Patents by Inventor Yi-kai LAN

Yi-kai LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling assemblies for electronic devices
    Patent number: 10368431
    Abstract: According to some aspects of the present disclosure, cooling assemblies for electronic devices are disclosed. Example cooling assemblies include a circuit board having a first surface and a second surface opposite the first surface, a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices. Each set includes at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board. At least one of the electronic devices of the first set is adjacent one of the electronic devices of the second set and is adjacent one of the electronic devices of the third set. The cooling assembly further includes a heat sink disposed on the second surface of the circuit board. The heat sink is in thermal contact with the first set, the second set, and the third set of electronic devices.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: July 30, 2019
    Assignee: Astec International Limited
    Inventors: Yu-wei Chen, Yi-kai Lan, Shih-chien Chou
  • COOLING ASSEMBLIES FOR ELECTRONIC DEVICES
    Publication number: 20190029104
    Abstract: According to some aspects of the present disclosure, cooling assemblies for electronic devices are disclosed. Example cooling assemblies include a circuit board having a first surface and a second surface opposite the first surface, a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices. Each set includes at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board. At least one of the electronic devices of the first set is adjacent one of the electronic devices of the second set and is adjacent one of the electronic devices of the third set. The cooling assembly further includes a heat sink disposed on the second surface of the circuit board. The heat sink is in thermal contact with the first set, the second set, and the third set of electronic devices.
    Type: Application
    Filed: July 20, 2017
    Publication date: January 24, 2019
    Inventors: Yu-wei CHEN, Yi-kai LAN, Shih-chien CHOU