Patents by Inventor Yi-Hui Tseng

Yi-Hui Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automatic detection method and automatic detection system for detecting crack on wafer edges
    Patent number: 11644427
    Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: May 9, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Feng Hsiao, Chung-Hsuan Wu, Shuo-Yu Chen, Nai-Ying Lo, Yi-Hui Tseng, Chen-Hui Huang, Yung-Yu Yang, Tzu-Ping Kao
  • AUTOMATIC DETECTION METHOD AND AUTOMATIC DETECTION SYSTEM FOR DETECTING CRACK ON WAFER EDGES
    Publication number: 20220128485
    Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
    Type: Application
    Filed: November 23, 2020
    Publication date: April 28, 2022
    Inventors: Chia-Feng HSIAO, Chung-Hsuan WU, Shuo-Yu CHEN, Nai-Ying LO, Yi-Hui TSENG, Chen-Hui HUANG, Yung-Yu YANG, Tzu-Ping KAO
  • Method of virtual metrology using combined models
    Publication number: 20160274570
    Abstract: A method of virtual metrology is disclosed. Process data and measurement values corresponding to a workpiece are collected. The process data and the measurement values are used to establish a conjecture model. A theoretical model corresponding to the workpiece and the conjecture model is used to establish another conjecture model. The another conjecture model is used to establish a virtual metrology value. The virtual metrology value is used to predict properties of a subsequently manufactured workpiece.
    Type: Application
    Filed: March 18, 2015
    Publication date: September 22, 2016
    Inventors: Lian-Hua Shih, Ching-Hsing Hsieh, Feng-Chi Chung, Chia-Chi Chang, Yu-Cheng Lin, Sian-Jhu Tsai, Meng-Chih Chang, Yi-Hui Tseng