Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

Abstract: A wafer is carried on a blade supported on robotic arms. A plurality of guide clamps both move the wafer into a desired position on the blade and clamp the wafer in place during transport by the arms. The clamps are reciprocally mounted on the blade and are connected with and driven by a rotatable hub carried on the blade and rotated by the movement of the arms. Both the blade and the clamps include beveled surfaces that guide the wafer into place. The operation of the clamps is controlled by a laser that detects when the wafer is out of place or tilted on the blade.

Abstract: The orientation of a wafer carried on a blade of a semiconductor wafer transfer system is sensed in order to prevent wafer damage during transfer of the wafer from chamber-to-chamber within a semiconductor processing system. A pair of laser beams are used to sense both tilt of the wafer on the blade, and mis-alignment of the blade in the chamber. A control and logic circuit lock out movement of the blade when the laser beams indicate tilt of the wafer or mis-alignment of the blade.

Abstract: A wafer positioning checking system used in a vertical furnace as found in a semiconductor manufacturing facility for manufacturing chips. The system utilizes a first sensor such as a photoelectric or laser sensor that checks the peripheral alignment of the wafers loaded in the boat. A second sensor is mounted on a robot having a wafer-handling arm for checking the position of a wafer that has just been loaded into the boat. An algorithm in a control unit responds to electrical signals generated by these two sensors to allow the loading operation to continue as long as the wafers are properly positioned and to controllable monitoring the wafers during a portion of the processing.

Abstract: A wafer is carried on a blade supported on robotic arms. A plurality of guide clamps both move the wafer into a desired position on the blade and clamp the wafer in place during transport by the arms. The clamps are reciprocally mounted on the blade and are connected with and driven by a rotatable hub carried on the blade and rotated by the movement of the arms. Both the blade and the clamps include beveled surfaces that guide the wafer into place. The operation of the clamps is controlled by a laser that detects when the wafer is out of place or tilted on the blade.

Abstract: The orientation of a wafer carried on a blade of a semiconductor wafer transfer system is sensed in order to prevent wafer damage during transfer of the wafer from chamber-to-chamber within a semiconductor processing system. At least a pair of laser beams are used to sense both tilt of the wafer on the blade, and mis-alignment of the blade in the chamber. A control and logic circuit lock out movement of the blade when the laser beams indicate tilt of the wafer or mis-alignment of the blade.