas guide region. The second gas guide region has a plurality of second gas guide holes. The area of the first gas guide region is less than the area of the second gas guide region. The number of the second gas guide holes is greater than the number of the first gas guide holes. The total area of the second gas guide holes is greater than the total area of the first gas guide holes.
    Type: Application
    Filed: November 8, 2022
    Publication date: January 2, 2025
    Inventors: JIN-BOR CHEN, TSAN-HUA HUANG, SHUN-YI HSU, TZU-HUNG HSU
  • Patent number: 12179193
    Abstract: A planar volumetric device for quantifying and handling a body fluid sample is provided. The device has a planar main body, a body fluid sample flow path, an air pump and an air passage. The planar main body includes a first planar surface and a second planar surface. The body fluid sample flow path is disposed in the main body, and has a body fluid sample inlet, a middle junction and a body fluid sample outlet, wherein the middle junction and the body fluid sample outlet define therebetween a specific path segment, by which it is possible to externally observe to which extent the body fluid sample has filled up with the path segment. The air pump is configured to provide an operating air pressure. The air passage has a first end and a second end, wherein the first and the second ends are connected to the air pump and the middle junction respectively, and the specific path segment has a constant volume.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: December 31, 2024
    Assignee: TAI-SAW Technology Co., Ltd.
    Inventors: Yi-Qi Huang, Wei-Yi Hsu, Pei-Tzu Hung, Szu-Heng Liu, Yu-Tung Huang
  • Publication number: 20240395582
    Abstract: A method of controlling a feedback control system of a semiconductor process chemical fluid in a storage tank includes performing a fluid quality measurement of fluid by a spectrum analyzer positioned adjacent to a dispensing port of the storage tank, and determining whether a variation in fluid quality measurement of the fluid is within an acceptable range. The method further includes in response to a variation in fluid quality measurement that is not within the acceptable range of variation in fluid quality measurement, automatically adjusting a configurable parameter of the semiconductor process chemical fluid in the storage tank to set the variation in fluid quality measurement of the fluid within the acceptable range.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yang LIN, Cheng-Han WU, Chen-Yu LIU, Kuo-Shu TSENG, Shang-Sheng LI, Chen Yi HSU, Yu-Cheng CHANG
  • Publication number: 20240387979
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu
  • Publication number: 20240389213
    Abstract: A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yang LIN, Yu-Cheng CHANG, Cheng-Han WU, Shang-Sheng LI, Chen-Yu LIU, Chen Yi HSU
  • Publication number: 20240379841
    Abstract: A semiconductor device includes a first well region having the first conductivity type and a second well region having the second conductivity type formed in a substrate having the first conductivity type. An isolation component and a third well region are formed in the second well region. The third well region has the first conductivity type and is in contact with the bottom surface of the isolation component. A first doping region is formed in the first well region and a second doping region is formed in the second well region. The first and second doping regions have the second conductivity type and are disposed at opposite sides of the gate structure. The interface between the first well region and the second well region is positioned between the isolation component and the first doping region. The interface is separated from the third well region by a lateral distance.
    Type: Application
    Filed: May 8, 2023
    Publication date: November 14, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Tse-Hsiao LIU, Po-Hao CHIU, Nai-Lun CHENG, Pi-Kuang CHUANG, Chih-Hung LIN, Ching-Yi HSU
  • Publication number: 20240373243
    Abstract: A wireless communication device configured to operate with a first wireless communication protocol and a second wireless communication protocol and a method for performing coexistence control based on adaptive threshold adjustment in the wireless communication device are provided. The method may include: performing wireless communication operations with the first wireless communication protocol and the second wireless communication protocol concurrently; comparing a current throughput with a throughput threshold; in response to the current throughput being less than the throughput threshold, comparing a received signal strength indicator (RSSI), in communication using the second wireless communication protocol, with a signal strength threshold to generate at least one comparison result; and selectively sending a null frame according to the at least one comparison result, in order to temporarily avoid communication using the second wireless communication protocol.
    Type: Application
    Filed: May 2, 2024
    Publication date: November 7, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chang-Yi Hsu, Yu-Ming Wen, Po-Hsun Huang, Li-Tien Chang, Chia-Ming Chang
  • Patent number: D1054384
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: December 17, 2024
    Assignee: TELEBOX INDUSTRIES CORP.
    Inventors: Fu-Wen Wu, Ching-Yi Hsu, Hung Yu Wu
  • Patent number: D1060456
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: February 4, 2025
    Inventor: Roger Wen Yi Hsu