Patents by Inventor Yi-Hung Lee

Yi-Hung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11951628
    Abstract: A robot controlling method includes following operations. A depth image is obtained by the depth camera. A processing circuit receives the depth image and obtains an obstacle parameter of an obstacle and a tool parameter of a tool according to the depth image. The tool is set on the end of a robot. The processing circuit obtains a distance vector between the end and the obstacle parameter. The processing circuit obtains a first endpoint vector and a second endpoint vector between the tool parameter and the obstacle parameter. The processing circuit establishes a virtual torque according to the distance vector, the first endpoint vector, and the second endpoint vector. The processing circuit outputs control signal to the robot according to the tool parameter, the obstacle parameter and the virtual torque to drive the robot to move or rotate the tool to a target.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: April 9, 2024
    Assignee: National Yang Ming Chiao Tung University
    Inventors: Kai-Tai Song, Yi-Hung Lee
  • Publication number: 20220250244
    Abstract: A robot controlling method includes following operations. A depth image is obtained by the depth camera. A processing circuit receives the depth image and obtains an obstacle parameter of an obstacle and a tool parameter of a tool according to the depth image. The tool is set on the end of a robot. The processing circuit obtains a distance vector between the end and the obstacle parameter. The processing circuit obtains a first endpoint vector and a second endpoint vector between the tool parameter and the obstacle parameter. The processing circuit establishes a virtual torque according to the distance vector, the first endpoint vector, and the second endpoint vector. The processing circuit outputs control signal to the robot according to the tool parameter, the obstacle parameter and the virtual torque to drive the robot to move or rotate the tool to a target.
    Type: Application
    Filed: May 4, 2021
    Publication date: August 11, 2022
    Inventors: Kai-Tai SONG, Yi-Hung LEE
  • Patent number: 6470231
    Abstract: The invention is proposed to efficiently dispatch wafers into tools, and particularly to provide a real-time and automatic way to dispatch wafers. In addition, a method for dispatching wafers, a system for dispatching wafers into tools and a system for processing numerous lots by number of tools with automatic dispatch are present as examples. One main characteristic of the invention is that each pending wafer is given an individual priority before it is processed by any tool and the priority is automatically calculated in accordance with to a ranking algorithm. Another main characteristic of the invention is that whenever a tool is available to process at least one pending wafer, part of pending wafers is automatically assigned to the available tool in accordance with an assignment algorithm and a required limitation database that is provided by the dispatcher.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: October 22, 2002
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Keng-Chia Yang, Yo Chang, Chen-Lung Chu, Yi-Hung Lee
  • Patent number: D1018907
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 19, 2024
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Yun-Chien Lee, Yi-Ching Hsu, Pei-Yi Lin, Yu-Hung Su, Sheng-Yuan Huang, Chun-Fu Lin