Abstract: A high-efficiency mold temperature control system includes a dielectric heating module, a cooling module, and a flow control module. The dielectric heating module includes a heating circuit, a dielectric heater, a high-frequency power supply, a high-temperature heat medium storage tank, and a heat circulation pump. The cooling module includes a cooling circuit, a heat exchanger, a low-temperature heat medium storage tank, and a cold circulation pump. The flow control module includes multiple thermal switch valves and multiple cooling switch valves to control a high-temperature heat medium to the heating circuit or control a low-temperature heat medium to the cooling circuit. Through the design of the dielectric heating module, the high-temperature heat medium can be rapidly heated and the overall heating efficiency can be enhanced, thereby rapidly heating or cooling a mold and controlling the rapid heating and cooling of the mold.

Abstract: A memory device test system includes a memory device, a tester, a system board, and an interface card. The tester generates a first control signal corresponding to a test being performed to the memory device. The system board is coupled to the tester and generates, in response to the first control signal, a second control signal to the memory device. The interface card is coupled to the tester, the system board, and the memory device and transmits to the memory device, in response to a switch signal received from the tester, a power signal from the tester through a first conductive path or from the system board through a second conductive path. The memory device generates, in response to the power signal and the second control signal, an output signal corresponding to the test to the tester.

Abstract: A high-efficiency mold temperature control system includes a dielectric heating module, a cooling module, and a flow control module. The dielectric heating module includes a heating circuit, a dielectric heater, a high-frequency power supply, a high-temperature heat medium storage tank, and a heat circulation pump. The cooling module includes a cooling circuit, a heat exchanger, a low-temperature heat medium storage tank, and a cold circulation pump. The flow control module includes multiple thermal switch valves and multiple cooling switch valves to control a high-temperature heat medium to the heating circuit or control a low-temperature heat medium to the cooling circuit. Through the design of the dielectric heating module, the high-temperature heat medium can be rapidly heated and the overall heating efficiency can be enhanced, thereby rapidly heating or cooling a mold and controlling the rapid heating and cooling of the mold.

Abstract: The present invention is directed to an adjustable optical element supporting structure comprising a first structure group, a second structure group, a third structure group and a fourth structure group. The second structure group is disposed on the first structure group, the third structure group is disposed on the second structure group, and the fourth structure group is disposed on the third structure group. Each of the first structure group, the second structure group and the third structure group includes a supporting beam and a node assemble, and the position of the node assemble can be adjusted along a radial or a tangential direction. The fourth structure group is a supporting member having three branches, and a supporting pad made by an elastic material is disposed on the supporting member for supporting an optical element. Accordingly, the present invention can evenly support the optical element having different sizes and structures.

Abstract: The present invention is directed to an adjustable optical element supporting structure comprising a first structure group, a second structure group, a third structure group and a fourth structure group. The second structure group is disposed on the first structure group, the third structure group is disposed on the second structure group, and the fourth structure group is disposed on the third structure group. Each of the first structure group, the second structure group and the third structure group includes a supporting beam and a node assemble, and the position of the node assemble can be adjusted along a radial or a tangential direction. The fourth structure group is a supporting member having three branches, and a supporting pad made by an elastic material is disposed on the supporting member for supporting an optical element. Accordingly, the present invention can evenly support the optical element having different sizes and structures.

Abstract: An optical recording media includes a substrate, a cap layer opposite to the substrate, at least one first stacked recording structure, at least one second stacked recording structure, and a space layer. The first stacked recording structure including a first recording layer disposed between the substrate and the cap layer and a reflective layer disposed between the substrate and the first recording layer is disposed between the substrate and the cap layer. The second stacked recording structure including a second recording layer disposed between the substrate and the cap layer and an Nb2O5 interface layer disposed between the substrate and the second recording layer is disposed between the substrate and the cap layer. The spacer layer is disposed between the first and second stacked recording structures, the first stacked recording structures, and the second stacked recording structures. One of the first stacked recording structures is disposed directly on the substrate.

Abstract: An optical recording media includes a substrate, a cap layer opposite to the substrate, at least one first stacked recording structure, at least one second stacked recording structure, and a space layer. The first stacked recording structure including a first recording layer disposed between the substrate and the cap layer and a reflective layer disposed between the substrate and the first recording layer is disposed between the substrate and the cap layer. The second stacked recording structure including a second recording layer disposed between the substrate and the cap layer and an Nb2O5 interface layer disposed between the substrate and the second recording layer is disposed between the substrate and the cap layer. The spacer layer is disposed between the first and second stacked recording structures, the first stacked recording structures, and the second stacked recording structures. One of the first stacked recording structures is disposed directly on the substrate.