Patents by Inventor Yi-Hsuan Su

Yi-Hsuan Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230085052
    Abstract: Methods of, inter alia, detecting the presence of one or more analytes in one or more query samples include providing one or more sensor that each include biomolecules disposed on a functionalized surface of one or more giant magnetoresistance (GMR) sensors. Modes of operation remove or add magnetic beads from the vicinity of sensor surfaces by interactions with the biomolecules. The methods feature, inter alia, detecting the presence of one or more analytes in one or more query samples by measuring magnetoresistance change of the one or more GMR sensors based on determining magnetoresistance before and after passing magnetic particles over the one or more sensors.
    Type: Application
    Filed: January 17, 2020
    Publication date: March 16, 2023
    Inventors: Todd Michael KLEIN, Wei WANG, Yi-Hsuan SU, Gemma MENDONSA, Ian STUYVENBERG
  • Publication number: 20220307078
    Abstract: Methods of detecting one or more genetic variants, including allelic variants, in one or more query samples include providing one or more sensors that each include capture nucleic acids disposed on a functionalized surface of one or more giant magnetoresistance (GMR) sensors. The methods detect the presence of one or more analytes in one or more query samples by measuring magnetoresistance change of the one or more GMR sensors based on determining magnetoresistance before and after passing magnetic particles over the one or more sensors.
    Type: Application
    Filed: January 22, 2020
    Publication date: September 29, 2022
    Inventors: Matthew NELSON, Yi-Hsuan SU, Jung Min SONG, Vicci L. KORMAN, Todd Michael KLEIN, Wei WANG, Ian STUYVENBERG, Gemma Roselle MENDONSA
  • Patent number: 11339417
    Abstract: Systems, methods, and devices are described herein for identifying, monitoring, isolating, or selecting a cell having a predefined characteristic in a mixed population of cells utilizing a combination of any one or more of iDEP, a region of localized field enhancement, a variable frequency electric field, a wide bandwidth amplifier, and/or an imaging apparatus.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: May 24, 2022
    Assignee: University of Virginia Patent Foundation
    Inventors: Nathan Swami, Yi-Hsuan Su, Cirle Alcantara Warren, Ali Rohani, Vahid Farmehini
  • Publication number: 20210131989
    Abstract: Methods of detecting the presence of an analyte in a query sample include providing a sensor that includes biomolecules disposed on a polymer-coated surface of a giant magnetoresistance (GMR) sensor. Modes of operation remove or add magnetic beads from the vicinity of the sensor surface by interactions with the biomolecules. The methods feature detecting the presence of the analyte in the query sample by measuring resistance change of the GMR sensor based on determining resistance before and after passing magnetic particles over the sensor.
    Type: Application
    Filed: July 26, 2019
    Publication date: May 6, 2021
    Inventors: Todd Michael KLEIN, Wei WANG, Yi-Hsuan SU, Ian STUYVENBERG, Gemma Roselle MENDONSA
  • Publication number: 20170218424
    Abstract: Systems, methods, and devices are described herein for identifying, monitoring, isolating, or selecting a cell having a predefined characteristic in a mixed population of cells utilizing a combination of any one or more of iDEP, a region of localized field enhancement, a variable frequency electric field, a wide bandwidth amplifier, and/or an imaging apparatus.
    Type: Application
    Filed: October 9, 2015
    Publication date: August 3, 2017
    Inventors: Nathan Swami, Yi-Hsuan Su, Cirle Alcantara Warren, Ali Rohani, Vahid Farmehini
  • Patent number: 7701056
    Abstract: A redistribution connecting structure for solder balls is disclosed. A substrate includes a plurality of bonding pads. A plurality of dielectric layers, a redistribution conductive layer between the dielectric layer, and a plurality of solder balls are formed on the substrate. The redistribution layer has a redistribution pad disposed adjacent to one of the bonding pads without electrical connection with the redistribution pad. One of the dielectric layers covering the redistribution conductive layer has an opening to partially expose the redistribution pad, in which the opening is approximately circular and has a cut-off portion so that the opening is adjacent to an opening of another of the dielectric layers exposing one of the bonding pads without overlapping. Accordingly, bonding area of the redistribution pad for a bonding pad under one of the solder balls can be expanded to reduce stress effect.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: April 20, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Yi-Hsuan Su
  • Publication number: 20070200239
    Abstract: A redistribution connecting structure for solder balls is disclosed. A substrate includes a plurality of bonding pads. A plurality of dielectric layers, a redistribution conductive layer between the dielectric layer, and a plurality of solder balls are formed on the substrate. The redistribution layer has a redistribution pad disposed adjacent to one of the bonding pads without electrical connection with the redistribution pad. One of the dielectric layers covering the redistribution conductive layer has an opening to partially expose the redistribution pad, in which the opening is approximately circular and has a cut-off portion so that the opening is adjacent to an opening of another of the dielectric layers exposing one of the bonding pads without overlapping. Accordingly, bonding area of the redistribution pad for a bonding pad under one of the solder balls can be expanded to reduce stress effect.
    Type: Application
    Filed: December 13, 2006
    Publication date: August 30, 2007
    Inventor: Yi-Hsuan Su