Abstract: A paper delivery device includes a mounting shaft, a paper guide assembly attached to the mounting shaft, a first wheel, a second wheel, and a driving module configured to drive the first wheel and the second wheel to rotate in a first direction or a second direction that is reverse to the first direction. The paper guide assembly includes a first guide module attached to the mounting shaft and a second guide module attached to the mounting shaft. The first wheel abuts the first guide module. The second wheel abuts the second guide module. The first guide module and the second guide module is movable towards each other when the first wheel and the second wheel rotate in the first direction, or movable away from each other when the first wheel and the second wheel rotate in the second direction.

Abstract: A method for fabricating a semiconductor device comprises steps as follows: A first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on a substrate is firstly provided. The first dummy gate electrode is subsequently removed to expose the first composite sacrificial layer. The first composite sacrificial layer is then removed. Thereafter, a first work function layer is formed on the first high-k gate insulator layer, and a first metal gate electrode is formed on the first work function layer.

Abstract: A paper delivery device includes a mounting shaft, a paper guide assembly attached to the mounting shaft, a first wheel, a second wheel, and a driving module configured to drive the first wheel and the second wheel to rotate in a first direction or a second direction that is reverse to the first direction. The paper guide assembly includes a first guide module attached to the mounting shaft and a second guide module attached to the mounting shaft. The first wheel abuts the first guide module. The second wheel abuts the second guide module. The first guide module and the second guide module is movable towards each other when the first wheel and the second wheel rotate in the first direction, or movable away from each other when the first wheel and the second wheel rotate in the second direction.

Abstract: A fabricating method of semiconductor structure is provided. First, a substrate with a dielectric layer formed thereon is provided. The dielectric layer has a first opening and a second opening exposing a portion of the substrate. Further, a gate dielectric layer including a high-k dielectric layer and a barrier layer stacked thereon had been formed on the bottoms of the first opening and the second opening. Next, a sacrificial layer is formed on the portion of the gate dielectric layer within the second opening. Next, a first work function metal layer is formed to cover the portion of the gate dielectric layer within the first opening and the sacrificial layer. Then, the portion of the first work function metal layer and the sacrificial layer within the second opening are removed.

Abstract: A method for fabricating a semiconductor device comprises steps as follows: A first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on a substrate is firstly provided. The first dummy gate electrode is subsequently removed to expose the first composite sacrificial layer. The first composite sacrificial layer is then removed. Thereafter, a first work function layer is formed on the first high-k gate insulator layer, and a first metal gate electrode is formed on the first work function layer.

Abstract: A fabricating method of semiconductor structure is provided. First, a substrate with a dielectric layer formed thereon is provided. The dielectric layer has a first opening and a second opening exposing a portion of the substrate. Further, a gate dielectric layer including a high-k dielectric layer and a barrier layer stacked thereon had been formed on the bottoms of the first opening and the second opening. Next, a sacrificial layer is formed on the portion of the gate dielectric layer within the second opening. Next, a first work function metal layer is formed to cover the portion of the gate dielectric layer within the first opening and the sacrificial layer. Then, the portion of the first work function metal layer and the sacrificial layer within the second opening are removed.

Abstract: A printer having an ink drying apparatus is provided. The printer includes a hollow metal cylinder; a heater, disposed in an inner surface and along axial direction of the hollow metal cylinder; a print assembly; a feed roller, to feed a print media towards the print assembly; a support substrate, for supporting the print media, an idle gear, connected with the feed roller assembly and the hollow metal cylinder. The feed roller assembly rolls the idle gear, thereby drives the hollow metal cylinder to roll at same rate as the feed roller assembly and the idle gear. A printing method is also provided.

Abstract: Apparatus for aiding in the disassembly of a mechanical assembly, such as an injector head having a plurality of interconnected, stacked plates. The apparatus includes a stationary base with side walls between which the plates are received to maintain registration of the latter during disassembly. A carriage slideably mounted on the base includes a clamp for clamping the head on the base and means for securing a portion of the head on the carriage such that the head portion moves along with the carriage. Through holes in the side walls allow certain of the plates to be secured to the side walls against movement of the carriage such that upward movement of the carriage separates the plates.