Abstract: A heat dissipation fin includes a body and an airflow guiding structure. The body has a first surface and a second surface opposite to each other and an airflow hole penetrating the first surface and the second surface. The airflow guiding structure is obliquely joined on the first surface of the body and covers part of the airflow hole. An airflow passage is formed between the airflow guiding structure and the first surface. Part of an airflow is adapted to pass along the first surface through the airflow passage to flow away. Part of the airflow passes in a direction from the second surface through the airflow hole to flow away.

Abstract: A heat dissipation fin includes a body and an airflow guiding structure. The body has a first surface and a second surface opposite to each other and an airflow hole penetrating the first surface and the second surface. The airflow guiding structure is obliquely joined on the first surface of the body and covers part of the airflow hole. An airflow passage is formed between the airflow guiding structure and the first surface. Part of an airflow is adapted to pass along the first surface through the airflow passage to flow away. Part of the airflow passes in a direction from the second surface through the airflow hole to flow away.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: A heat dissipation device for being in thermal contact with a heat source includes multiple heat dissipation fins, a heat pipe and a fan. Each of the heat dissipation fins includes a plate and an air guiding body. The plate has a thermal contact side used for being in thermal contact with the heat source. An acute angle is formed between an extension side of the air guiding body and the thermal contact side. The heat pipe penetrates through the plates. The fan used for forming an air current is installed at a side of the heat dissipation fin opposite to the thermal contact side. The air guiding body and the heat pipe are disposed in a flowing path of the air current. Thereby, the air current is guided toward the heat pipe and the amount of air flowing through the heat pipe is increased.

Abstract: A cooling device includes a heat sink base plate for mounting on a circuit board to absorb waste heat from a heat source, a radiation fin unit consisting of a set of radiation fins, mounted on the heat sink base plate opposite to the circuit board and defining a plurality of heat-dissipation passages between each two adjacent ones of the radiation fins, a cooling fan unit mounted on the radiation fin unit for creating currents of air toward the heat-dissipation passages, a plurality of thermal tubes supported on the heat sink base plate and fastened to the radiation fins. Each radiation fin has first wind guiding wall portions and second wind guiding wall portions respectively tilted in reversed directions to facilitate the flow of air through the heat-dissipation passages.

Abstract: A heat sink fabrication method includes the step of heating aluminum billets into malleable aluminum and then extruding malleable aluminum into an aluminum substrate bar having different lengths of fins radially spaced around the periphery thereof, the step of using a machine to transversely cut the aluminum substrate bar into multiple aluminum substrates subject to a predetermined thickness, and the step of employing a stamping technique to stamp each aluminum substrate into a heat sink having radiation fins extended from and spaced around a plate-shaped base portion thereof.