Patents by Inventor Yi-Kai Chao

Yi-Kai Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940486
    Abstract: A probe station includes a frame, a platform, a testing equipment, a probe holder and at least one probe. The frame defines an accommodation space. The platform is connected with the frame. The platform has an opening. The opening is communicated with the accommodation space. The testing equipment is at least partially disposed in the accommodation space and is at least partially exposed through the opening. The probe holder is disposed on the platform. The probe is held by the probe holder. The probe holder is configured to control the probe to contact with a device under test disposed on the testing equipment through the opening.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: March 26, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yi-Kai Chao
  • Publication number: 20230393191
    Abstract: A probe station includes a frame, a platform, a testing equipment, a probe holder and at least one probe. The frame defines an accommodation space. The platform is connected with the frame. The platform has an opening. The opening is communicated with the accommodation space. The testing equipment is at least partially disposed in the accommodation space and is at least partially exposed through the opening. The probe holder is disposed on the platform. The probe is held by the probe holder. The probe holder is configured to control the probe to contact with a device under test disposed on the testing equipment through the opening.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Inventor: Yi-Kai CHAO
  • Patent number: 11774491
    Abstract: The present application provides a testing system. The testing system includes a chip socket and a probe. The chip socket includes a pedestal and a fastener. The pedestal is configured to accommodate a chip to be tested. The fastener includes a top body and a base body. The top body includes a probing window surrounded by a plurality of side walls, wherein the probing window has a first end at an outer surface of the top body and a second end at an inner surface of the top body, a first angle between a first side wall of the plurality of side walls and the outer surface is less than 90 degrees, and a first opening area at the first end of the probing window is larger than a second opening area at the second end of the probing window.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: October 3, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yi-Kai Chao
  • Patent number: 11733291
    Abstract: The present application discloses a chip socket for testing a semiconductor chip. The chip socket includes a pedestal and a fastener. The pedestal accommodates a chip to be tested. The fastener includes a top body and a base body. The top body includes a probing window, wherein a first opening area of the probing window at an outer surface of the top body is larger than a second opening area of the probing window at an inner surface of the top body. The base body is attached to the pedestal and locked to the top body when the top body covers the base body and clamps the chip. When the top body covers the base body, the probing window reveals a surface of the chip, allowing a probe to contact the surface of the chip through the probing window.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: August 22, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yi-Kai Chao