Abstract: An active alignment machine includes a base, a first pillar, a second pillar, a distribution module, a first alignment module, a second alignment module and a third alignment module. The first pillar has a first pillar top surface. The second pillar has a second pillar top surface. The first pillar top surface and the second pillar top surface cooperatively support plural assembling specifications. The distribution module is installed on the base and arranged between the first pillar and the second pillar. The first alignment module, the second alignment module and third alignment module are replaceable to be assembled with or dissembled from the first pillar top surface and the second pillar top surface. The first alignment module, the second alignment module and third alignment module work with the distribution module to perform the active alignment on a first-type product, a second-type product and a third-type product, respectively.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.

Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.

Abstract: An approach for managing data set access based on data set relevance. The approach monitors data set access activities associated with a user. The approach detects access of a first data set by the user. The approach determines a group of data sets associated with the first data set based on a data set mapping associated with the user. The approach recalls one or more data sets of the group of data sets from a slower storage device to a faster storage device.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.

Abstract: An optical detection device includes a base, a cartridge placing portion, a shield cover, a processor, and an optical sensor. The base includes an opening. The cartridge placing portion is located in the base, and is in communication with the opening. The shield cover is configured to open or close the opening. When the optical sensor is actuated, the shield cover closes the opening to prevent external ambient light from entering the opening to affect the optical sensor during sensing.

Abstract: A non-volatile memory structure including a substrate, a plurality of charge storage layers, a first dielectric layer, and a control gate is provided. The charge storage layers are located on the substrate. An opening is provided between two adjacent charge storage layers. The first dielectric layer is located on the charge storage layers and on a surface of the opening. A bottom cross-sectional profile of the first dielectric layer located in the opening is a profile that is recessed on both sides. The control gate is located on the first dielectric layer and fills the opening.

Abstract: A non-volatile memory structure including a substrate, a plurality of charge storage layers, a first dielectric layer, and a control gate is provided. The charge storage layers are located on the substrate. An opening is provided between two adjacent charge storage layers. The first dielectric layer is located on the charge storage layers and on a surface of the opening. A bottom cross-sectional profile of the first dielectric layer located in the opening is a profile that is recessed on both sides. The control gate is located on the first dielectric layer and fills the opening.

Abstract: A method is provided for fabricating a diol containing a bis-cycloaliphate. The diol is hydrogenated with hydrogen and a catalyst. Therein, the diol has a bis-aromatic. The catalyst comprises an active metal and a catalyst carrier. The active metal is a VIII-B-group transition element. The catalyst carrier is an oxide of IV-B-group element. Thus, the diol containing the bis-cycloaliphate is generated.

Abstract: The present invention discloses a process for making alicyclic polycarboxylic acids or their derivatives, referring to a process for hydrogenating aromatic polycarboxylic acids or their derivatives in the presence of hydrogen and a catalyst to form alicyclic polycarboxylic acids or their derivatives, and the catalyst comprises at least one active metal of group VIIIB transition elements of the periodic table of elements, and a catalyst support comprising group IIA and group IIIA elements in a specific weight ratio.

Abstract: The present invention discloses a process for making alicyclic polycarboxylic acids or their derivatives, referring to a process for hydrogenating aromatic polycarboxylic acids or their derivatives in the presence of hydrogen and a catalyst to form alicyclic polycarboxylic acids or their derivatives, and the catalyst comprises at least one active metal of group VIIIB transition elements of the periodic table of elements, and a catalyst support comprising group IIA and group IIIA elements in a specific weight ratio.

Abstract: This invention discloses the process for hydrogenation of aromatic polycarboxylic acids or derivatives thereof, hydrogenation of aromatic polycarboxylic acids or derivatives thereof can be achieved in the present of the catalyst, which consist at least one metal of the eighth transition group of the Periodic Table as the active metal while group IIA and group IVA elements are included as the catalyst support.

