Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.

Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.

Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.

Abstract: An optical system includes a cage and an optical transceiver. The optical transceiver is inserted into the cage in a pluggable manner, and includes a housing, a partition component provided on the housing, and a fastening component movably disposed on the housing. The fastening component is detachably fastened with the cage. The partition component is located between the fastening component and the cage to separate at least a part of the fastening component from the cage.

Abstract: An optical transceiver includes a receptacle, a ferrule and a ferrule fastening component. The receptacle includes a supporting portion and an inset portion connected with each other. The ferrule is disposed within the inset portion. The ferrule fastening component is disposed on the receptacle. The ferrule fastening component includes a first holding portion, a cap and a second holding portion connected together. The cap is located between the first holding portion and the second holding portion. The first holding portion touches the supporting portion, the second holding portion touches the ferrule, and the cap covers a first area of a top surface of the receptacle.

Abstract: An optical transceiver includes a receptacle, a ferrule and a ferrule fastening component. The receptacle includes a supporting portion and an inset portion connected with each other. The ferrule is disposed within the inset portion. The ferrule fastening component is disposed on the receptacle. The ferrule fastening component includes a first holding portion, a cap and a second holding portion connected together. The cap is located between the first holding portion and the second holding portion. The first holding portion touches the supporting portion, the second holding portion touches the ferrule, and the cap covers a first area of a top surface of the receptacle.

Abstract: An optical subassembly includes a receptacle, a ferrule and a ferrule fastening component. The ferrule and the ferrule fastening component are connected with the receptacle. The ferrule fastening component includes a fastening portion and a blocking portion connected with each other. The fastening portion is fastened with the receptacle, and the blocking portion touches the ferrule.

Abstract: An optical subassembly includes a receptacle, a ferrule and a ferrule fastening component. The ferrule and the ferrule fastening component are connected with the receptacle. The ferrule fastening component includes a fastening portion and a blocking portion connected with each other. The fastening portion is fastened with the receptacle, and the blocking portion touches the ferrule.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

Abstract: A hydrophobic finishing apparatus of a fabric is described. The hydrophobic finishing apparatus includes a first spray coating device, at least one first plasma device, a second spray coating device and at least one second plasma device. The first spray coating device is configured to spray a hydrophobic agent to a first side of the fabric. The first plasma device is disposed at the rear of the first spray coating device and is configured to perform a first plasma treatment on the first side of the fabric. The second spray coating device is disposed at the rear of the first plasma device and is configured to spray the hydrophobic agent to a second side of the fabric. The second plasma device is disposed at the rear of the second spray coating device and is configured to perform a second plasma treatment on the second side of the fabric.

Abstract: An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.