Abstract: A planar piezoelectric vibration module includes an insulating bottom layer, a conductive layer, a piezoelectric assembly, and an insulating filling layer. The conductive layer is arranged on the insulating bottom layer and includes two conductive patterns that are insulated. The piezoelectric assembly is arranged on the conductive layer and includes a piezoelectric material layer, a first electrode including a first inner interdigital portion, a second electrode including a second inner interdigital portion, and an encapsulating material, where the first inner interdigital portion and the second inner interdigital portion penetrate through the piezoelectric material layer in a mutual interdigital arrangement manner, and the first electrode and the second electrode are electrically connected to the two conductive patterns, respectively. The insulating filling layer is arranged on the conductive layer and around the piezoelectric assembly.

Abstract: A manufacturing method of a plane piezoelectric vibration module includes: providing a piezoelectric element having a first side and a second side that are opposite; providing a substrate including an insulating bottom layer and an electrode layer, wherein the electrode layer includes a first conduction region, a second conduction region and a patterned insulating groove; disposing an adhesive layer on the electrode layer; disposing the first side of the piezoelectric element on the first conduction region via the adhesive layer, wherein the adhesive layer covers a part of the piezoelectric element; electrically connecting the second side of the piezoelectric element and the second conduction region by using a conduction structure; disposing a protection structure on the electrode layer to cover the piezoelectric element, the adhesive layer and the conduction structure; and finally, applying an electric field to the piezoelectric element to conduct a polarization process on a piezoelectric material layer.