Patents by Inventor Yi-Li Hsiao

Yi-Li Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11515233
    Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: November 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao
  • Publication number: 20220367255
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Patent number: 11443981
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: September 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Publication number: 20220285310
    Abstract: A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Inventors: Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang, Yi-Li Hsiao, Su-Chun Yang
  • Patent number: 11348889
    Abstract: A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 31, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
  • Patent number: 11342302
    Abstract: A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 24, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang, Yi-Li Hsiao, Su-Chun Yang
  • Publication number: 20210098336
    Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.
    Type: Application
    Filed: May 8, 2020
    Publication date: April 1, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Liang Shao, Lawrence Chiang Sheu, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao
  • Publication number: 20210050251
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Application
    Filed: May 5, 2020
    Publication date: February 18, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Publication number: 20200126937
    Abstract: A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
  • Patent number: 10522491
    Abstract: A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
  • Publication number: 20190326251
    Abstract: A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
    Type: Application
    Filed: February 1, 2019
    Publication date: October 24, 2019
    Inventors: Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang, Yi-Li Hsiao, Su-Chun Yang
  • Patent number: 10229901
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: March 12, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Liang Shao, Yi-Li Hsiao, Hsiao-Yun Chen, Chih-Hang Tung, Chen-Hua Yu
  • Patent number: 10163835
    Abstract: A wafer-level pulling method includes securing a top holder to a plurality of chips. The method further includes securing a bottom holder to a wafer, wherein the plurality of chips are bonded to the wafer by a plurality of solder bumps. The method further includes softening the plurality of solder bumps. The method further includes stretching the plurality of softened solder bumps, wherein stretching the plurality of softened solder bumps comprises leveling the plurality of chips using a plurality of levelling devices separated from the plurality of chips, and a first levelling device of the plurality of levelling devices has a different structure from a second levelling device of the plurality of levelling devices.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Su-Chun Yang, Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu
  • Patent number: 10147693
    Abstract: An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: December 4, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu
  • Publication number: 20180247907
    Abstract: A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
    Type: Application
    Filed: April 30, 2018
    Publication date: August 30, 2018
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
  • Patent number: 10034390
    Abstract: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: July 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu
  • Patent number: 9978709
    Abstract: A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 22, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu
  • Patent number: 9966357
    Abstract: A method includes moving a first bond head along a first guide apparatus for a first loop. The first guide apparatus is configured in a ring shape. The method also includes picking up a first die using the first bond head during the first loop, and aligning the first die with a first package substrate. The aligning the first die with the first package substrate includes moving the first package substrate in a first direction and a second direction. The first direction and the second direction are contained in a first plane parallel to the first loop. The method further includes placing the first die over the first package substrate during the first loop.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: May 8, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Patent number: 9960134
    Abstract: A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: May 1, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
  • Publication number: 20180108632
    Abstract: A wafer-level pulling method includes securing a top holder to a plurality of chips. The method further includes securing a bottom holder to a wafer, wherein the plurality of chips are bonded to the wafer by a plurality of solder bumps. The method further includes softening the plurality of solder bumps. The method further includes stretching the plurality of softened solder bumps, wherein stretching the plurality of softened solder bumps comprises leveling the plurality of chips using a plurality of levelling devices separated from the plurality of chips, and a first levelling device of the plurality of levelling devices has a different structure from a second levelling device of the plurality of levelling devices.
    Type: Application
    Filed: December 11, 2017
    Publication date: April 19, 2018
    Inventors: Su-Chun YANG, Yi-Li HSIAO, Chih-Hang TUNG, Chen-Hua YU