Patents by Inventor YiLei Wu

YiLei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planarization method
    Patent number: 11569791
    Abstract: The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: January 31, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lieng Loo, Kahkeen Lai, Yilei Wu
  • Planarization method
    Patent number: 11482664
    Abstract: The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: October 25, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lieng Loo, Kahkeen Lai, Yilei Wu
  • PLANARIZATION METHOD
    Publication number: 20210336125
    Abstract: The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.
    Type: Application
    Filed: December 29, 2020
    Publication date: October 28, 2021
    Inventors: Lieng Loo, Kahkeen Lai, Yilei Wu
  • PLANARIZATION METHOD
    Publication number: 20210336596
    Abstract: The invention provides a planarization method, which can make the local flatness of the product to be processed more uniform. The product has a cavity filled with oxide and includes a first electrode layer, a piezoelectric layer and a second electrode layer superposed on the cavity. The first electrode layer covers the cavity and includes a first inclined face around the first electrode layer, and the piezoelectric layer covers the first electrode layer and is arranged on the first electrode layer. The planarization method includes: depositing a passivation layer on the second electrode layer and etching the passivation layer completely until the thickness of the passivation layer is reduced to the required thickness.
    Type: Application
    Filed: December 29, 2020
    Publication date: October 28, 2021
    Inventors: Lieng Loo, Kahkeen Lai, Yilei Wu
  • Vibration compensation based on identification of vibration frequency
    Patent number: 7596795
    Abstract: A shock detection circuit housed in an electronic device includes an output shock signal that is indicative of vibration amplitude. To compensate for vibrations that are experienced by the electronic device, the output shock signal is analyzed. The analysis of the output shock signal allows a vibration frequency of the output shock signal to be identified and used in vibration compensation.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: September 29, 2009
    Assignee: Seagate Technology LLC
    Inventors: Mingzhong Ding, KianKeong Ooi, KeXiu Liu, YiLei Wu, ShuYu Cao
  • Vibration Compensation Based on Identification of Vibration Frequency
    Publication number: 20080262658
    Abstract: A shock detection circuit housed in an electronic device includes an output shock signal that is indicative of vibration amplitude. To compensate for vibrations that are experienced by the electronic device, the output shock signal is analyzed. The analysis of the output shock signal allows a vibration frequency of the output shock signal to be identified and used in vibration compensation.
    Type: Application
    Filed: April 17, 2007
    Publication date: October 23, 2008
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Mingzhong Ding, KianKeong Ooi, KeXiu Liu, YiLei Wu, ShuYu Cao