Abstract: Semiconductor devices and manufacturing method thereof are disclosed. The semiconductor device includes a substrate, a device layer, first and second conductive layers, first and second vias, and a MIM capacitor structure. The substrate includes active and passive regions. The device layer is in the active region. The first conductive layer is over the device layer. The second conductive layer is over the first conductive layer, wherein the first conductive layer is disposed between the device layer and the second conductive layer. The first via electrically connects the first and the second conductive layers. The MIM capacitor structure is between the first and the second conductive layers and in the passive region, and includes first and second electrodes and a capacitor dielectric layer therebetween. The capacitor dielectric layer includes Group IIIA-metal oxide or nitride. The second via electrically connects the second conductive layer and one of the first and second electrodes.

Abstract: An intelligent control faucet includes a faucet that includes a manual operation valve, an intelligent control module, a water egress tube, a cold water ingress tube, a hot water ingress tube, and a magnetic reed detection device. The water egress tube, the cold water ingress tube, and the hot water ingress tube are connected to the manual operation valve. The intelligent control module is connected, in a series manner, to the water egress tube. The magnetic reed detection device is mounted to the water egress tube and is connected through a feeding cable or directly to the intelligent control module. Water flow can be established or cut off through pulling the water egress tube so that the use is made easy.

Abstract: Semiconductor devices and manufacturing method thereof are disclosed. The semiconductor device includes a substrate, a device layer, first and second conductive layers, first and second vias, and a MIM capacitor structure. The substrate includes active and passive regions. The device layer is in the active region. The first conductive layer is over the device layer. The second conductive layer is over the first conductive layer, wherein the first conductive layer is disposed between the device layer and the second conductive layer. The first via electrically connects the first and the second conductive layers. The MIM capacitor structure is between the first and the second conductive layers and in the passive region, and includes first and second electrodes and a capacitor dielectric layer therebetween. The capacitor dielectric layer includes Group IIIA-metal oxide or nitride. The second via electrically connects the second conductive layer and one of the first and second electrodes.

Abstract: An intelligent control faucet includes a faucet that includes a manual operation valve, an intelligent control module, a water egress tube, a cold water ingress tube, a hot water ingress tube, and a magnetic reed detection device. The water egress tube, the cold water ingress tube, and the hot water ingress tube are connected to the manual operation valve. The intelligent control module is connected, in a series manner, to the water egress tube. The magnetic reed detection device is mounted to the water egress tube and is connected through a feeding cable or directly to the intelligent control module. Water flow can be established or cut off through pulling the water egress tube so that the use is made easy.

Abstract: An intelligent control faucet includes a faucet that includes a manual operation valve, an intelligent control module, a water egress tube, a cold water ingress tube, a hot water ingress tube, and a magnetic reed detection device. The water egress tube, the cold water ingress tube, and the hot water ingress tube are connected to the manual operation valve. The intelligent control module is connected, in a series manner, to the water egress tube. The magnetic reed detection device is mounted to the water egress tube and is connected through a feeding cable or directly to the intelligent control module. Water flow can be established or cut off through pulling the water egress tube so that the use is made easy.

Abstract: An intelligent control faucet includes a faucet that includes a manual operation valve, an intelligent control module, a water egress tube, a cold water ingress tube, a hot water ingress tube, and a magnetic reed detection device. The water egress tube, the cold water ingress tube, and the hot water ingress tube are connected to the manual operation valve. The intelligent control module is connected, in a series manner, to the water egress tube. The magnetic reed detection device is mounted to the water egress tube and is connected through a feeding cable or directly to the intelligent control module. Water flow can be established or cut off through pulling the water egress tube so that the use is made easy.

Abstract: A method and a system for preserving privacy of a dataset are provided. In the method, a k-anonymity value with respect to a sensitive data field is determined according to at least one first quasi-identifier. Data entries in each group have the same value in the one or more fields of the first quasi-identifier and data entries in different groups have different values in the one or more fields of the first quasi-identifier. A first group and a second group among the plurality of groups are determined according to the reference number Kr, where the first group and the second group are merged into a merging group. The number of data entries in the merging group is not less than a reference number Kr. One or more fields of at least one first quasi-identifier is masked for the merging group.