Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

Abstract: A method for analyzing variation causes of manufacturing process is applied. The method includes acquiring manufacturing process data of a plurality of products, and using at least one of a non-probability based classifier and a probability based classifier to compute manufacturing process data to acquire a contribution rate of each of the manufacturing process parameters. The method further includes determining whether a classifier accuracy rate is greater than a threshold. The method further includes, if yes, performing a deleting operation to delete a manufacturing process parameter having a lowest contribution rate and using the at least one of the non-probability based classifier and the probability based classifier to compute the manufacturing process data again; and if no, setting the manufacturing process parameters not deleted by the deleting operation plus the manufacturing process parameter deleted in the last deleting operation as the at least one crucial manufacturing process parameter.

Abstract: The present invention discloses a packaging structure and method for organic light emitting devices, in which the packaging structure comprises a substrate; an OLED device, which disposing on the substrate; a first transparent protection layer, which forming on the OLED device; and a second transparent protection layer, which forming on the first transparent protection layer.

Abstract: A method for monitoring and controlling a household appliance is provided. The method has the steps of: monitoring and sampling the power of the household appliance to obtain a first standby power range; monitoring and sampling the power of the household appliance to obtain a set of first real-time power data; calculating a first standby confidence level based on the number of times that the first real-time power data fall within the first standby power range; and determining that the household appliance is in a standby state if the first standby confidence level is greater than or equal to a standby confidence level threshold.

Abstract: A method for monitoring and controlling a household appliance is provided. The method has the steps of: monitoring and sampling the power of the household appliance to obtain a first standby power range; monitoring and sampling the power of the household appliance to obtain a set of first real-time power data; calculating a first standby confidence level based on the number of times that the first real-time power data fall within the first standby power range; and determining that the household appliance is in a standby state if the first standby confidence level is greater than or equal to a standby confidence level threshold.

Abstract: The present invention discloses a packaging structure and method for organic light emitting devices, in which the packaging structure comprises a substrate; an OLED device, which disposing on the substrate; a first transparent protection layer, which forming on the OLED device; and a second transparent protection layer, which forming on the first transparent protection layer.

Abstract: The present invention is to provide a burn-in adapter comprising a first connector, an interface circuit (e.g., RS-232 port), a jumper assembly, a reset instruction generator, and a second connector coupled to a motherboard, in which the interface circuit is electrically coupled to the first connector, the jumper assembly, the reset instruction generator, and the second connector respectively, different signal levels are generated by moving or removing a plurality of jumpers of the jumper assembly, the first connector is electrically coupled to a burn-in device via a first cable, and the second connector is electrically coupled to the motherboard via a second cable, thereby the burn-in adapter is adapted to burn a memory of the motherboard after generating a reset instruction and a burn-in signal level to cause the motherboard entering into a burn-in state.

Abstract: The present invention is to provide a burn-in adapter comprising a first connector, an interface circuit (e.g., RS-232 port), a jumper assembly, a reset instruction generator, and a second connector coupled to a motherboard, in which the interface circuit is electrically coupled to the first connector, the jumper assembly, the reset instruction generator, and the second connector respectively, different signal levels are generated by moving or removing a plurality of jumpers of the jumper assembly, the first connector is electrically coupled to a burn-in device via a first cable, and the second connector is electrically coupled to the motherboard via a second cable, thereby the burn-in adapter is adapted to burn a memory of the motherboard after generating a reset instruction and a burn-in signal level to cause the motherboard entering into a burn-in state.