Patents by Inventor Yi Hui Chen

Yi Hui Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10757310
    Abstract: A miniature image pickup module and a manufacturing method are provided. The manufacturing method includes the following steps. In a step (a), a substrate with two vertical conductor lines is provided. In a step (b), a photosensitive element is provided. The photosensitive element is fixed on the substrate. The two vertical conductor lines are penetrated through two openings of the photosensitive element. Moreover, first ends of the vertical conductor lines are located away from the substrate and partially exposed to a top surface of the photosensitive element. In a step (c), the first ends of the vertical conductor lines are electrically connected with the corresponding bonding pads. In a step (d), a lens module is fixed on the substrate to cover a top side of the photosensitive element, so that the miniature image pickup module is manufactured.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: August 25, 2020
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Ching-Hui Chang, Sheng-Hsiang Chiu, Yi-Hou Chen
  • Patent number: 10752014
    Abstract: A thermal print head structure includes a fixed electrode layer, a movable electrode layer opposite to the fixed electrode layer, a protection layer group covering the fixed electrode layer and the movable electrode layer, a heat source used to heat the fixed electrode layer, and a number of spacers. The fixed electrode layer includes a fixed electrode line. The movable electrode layer includes a flexible electrode line which is intersected with the fixed electrode line. These spacers are located between the fixed electrode layer and the protection layer group such that gaps are defined between the fixed electrode layer and the protection layer group. When a potential difference is generated between the fixed electrode line and the flexible electrode line, the movable electrode layer contacts the fixed electrode layer through the gap.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: August 25, 2020
    Assignee: Chien Hwa Coating Technology, Inc.
    Inventors: Ming-Jia Li, Chih-Hui Liu, Yi-Wei Lin, Chun-Chen Chen
  • Publication number: 20200262779
    Abstract: The present invention discloses a process for making alicyclic polycarboxylic acids or their derivatives, referring to a process for hydrogenating aromatic polycarboxylic acids or their derivatives in the presence of hydrogen and a catalyst to form alicyclic polycarboxylic acids or their derivatives, and the catalyst comprises at least one active metal of group VIIIB transition elements of the periodic table of elements, and a catalyst support comprising group IIA and group IIIA elements in a specific weight ratio.
    Type: Application
    Filed: March 14, 2019
    Publication date: August 20, 2020
    Inventors: Ching-Fa Chi, Ying-Chien Yang, Yi-Hui Chen, Yih-Ping Wang, Chyi-Liuh Ho
  • Patent number: 10730822
    Abstract: The present invention discloses a process for making alicyclic polycarboxylic acids or their derivatives, referring to a process for hydrogenating aromatic polycarboxylic acids or their derivatives in the presence of hydrogen and a catalyst to form alicyclic polycarboxylic acids or their derivatives, and the catalyst comprises at least one active metal of group VIIIB transition elements of the periodic table of elements, and a catalyst support comprising group IIA and group IIIA elements in a specific weight ratio.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: August 4, 2020
    Assignee: CPC CORPORATION, TAIWAN
    Inventors: Ching-Fa Chi, Ying-Chien Yang, Yi-Hui Chen, Yih-Ping Wang, Chyi-Liuh Ho
  • Patent number: 10714384
    Abstract: A semiconductor device includes an integrated circuit and a guard ring. The integrated circuit includes a first circuit and a second circuit separated from the first circuit. The guard ring is disposed around the first circuit and between the first circuit and the second circuit. The guard ring includes an outer ring, an inner ring, and two connectors. The outer ring is disposed around the first circuit and has a first gap. The inner ring is disposed between the outer ring and the first circuit and has a second gap. The two connectors connect the outer ring and the inner ring. The outer ring, the inner ring, and the two connectors form a closed loop.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: July 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Ming-Hui Yang, Chun-Ting Liao, Chen-Yuan Chen, Ho-Chun Liou, Yi-Te Chen
  • Patent number: 10700001
    Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho, Yi-Wen Wu, Ching-Hui Chen, Kuo-Chio Liu
  • Publication number: 20200180327
    Abstract: The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.
