Patents by Inventor Yi-Le CHENG

Yi-Le CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250234485
    Abstract: A manifold liquid drainage system includes a first liquid drain body and a manifold assembly. The first liquid drain body includes a first hollow flow channel and a plurality of first openings. The manifold assembly is fixed to at least one of the first openings and communicates with the first hollow flow channel, wherein the manifold assembly includes a pipe, a quick release joint, an electronic flow valve, and a control circuit board. The pipe is connected to one of the openings. The electronic flow valve is installed between the pipe and the quick release joint. The control circuit board controls the electronic flow valve to regulate the liquid flow through the pipe.
    Type: Application
    Filed: August 6, 2024
    Publication date: July 17, 2025
    Inventors: Yi-Le CHENG, Chien-Yu CHEN, Chih-Wei CHEN, Tian-Li YE
  • Patent number: 12228146
    Abstract: A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin set is installed on the main vapor chamber, the auxiliary heat dissipation fin set is connected to the auxiliary vapor chamber, and the auxiliary vapor chamber is arranged between the main heat dissipation fin set and the auxiliary heat dissipation fin set.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: February 18, 2025
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chih-Wei Chen, Cheng-Ju Chang, Hsiang-Chih Chuang, Jyun-Wei Huang, Yi-Le Cheng
  • Publication number: 20240328445
    Abstract: An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.
    Type: Application
    Filed: November 29, 2023
    Publication date: October 3, 2024
    Inventors: Cheng-Ju CHANG, Moo-Ting CHOU, Yi-Le CHENG, Wan-Hsuan LIN, Chung-Chien SU
  • Publication number: 20240230241
    Abstract: A heat dissipation device is provided and includes: a first vapor chamber having a first chamber and two first openings; and a second vapor chamber disposed on the first vapor chamber and having a second chamber, two bending portions and a middle portion. The two bending portions are inserted into the two first openings respectively to connect the first vapor chamber, such that the second chamber is in communication with the first chamber.
    Type: Application
    Filed: November 29, 2023
    Publication date: July 11, 2024
    Inventors: Yi-Le CHENG, Jyun-Wei HUANG, Cheng-Ju CHANG, Chih-Wei CHEN, Tien-Yao CHANG, Che-Wei KUO
  • Publication number: 20230413483
    Abstract: A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin set is installed on the main vapor chamber, the auxiliary heat dissipation fin set is connected to the auxiliary vapor chamber, and the auxiliary vapor chamber is arranged between the main heat dissipation fin set and the auxiliary heat dissipation fin set.
    Type: Application
    Filed: August 15, 2022
    Publication date: December 21, 2023
    Inventors: Chih-Wei CHEN, Cheng-Ju CHANG, Hsiang-Chih CHUANG, Jyun-Wei HUANG, Yi-Le CHENG