Patents by Inventor Yi Jian

Yi Jian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad and polishing method
    Patent number: 10239182
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: March 26, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
  • POLISHING PAD AND POLISHING METHOD
    Publication number: 20170355061
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
    Type: Application
    Filed: June 1, 2017
    Publication date: December 14, 2017
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen