Patents by Inventor Yi-Jhang Wang

Yi-Jhang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages and methods of forming the same
    Patent number: 11545438
    Abstract: A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: January 3, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang
  • SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
    Publication number: 20220336362
    Abstract: A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.
    Type: Application
    Filed: July 5, 2022
    Publication date: October 20, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang
  • SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
    Publication number: 20210202389
    Abstract: A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.
    Type: Application
    Filed: November 6, 2020
    Publication date: July 1, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang