Patents by Inventor Yi-Hua Ho

Yi-Hua Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7271474
    Abstract: The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: September 18, 2007
    Assignee: C-One Technology Corp.
    Inventors: Gordon Yu, Hung-Tse Ho, Yi-Hua Ho, Ming-Che Chang
  • Publication number: 20060118930
    Abstract: The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.
    Type: Application
    Filed: April 22, 2005
    Publication date: June 8, 2006
    Applicant: C-One Technology Corporation
    Inventors: Gordon Yu, Hung-Tse Ho, Yi-Hua Ho, Ming-Che Chang
  • Publication number: 20060118640
    Abstract: The present invention provides an integrated circuit chip with flash memory and identification function, which comprises a base, a body, at least one flash memory die, and a codeless die. The flash memory die and the codeless die are disposed on the base and packaged in the same body, such that the integrated circuit chip is equipped with the flash memory and personal identification function. Further, the integrated circuit chip can connect to a die controling chip for providing the function of data access and data security. That is, when the identification code stored in the codeless die matches the identification data included in the received wireless signal, the die controling chip allows the flash memory die to process data access.
    Type: Application
    Filed: April 20, 2005
    Publication date: June 8, 2006
    Applicant: C-One Technology Corporation
    Inventors: Gordon Yu, Hung-Tse Ho, Yi-Hua Ho, Ching-Lung Wu