Abstract: The present disclosure provides a method. In some embodiments, the method includes forming a first porogen over a dielectric film; depositing a first dielectric monolayer over the first porogen and in contact with the dielectric film; removing the first porogen. In some embodiments, the method includes forming a first porogen over a substrate; forming a first dielectric film over the first porogen; after forming the first dielectric film, performing an UV treatment on the first porogen.

Abstract: The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.

Abstract: The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.

Abstract: The present invention provides an integrated circuit chip with flash memory and identification function, which comprises a base, a body, at least one flash memory die, and a codeless die. The flash memory die and the codeless die are disposed on the base and packaged in the same body, such that the integrated circuit chip is equipped with the flash memory and personal identification function. Further, the integrated circuit chip can connect to a die controling chip for providing the function of data access and data security. That is, when the identification code stored in the codeless die matches the identification data included in the received wireless signal, the die controling chip allows the flash memory die to process data access.