Abstract: A computation apparatus and a computation method with input swapping are provided. The computation apparatus includes a non-zero detection circuit, a swapper policy circuit, a swapper matrix circuit, and an adder tree. The non-zero detection circuit is configured to receive input vectors, inspect non-zero operands in the input vectors and generate a non-zero indicative signal indicating the non-zero operands. The swapper policy circuit is configured to receive and interpret the non-zero indicative signal, and generate multiplexer (MUX) selection signals for swapping the non-zero operands according to a set of swapping policies. The swapper matrix circuit is configured to receive the input vectors and the MUX selection signal, and perform swapping on operands in the input vectors according to the MUX selection signal. The adder tree is configured to receive the input vectors with the swapped operands and perform additions on the input vectors to output a computation result.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory array and including: a test array, including test cells out of memory cells of the memory array; a write multiplexer, configured to selectively output one of a test signal and a reference voltage based on a write measurement signal, wherein the test signal is output to write into at least one test cell and the reference voltage is output to a sense amplifier; and a read multiplexer, configured to selectively receive and output one of a readout signal corresponding to the test signal and an amplified signal based on a read measurement signal, wherein the readout signal is read from the at least one test cell and the amplified signal is obtained for a read margin evaluation from the sense amplifier by amplifying a voltage difference between the readout signal and the reference voltage.

Abstract: A memory test circuit is provided. The memory test circuit is disposed in a memory chip and electrically coupled to a memory macro of the memory chip. A high speed clock receives an input signal and an external clock signal. The input signal includes a plurality of test bits. A finite state machine controller provides a pattern type. A pattern generator generates and provides a test signal to at least one memory cell of the memory chip to write the test signal to the at least one memory cell based on the pattern type and the external clock signal. A test frequency of the test signal is determined based on the high speed clock. An output comparator outputs a comparison signal based on a difference between the test signal and a readout signal corresponding to the test signal read from the at least one memory cell.

Abstract: Provided is a method for diagnosing and monitoring progression of cancer or effectiveness of a therapeutic treatment. The method includes detecting a methylation level of at least one gene in a biological sample containing circulating free DNA. Also provided are primer pairs and probes for diagnosis or prognosis of cancer in a subject in need thereof.

Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.

Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.

Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.

Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.

Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.

Abstract: Instantly disclosed power supply utilizes a breathable water repelling structure to provide obstruction-less air passage while preventing undesirable intrusion of water/fluids, thus enabling more secure and efficient heat-dissipation. The power supply includes a housing unit having at least one ventilation port; an electronic module disposed in the housing unit; at least one breathable water-repelling membrane unit sealingly covering the ventilation port; and at least one membrane protection unit correspondingly arranged over the breathable water-repelling membrane unit. The power supply can further include a fire-resisting member to prevent the breathable water-repelling membrane unit from catching fire.

Abstract: A network device includes a Universal Serial Bus (USB) port adapted for connecting to a USB connector of a wireless network module, and a Linux-based embedded system that includes a user interface unit, a data converting unit, and a driver unit. The user interface is for providing a user interface to a user terminal and for user input of configuration data for the wireless network module through the user terminal. The user interface unit receives the inputted configuration data from the user terminal. The data converting unit is coupled to the user interface unit for receiving the configuration data therefrom and for converting the configuration data into at least one command. The driver unit is coupled between the data converting unit and the USB port for transferring the at least one command from the data converting unit to the wireless network module.

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: An electric blanket includes a substrate made of cotton cloth, a heating member mounted on the substrate, a plurality of digital temperature sensors mounted to the heating member at a plurality of positions for detecting temperature of the heating member at the positions and sending signals relating to the temperature of the heating member at the positions and indicating the positions, a temperature protection switch, an electromagnetic radiation interference filter electrically connected to an AC power source, a DC power supply circuit, a display for displaying at least temperature of the electric blanket, a zero-cross detector, a triac electrically connected to the heating member, and a central processing unit. The central processing unit receives and processes the signals from the digital temperature sensors and a feedback signal from the temperature protection switch to control temperature of the electric blanket.

Abstract: An apparatus for thermal low periodic wave treatment includes a pair of shock plates, a storage battery and a main control circuit, and a housing enclosing the main control circuit and the storage battery. The apparatus is characterized in that the shock plates are each provided with a sensing plate and a plurality of heating wires, and by way of a transmission wire, the shock plates are linked to the main control circuit, and any corresponding action of the main control circuit is transmitted to the shock plates and at the same time, provides the shock plates with a heat source and low periodic wave pulse source. The main control circuit includes a single chip CPU, and a DC charger switching circuit directly connected thereto, a voltage-stabilizing circuit, a ringing circuit, a heating circuit, a press key control circuit, a voltage-elevating and feedback monitoring circuit, a polar switching circuit and a display.