Patents by Inventor Yi-Kai Huang

Yi-Kai Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107902
    Abstract: A method includes forming a first and a second dummy gate stack crossing over a semiconductor region, forming an ILD to embed the first and the second dummy gate stacks therein, replacing the first and the second dummy gate stacks with a first and a second replacement gate stack, respectively, performing a first etching process to form a first opening. A portion of the first replacement gate stack and a portion of the second replacement gate stack are removed. The method further includes filling the first opening to form a dielectric isolation region, performing a second etching process to form a second opening, with the ILD being etched, and the dielectric isolation region being exposed to the second opening, forming a contact spacer in the second opening, and filling a contact plug in the second opening. The contact plug is between opposite portions of the contact spacer.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: August 31, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Gang Chen, Tai-Chun Huang, Yi-Ting Fu, Ming-Chang Wen, Shu-Yuan Ku, Fu-Kai Yang, Tze-Liang Lee, Yung-Cheng Lu
  • Patent number: 8420198
    Abstract: An optical recording media includes a substrate, a cap layer opposite to the substrate, at least one first stacked recording structure, at least one second stacked recording structure, and a space layer. The first stacked recording structure including a first recording layer disposed between the substrate and the cap layer and a reflective layer disposed between the substrate and the first recording layer is disposed between the substrate and the cap layer. The second stacked recording structure including a second recording layer disposed between the substrate and the cap layer and an Nb2O5 interface layer disposed between the substrate and the second recording layer is disposed between the substrate and the cap layer. The spacer layer is disposed between the first and second stacked recording structures, the first stacked recording structures, and the second stacked recording structures. One of the first stacked recording structures is disposed directly on the substrate.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: April 16, 2013
    Assignee: CMC Magnetics Corporation
    Inventors: Yi-Kai Huang, Kun-Long Li, Yung-Hui Hung, Cheng-Pi Lee
  • Publication number: 20110236618
    Abstract: An optical recording media includes a substrate, a cap layer opposite to the substrate, at least one first stacked recording structure, at least one second stacked recording structure, and a space layer. The first stacked recording structure including a first recording layer disposed between the substrate and the cap layer and a reflective layer disposed between the substrate and the first recording layer is disposed between the substrate and the cap layer. The second stacked recording structure including a second recording layer disposed between the substrate and the cap layer and an Nb2O5 interface layer disposed between the substrate and the second recording layer is disposed between the substrate and the cap layer. The spacer layer is disposed between the first and second stacked recording structures, the first stacked recording structures, and the second stacked recording structures. One of the first stacked recording structures is disposed directly on the substrate.
    Type: Application
    Filed: June 7, 2010
    Publication date: September 29, 2011
    Applicant: CMC MAGNETICS CORPORATION
    Inventors: Yi-Kai Huang, Kun-Long Li, Yung-Hui Hung, Cheng-Pi Lee