Abstract: A method for determining a consistency coefficient of a power-law cement grout includes: determining a water-cement ratio of the power-law cement grout; according to engineering practice requirements, determining a time required to determine the consistency coefficient of the power-law cement grout; and obtaining the consistency coefficient of the power-law cement grout. The method is accurate and reliable, requires less calculation, etc.; and has very high practical value and popularization value in environmental protection and ecological restoration.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A method for determining a three-dimensional tortuosity of a loose and broken rock-soil mass, includes the following steps: a particle grading curve of the loose and broken rock-soil mass is obtained by utilizing a particle size analysis, and followed by calculating an equivalent particle size and an average particle size; a porosity of the loose and broken rock-soil mass is obtained by utilizing a moisture content test, a density test, and a specific gravity test; the three-dimensional tortuosity of the loose and broken rock-soil mass is obtained by utilizing the equivalent particle size, the average particle size and the porosity of the loose and broken rock-soil mass. The method has the advantages of simple logic, accuracy and reliability, simple and fast parameter determination, and has high practical value and promotion value in the field of environmental protection and ecological restoration technology.

Abstract: Various embodiments herein relate to methods, apparatus, and systems for forming an interconnect structure, or a portion thereof, on a substrate. In one example, the method includes receiving the substrate in a processing chamber, the substrate having dielectric material exposed within recessed features formed therein; exposing the substrate to plasma to thereby modify a top surface of the dielectric material; forming a metal oxide barrier layer on the modified top surface of the dielectric material, wherein the metal oxide barrier layer is formed through atomic layer deposition and/or chemical vapor deposition. In certain implementations, one or more additional step may be taken to improve processing results, for example to promote nucleation and/or adhesion of relevant layers.

Abstract: Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.

Abstract: Various embodiments relate to methods, apparatus, and systems for forming an interconnect structure, or a portion thereof. The method may include contacting the substrate with a functionalization bath comprising a first solvent and a functionalization reactant to form a modified first material, and then depositing a second material on the modified first material through electroless plating, electroplating, chemical vapor deposition, or atomic layer deposition. The first material may be a dielectric material, a barrier layer, or a liner, and the second material may be a barrier layer or a barrier layer precursor, a liner, a seed layer, or a conductive metal that forms the interconnect of the interconnect structure, according to various embodiments.

Abstract: Void-free bottom-up fill of copper in features is achieved on non-copper liner layers. A non-copper liner layer has a higher resistivity than copper. An electroplating solution for plating copper on a non-copper liner layer includes a low copper concentration, high pH, organic additives, and bromide ions as a copper complexing agent. The high pH and the bromide ions do not interfere with the activity of the organic additives. In some implementations, the concentration of copper ions is between about 0.2 g/L and about 10 g/L, a concentration of sulfuric acid is between about 0.1 g/L and about 10 g/L, and a concentration of the bromide ions is between about 20 mg/L and about 240 mg/L. In some implementations, the electroplating solution further includes chloride ions as an additional copper complexing agent at a concentration between about 0.1 mg/L and about 100 mg/L.

Abstract: Embodiments of three-dimensional (3D) memory devices having source contact structure in a memory stack are disclosed. The 3D memory device has a memory stack that includes a plurality of interleaved conductor layers and insulating layers extending over a substrate, a plurality of channel structures each extending vertically through the memory stack into the substrate, and a source contact structure extending vertically through the memory stack and extending laterally to separate the memory stack into a first portion and a second portion. The source contact structure may include a plurality of source contacts each electrically coupled to a common source of the plurality of channel structures.

Abstract: Embodiments of three-dimensional (3D) memory devices having source contact structure in a memory stack are disclosed. The 3D memory device has a memory stack that includes a plurality of interleaved conductor layers and insulating layers extending over a substrate, a plurality of channel structures each extending vertically through the memory stack into the substrate, and a source contact structure extending vertically through the memory stack and extending laterally to separate the memory stack into a first portion and a second portion. The source contact structure may include a plurality of source contacts each electrically coupled to a common source of the plurality of channel structures.

Abstract: A smart charging method is provided. The smart charging method includes the following steps: A battery is charged under a constant charging current. Whether a measured voltage is higher than a predetermined voltage value is determined. If the measured voltage is higher than the predetermined voltage value, then the constant charging current is increased.

Abstract: The present disclosure provides a method for charging a battery. The method receives a plurality of battery parameters during the period of the battery charging, and the plurality of battery parameters are turned into fuzzification and corresponded to fuzzy rules to map out a fuzzy output. Then the fuzzy output is turned into defuzzification to obtain the value of the charging current. Therefore, the present disclosure can change the charging current adaptively to enhance the charging effect.

