Abstract: A semiconductor package includes a die stack including a first semiconductor die having a first interconnect structure, and a second semiconductor die having a second interconnect structure direct bonding to the first interconnect structure of the first semiconductor die. The second interconnect structure includes connecting pads disposed in a peripheral region around the first semiconductor die. First connecting elements are disposed on the connecting pads, respectively. A substrate includes second connecting elements on a mounting surface of the substrate. The first connecting elements are electrically connected to the second connecting elements through an anisotropic conductive structure.

Abstract: The present disclosure relates to a semiconductor package, a semiconductor bonding structure and a method of fabricating the same. The semiconductor package includes a first chip, a second chip and a conductive structure, wherein the conductive structure is disposed at a side of the second chip and over a second upper surface of the first interconnection structure to electrically connect to the first interconnection structure. The semiconductor bonding structure includes a first substrate, a plurality of first interconnection structures, a plurality of chips and a plurality of conductive structures, wherein the conductive structures are respectively disposed at a side of each of the chips and over a second upper surface of each first interconnection structure, to electrically connect to each first interconnection.

Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A cabin monitoring and situation understanding perceiving method is proposed. A cabin interior image capturing step is performed to capture a cabin interior image. A generative adversarial network model creating step is performed to create a generative adversarial network model according to the cabin interior image. An image adjusting step is performed to adjust the cabin interior image to generate an approximate image. A cabin interior monitoring step is performed to process the approximate image to generate a facial recognizing result and a human pose estimating result. A cabin exterior image and voice capturing step is performed to capture a cabin exterior image and a voice information. A situation understanding perceiving step is performed to process at least one of the approximate image, the cabin exterior image and the voice information according to a situation understanding model to perceive a situation understanding result.

Abstract: A feature point integration positioning system includes a moving object, an image input source, an analyzing module and a positioning module. The image input source is disposed at the moving object to shoot an environment for obtaining a sequential image dataset. The analyzing module includes a machine vision detecting unit configured to generate a plurality of first feature points in each of the images based on each of the images, a deep learning detecting unit configured to generate a plurality of second feature points in each of the images based on each of the images, and an integrating unit configured to integrate the first feature points and the second feature points in each of the images into a plurality of integrated feature points in each of the images. The positioning module confirms a position of the moving object relative to the environment at each of the time points.

Abstract: A light emitting device includes a lamp holder, a light emitting unit which is removably disposed on the lamp holder and includes a plurality of light emitting elements arranged in a closed configuration, and an optical element with a lens portion and a connecting portion and removably disposed on the lamp holder. The lens portion is formed in a closed configuration which is the same as the closed configuration formed by the light emitting elements, and the lens portion is aligned with the light emitting elements. The optical element can be removed via the connecting portion, then the light emitting unit is removed from another end of the elastic clamping unit, so that the light emitting unit can be easily replaced or removed. Besides, the light emitting unit can always fit in the same optical element no matter how the number of the light emitting element changes.

Abstract: A lens module for LED light sources including: a lens body; and an LED light source received in a recess of the lens body. By the conditions of Z1>Z2 and Z3>Y1, and with the shape of light incident surface and the position of LED light source, a light deflection effect is achieved. This allows light emitted from the LED light source to be refracted by the light incident surface and then emitted by the light exiting surface, generating an excellent light deflection effect, thereby increasing illumination in width at the road or public squares and increasing utilization rate of the LED light source.

Abstract: An optical lens for lighting fixture includes a body, which comprises a bottom surface and a light-exit surface at opposing bottom and top sides thereof, an elongated groove formed in the bottom surface, a light incident surface, a first intersection line and a second intersection line respectively connected between the two ends of the elongated groove and the bottom surface, a first line segment and a second line segment respectively connected between the light incident surface and the bottom surface, a first virtual line defined between the two ends of the first line segment, a first distance that is the shortest distance between the two ends of the first intersection line, and a SAGi that is the shortest distance between any point at the first line segment and the first virtual line and satisfies the equation: 0?|SAGi/first distance|×100?2.8.

Abstract: A lens module for LED light sources including: a lens body; and an LED light source received in a recess of the lens body. By the conditions of Z1>Z2 and Z3>Y1, and with the shape of light incident surface and the position of LED light source, a light deflection effect is achieved. This allows light emitted from the LED light source to be refracted by the light incident surface and then emitted by the light exiting surface, generating an excellent light deflection effect, thereby increasing illumination in width at the road or public squares and increasing utilization rate of the LED light source.

Abstract: An optical lens for lighting fixture includes a body, which comprises a bottom surface and a light-exit surface at opposing bottom and top sides thereof, an elongated groove formed in the bottom surface, a light incident surface, a first intersection line and a second intersection line respectively connected between the two ends of the elongated groove and the bottom surface, a first line segment and a second line segment respectively connected between the light incident surface and the bottom surface, a first virtual line defined between the two ends of the first line segment, a first distance that is the shortest distance between the two ends of the first intersection line, and a SAGi that is the shortest distance between any point at the first line segment and the first virtual line and satisfies the equation: 0?|SAGi/first distance|×100?2.8.

Abstract: A lens assembly includes a platform having an incident surface and a projection surface on opposite surfaces thereof. Wire holes are formed to the bottom side along a longer axis of the incident surface for wiring. A cut is formed around the incident surface for receiving waterproof ring. The incident surface has a main oval-shaped concave surface. Two symmetric oval-shaped lateral concave surfaces are formed to front two lateral sides of the main oval-shaped concave surface. The projection surface is formed by a plurality of continuous oval-shaped convex surfaces and discontinuous oval-shaped convex surfaces. Two symmetric vertical planes are formed to two lateral sides of the projection surface. The lens assembly capable of receiving LED larger than 10 mm has good distribution of a transverse maximum intensity of light occurring between ±50 to ±60 degrees and a vertical maximum intensity of light occurring between ±30 to ±40 degrees.

Abstract: A lens assembly includes a platform having an incident surface and a projection surface on opposite surfaces thereof. Wire holes are formed to the bottom side along a longer axis of the incident surface for wiring. A cut is formed around the incident surface for receiving waterproof ring. The incident surface has a main oval-shaped concave surface. Two symmetric oval-shaped lateral concave surfaces are formed to front two lateral sides of the main oval-shaped concave surface. The projection surface is formed by a plurality of continuous oval-shaped convex surfaces and discontinuous oval-shaped convex surfaces. Two symmetric vertical planes are formed to two lateral sides of the projection surface. The lens assembly capable of receiving LED larger than 10 mm has good distribution of a transverse maximum intensity of light occurring between ±50 to ±60 degrees and a vertical maximum intensity of light occurring between ±30 to ±40 degrees.

Abstract: A Chinese abacus adder is disclosed. The Chinese abacus adder includes a B/A (binary to abacus) circuit, a P/A (parallel addition) circuit and a T/B (thermometric to binary) circuit. The Chinese abacus adder has a multiple radix calculating structure, which could reduce power consumption of the system and lower the calculation delay time.

Abstract: A Chinese abacus adder is disclosed. The Chinese abacus adder includes a B/A (binary to abacus) circuit, a P/A (parallel addition) circuit and a T/B (thermometric to binary) circuit. The Chinese abacus adder has a multiple radix calculating structure, which could reduce power consumption of the system and lower the calculation delay time.