    Type: Application
    Filed: January 10, 2019
    Publication date: June 11, 2020
    Inventors: CHIH-HUI LIU, YI-WEI LIN, CHUN-CHEN CHEN
  • Patent number: 10675888
    Abstract: The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 9, 2020
    Assignee: Chien Hwa Coating Technology, Inc.
    Inventors: Chih-Hui Liu, Yi-Wei Lin, Chun-Chen Chen
  • Publication number: 20200161518
    Abstract: A light-emitting diode package including a carrier structure, a patterned conductive layer, at least one chip, a dielectric layer, at least one first conductive via, a build-up circuit structure, and at least one light-emitting diode is provided. The patterned conductive layer is disposed on the carrier structure. The chip is disposed on the carrier structure. The dielectric layer is disposed on the carrier structure and encapsulates the chip and the patterned conductive layer. The first conductive via penetrates the dielectric layer and is electrically connected to the patterned conductive layer. The build-up circuit structure is disposed on the dielectric layer and electrically connected to the first conductive via. The light-emitting diode is disposed on the build-up circuit structure.
    Type: Application
    Filed: February 21, 2019
    Publication date: May 21, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Yi-Cheng Lin, Yu-Hua Chen, Chun-Hsien Chien, Chien-Chou Chen, Cheng-Hui Wu
  • Patent number: 10653735
    Abstract: Use of Mesembryanthemum crystallinum L. callus extract in the manufacture of a medicament or a skin care product, wherein the medicament or skin care product is for at least one of delaying skin cell aging, nursing skin, repairing skin, treating skin cancer, and preventing skin cancer.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: May 19, 2020
    Assignee: TCI CO., LTD.
    Inventors: Yung-Hsiang Lin, Wei-Wen Kuo, I-Hui Chen, Yi-Chun Chen, Hui-Hsin Shih, Yun-Ching Tsai
  • Patent number: 10638784
    Abstract: The present invention provides a pharmaceutical composition and a food product for inhibiting gastritis induced by gastric Helicobacter pylori, comprising Lactobacillus selected from a group composed of Lactobacillus rhamnosus GM-020 (also known as GMNL-74) with deposited number CCTCC M203098; Lactobacillus acidophilus GMNL-185 with deposited number CCTCC M2017764; and Lactobacillus plantarum GMNL-662 with deposited number CCTCC M2016571; and any two of the above bacteria.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 5, 2020
    Assignee: GENMONT BIOTECH INCORPORATION
    Inventors: Yi-Hsing Chen, Wan-Hua Tsai, Ya-Hui Chen, Chih-Ho Lai, Yu-Hsin Lin
  • Patent number: 10640447
    Abstract: This invention discloses the process for hydrogenation of aromatic polycarboxylic acids or derivatives thereof, hydrogenation of aromatic polycarboxylic acids or derivatives thereof can be achieved in the present of the catalyst, which consist at least one metal of the eighth transition group of the Periodic Table as the active metal while group IIA and group IVA elements are included as the catalyst support.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: May 5, 2020
    Assignee: CPC CORPORATION, TAIWAN
    Inventors: Ching-Fa Chi, Ying-Chien Yang, Yi-Hui Chen, Jeng-Fan Leu, Shiann-Horng Chen, Yih-Ping Wang, Chyi-Liuh Ho
  • Publication number: 20200106159
    Abstract: An antenna structure of reduced size but able to cover first, second, and third LTE-A bands together with WI-FI and BLUETOOTH frequencies includes a metal frame defining at least two gaps. The gaps extend and pass completely through the metal frame, and divide the metal frame into radiating portions. At least one feeding portion is electrically coupled to each radiating portion. Each radiating portion can simultaneously activate first, second, and third operating modes for the radiation of signals in first, second, and third frequency bands.
    Type: Application
    Filed: September 11, 2019
    Publication date: April 2, 2020
    Inventors: CHO-KANG HSU, MIN-HUI HO, YI-TING CHEN, YEN-JUNG TSENG
  • Publication number: 20200105622
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.
    Type: Application
    Filed: July 30, 2019
    Publication date: April 2, 2020
    Inventors: Hsing-Hui Hsu, Po-Nien Chen, Yi-Hsuan Chung, Bo-Shiuan Shie, Chih-Yung Lin
  • Publication number: 20200098517
    Abstract: Various embodiments of the present disclosure are directed towards a piezoelectric metal-insulator-metal (MIM) device including a piezoelectric structure between a top electrode and a bottom electrode. The piezoelectric layer includes a top region overlying a bottom region. Outer sidewalls of the bottom region extend past outer sidewalls of the top region. The outer sidewalls of the top region are aligned with outer sidewalls of the top electrode. The piezoelectric layer is configured to help limit delamination of the top electrode from the piezoelectric layer.
    Type: Application
    Filed: May 21, 2019
    Publication date: March 26, 2020
    Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Patent number: 10591946
    Abstract: A power circuit applied to an electronic device, includes: a control circuit and a power providing circuit, wherein the control circuit is coupled to at least one circuit installed within the electronic device, and is arranged to generate a providing information according to at least one performance indicator of the circuit, wherein the providing information includes an optimal voltage signal setting, and the optimal voltage signal setting is generated according to a performance coefficient corresponding to each performance indicator; the power providing circuit is coupled to the control circuit and the at least one circuit, and is arranged to dynamically provide a voltage signal to the circuit according to the providing information.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: March 17, 2020
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chun-Yu Luo, Shih-Chieh Chen, Liang-Hui Li, Yi-Lin Li
  • Publication number: 20200077692
    Abstract: The present invention provides a pharmaceutical composition and a food product for inhibiting gastritis induced by gastric Helicobacter pylori, comprising Lactobacillus selected from a group composed of Lactobacillus rhamnosus GM-020 (also known as GMNL-74) with deposited number CCTCC M203098; Lactobacillus acidophilus GMNL-185 with deposited number CCTCC M2017764; and Lactobacillus plantarum GMNL-662 with deposited number CCTCC M2016571; and any two of the above bacteria.
    Type: Application
    Filed: September 12, 2018
    Publication date: March 12, 2020
    Inventors: Yi-Hsing Chen, Wan-Hua Tsai, Ya-Hui Chen, Chih-Ho Lai, Yu-Hsin Lin
  • Publication number: 20200066177
    Abstract: A multi-view display device includes a display screen component and an optical structure component. The display screen component includes a plurality of pixels, and each of the plurality of pixels includes a left sub-pixel and a right sub-pixel. The optical structure component is disposed at the display screen component. When light beams from the left sub-pixel and light beams from the right sub-pixel of the each of the plurality of pixels pass through the optical structure component, the optical structure component separates the light beams from the left sub-pixel and the light beams from the right sub-pixel so as to generate correspondingly a left image and a right image to reach the first pilot position and the second pilot position, respectively. In addition, a manipulation simulation device is also provided.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 27, 2020
    Inventors: JUNG-YU LI, SHIH-PU CHEN, YI-PING LIN, HONG-HUI HSU, MEI-TAN WANG
  • Patent number: 10535653
    Abstract: A semiconductor structure includes a pair of gate structures and an isolation structure. Each of the gate structures includes a work function metal, a gate, and a barrier layer between the work function metal and the gate. The isolation structure is disposed between the gate structures. The barrier layer covers a sidewall of the isolation structure.
    Type: Grant
    Filed: December 17, 2017
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Jen Chen, Chun-Sheng Liang, Shu-Hui Wang, Shih-Hsun Chang, Hsin-Che Chiang
  • Publication number: 20200012948
    Abstract: Methods, computer program products, and systems are presented. The methods include, for instance: obtaining a request for a predicted ensemble score in real-time. A subset of base model instances is formed by use of a preconfigured priority policy. A fitness score of the formed subset, quantifying the accuracy of the subset, is calculated as a sum of weights respective to the base model instances in the subset. A number of base models represented in the subset is less than or equal to a number of all based models.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 9, 2020
    Inventors: Lei TIAN, Yi SHAO, Peng Xue, Di Ling CHEN, Wei WU, Peng Hui JIANG