Abstract: The present disclosure provides a method for charging a battery. The method receives a plurality of battery parameters during the period of the battery charging, and the plurality of battery parameters are turned into fuzzification and corresponded to fuzzy rules to map out a fuzzy output. Then the fuzzy output is turned into defuzzification to obtain the value of the charging current. Therefore, the present disclosure can change the charging current adaptively to enhance the charging effect.

Abstract: A holding fixture includes a first part, a securing member and a second part. The first part includes a first end face and a sleeve extending from the first end face, the sleeve defines a plurality of radial through holes each receiving a ball therein, and each ball has a diameter larger than the wall thickness of the sleeve therein. The securing member located around the sleeve includes a plurality of protrusions configured on an inner wall thereof, with every two neighboring protrusions defining a notch therebetween. The second part includes a body and a tail fixed on the body, with seating thereof in the sleeve enabled by an annular groove in the periphery thereof. The protrusions guide the balls into the annular groove to secure the second part on the first part.

Abstract: A stamping die (20) includes a base set (21), a punch (241, 242, 243, 244, 245) detachably assembled on the base set, and a stripper plate (23) disposed on top of the base set. The stripper plate defines a through hole (231) through which the punch passes, and at least one elastic member (28) is disposed between the base set and the stripper plate. The stamping die can punch different shaped holes by means of changing the punch.

Abstract: A punching assembly includes a die base, a sleeve, an adjusting screw, a pull portion, a latching block, an elastic element, a fixing ring and a stop member. A top of the die base is received in the sleeve. The adjusting screw includes a contact end, a mounted end inserting into the sleeve and connecting to the top of the die base, and a latching portion located between the contact end and the mounted end. The pull portion is disposed around the sleeve. The latching block engages the latching portion. The elastic element is disposed around the adjusting screw, supporting the latching block. The fixing ring surrounding the adjusting screw is fixed on the sleeve. The stop member, contiguous with the fixing ring, prevents axial movement of the adjusting screw.

Abstract: A curling die tool includes an upper die, a transmission, and a lower die. The upper die includes an upper-die body and a warping-bending pressure portion for a workpiece. The warping-bending pressure portion includes a punch member and is secured to the upper-die body. The transmission member includes a first supporting body corresponding to the punch member supporting the workpiece, along with a curling pressure portion. The transmission member defines a first supporting groove facing the upper die receiving the first supporting body, along with a curling-pressure-portion receiving groove opposite to the first supporting groove receiving the curling pressure portion. The lower die includes a second supporting body facing the curling pressure portion, supporting the workpiece, and defining a guiding groove and a second supporting groove receiving the second supporting body. The transmission member is movably connected to the lower die and slides along the guiding groove.

Abstract: A stamping die (20) includes a base set (21), a punch (241, 242, 243, 244, 245) detachably assembled on the base set, and a stripper plate (23) disposed on top of the base set. The stripper plate defines a through hole (231) through which the punch passes, and at least one elastic member (28) is disposed between the base set and the stripper plate. The stamping die can punch different shaped holes by means of changing the punch.

Abstract: A curling die tool includes an upper die, a transmission, and a lower die. The upper die includes an upper-die body and a warping-bending pressure portion for a workpiece. The warping-bending pressure portion includes a punch member and is secured to the upper-die body. The transmission member includes a first supporting body corresponding to the punch member supporting the workpiece, along with a curling pressure portion. The transmission member defines a first supporting groove facing the upper die receiving the first supporting body, along with a curling-pressure-portion receiving groove opposite to the first supporting groove receiving the curling pressure portion. The lower die includes a second supporting body facing the curling pressure portion, supporting the workpiece, and defining a guiding groove and a second supporting groove receiving the second supporting body. The transmission member is movably connected to the lower die and slides along the guiding groove.

Abstract: A bending die includes an upper die base fixing a punch, a lower die base, a stripping block, a bending block and a gasket assembly. The stripping block is on the lower die base and under the punch and can elastically move relative to the lower die base. The bending block includes a first sidewall and a second sidewall, wherein the first sidewall is contiguous with the stripping block and the second sidewall is connected to the lower die base via screws. The gasket assembly between the second sidewall and the lower die base provides adjustment of clearance of the bending die.

Abstract: A holding fixture includes a first part, a securing member and a second part. The first part includes a first end face and a sleeve extending from the first end face, the sleeve defines a plurality of radial through holes each receiving a ball therein, and each ball has a diameter larger than the wall thickness of the sleeve therein. The securing member located around the sleeve includes a plurality of protrusions configured on an inner wall thereof, with every two neighboring protrusions defining a notch therebetween. The second part includes a body and a tail fixed on the body, with seating thereof in the sleeve enabled by an annular groove in the periphery thereof. The protrusions guide the balls into the annular groove to secure the second part on the first part.