Abstract: A patrol and inspection vehicle includes a vehicle body, distance measuring devices installed on front and rear sides of the vehicle body for detecting distances of ambient objects, a LiDAR sensor installed on the vehicle body for constructing a three-dimensional spatial model for positioning and navigation, a panoramic camera installed on the vehicle body for recognizing images of ambient individuals, and a gas detector installed on the vehicle body for detecting leaked gases having a temperature different from room temperature. The patrol and inspection vehicle can automatically inspect whether there are gas leaks in pipelines and detect if individuals have accidentally entered restricted areas, thereby reducing the manpower required for patrols and enhancing factory safety.

Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.

Abstract: Method of manufacturing semiconductor device includes forming photoresist layer over substrate. Forming photoresist layer includes combining first precursor and second precursor in vapor state to form photoresist material, wherein first precursor is organometallic having formula: MaRbXc, where M at least one of Sn, Bi, Sb, In, Te, Ti, Zr, Hf, V, Co, Mo, W, Al, Ga, Si, Ge, P, As, Y, La, Ce, Lu; R is substituted or unsubstituted alkyl, alkenyl, carboxylate group; X is halide or sulfonate group; and 1?a?2, b?1, c?1, and b+c?5. Second precursor is at least one of an amine, a borane, a phosphine. Forming photoresist layer includes depositing photoresist material over the substrate. The photoresist layer is selectively exposed to actinic radiation to form latent pattern, and the latent pattern is developed by applying developer to selectively exposed photoresist layer to form pattern.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on a first sidewall of the MTJ, and a second spacer on a second sidewall of the MTJ. Preferably, the first spacer and the second spacer are asymmetric, the first spacer and the second spacer have different heights, and a top surface of the MTJ includes a reverse V-shape.

Abstract: A dose planning system, which takes the drug concentration distribution in human organs/tissues as well as the atomic composition distribution of human organs/tissues into consideration, and calculates the neutron/photon dose distribution in human organs/tissues under this drug concentration distribution using the Monte Carlo Method. Thereby the neutron/photon dose distribution in the organs/tissues of the human subject is calculated more accurately.

Abstract: The present disclosure provides a display device and a method for manufacturing a display device. The method for manufacturing a display device of the present disclosure includes: forming a light emitting layer, a first metal layer and a protective layer on a substrate, wherein the first metal layer is located between the light emitting layer and the protective layer; forming a release layer covering over the light emitting layer, the first metal layer and the protective layer; removing a first portion of the release layer to expose the light emitting layer and the first portion of the first metal layer; and forming a first encapsulation layer covering the light emitting layer, a first portion of the first metal layer and a second portion of the release layer. A thickness of the first encapsulation layer on the light emitting layer is substantially equal to a thickness of the first encapsulation layer on the first portion of the first metal layer.

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

Abstract: A multifunction connector is provided. A housing of the connector has a base portion, a pair of walls extending from the base portion in a longitudinal direction and separated by a gap, and a pair of wings extending from the base portion on opposite sides of the pair of walls and in a transverse direction. A pair of power conductors each is held by one of the walls and has contact portions curving into the gap. A pair of sense conductors each is held by one of the walls and has a contact portion curving into the gap and being offset from the contact portions of a respective power conductor along the longitudinal direction. A position identification subassembly is held by a first wall of the pair and separate from the gap by the first wall. A ground conductor is held by a second wall of the pair and separate from the gap by the second wall. Such a configuration enables the connector to carry high current, identify insertion position on a busbar, sense the degree of insertion, and/or provide grounding.

Abstract: System and method to use position information about a power supply unit (PSU) within a system for status reporting or control. The system may have multiple slots into which the PSU may be installed, and each of multiple PSUs installed may sense position information, such as an indication of the slot into which it is installed. A controller may receive the position information in connection with status information such that faults or other events associated with a PSU may be reported to a system operator in connection with a position of the affected PSU. The controller may determine adjustments to operating parameters of the PSUs that are impacted by position and may direct commends to the appropriate PSU based on the position information.

Abstract: An electrical connector, electrical connector assembly, electrical device and electrical interconnection system configured for use in electronic devices with direct connect orthogonal architectures. The electrical connector comprises: an insulating housing; at least one electrically conductive terminal, with at least a part of each of the at least one electrically conductive terminal being accommodated in the insulating housing; and a mounting flange, the mounting flange having a mounting hole for mounting the electrical connector to component PCB. A threaded connecting member may pass through the mounting hole and be connected to a first PCB. A portion of the mating interface part of the connector may extend below the mounting interface of the connector so as to abut an edge of the PCB. The electrical connector can simultaneously provide compactness and robustness.

Abstract: A solid oxide cell obtainable by a process comprising the steps of: depositing a fuel electrode layer on a fuel electrode support layer; depositing an electrolyte layer comprising stabilized zirconia on the fuel electrode layer to provide an assembly of fuel electrode support, fuel electrode and electrolyte; optionally sintering the assembly of fuel electrode support, fuel electrode and electrolyte together to provide a pre-sintered half cell; depositing on the electrolyte layer of the pre-sintered half cell one or more oxygen electrode layers, at least one of the oxygen electrode layers comprising a composite of lanthanum-strontium-manganite and stabilized zirconia to provide a complete solid oxide cell; sintering the oxygen electrode layers together with the pre-sintered half cell to provide a sintered complete solid oxide cell; and impregnating the one or more oxygen electrode layers of the sintered complete solid oxide cell with manganese to obtain a manganese impregnated solid oxide cell.

Abstract: A solid oxide cell obtainable by a process comprising the steps of: depositing a fuel electrode layer on a fuel electrode support layer; depositing an electrolyte layer comprising stabilised zirconia on the fuel electrode layer to provide an assembly of fuel electrode support, fuel electrode and electrolyte; optionally sintering the assembly of fuel electrode support, fuel electrode and electrolyte together to provide a pre-sintered half cell; depositing on the electrolyte layer of the pre-sintered half cell one or more oxygen electrode layers, at least one of the oxygen electrode layers comprising a composite of lanthanum-strontium-manganite and stabilised zirconia to provide a complete solid oxide cell; sintering the oxygen electrode layers together with the pre-sintered half cell to provide a sintered complete solid oxide cell; and impregnating the one or more oxygen electrode layers of the sintered complete solid oxide cell with manganese to obtain a manganese impregnated solid oxide cell.

Abstract: A method for preparing deagglomerated fibres and/or particles and for providing the fibres and/or particles with a substantially uniform protective coating, the fibres and/or particles being of a material selected from the group consisting of carbides oxides, nitrides, silicides, borides, metals and graphite, including SiC, TiC, ZrC, WC, NbC, AlN, TiN, BN, Si.sub.3 N.sub.4, MgO, Al.sub.2 O.sub.3, SiO.sub.2, ZrO.sub.2, Fe.sub.2 O.sub.3, Y.sub.2 O.sub.3, steel, tungsten, molybdenum and carbon, the method comprising (a) preparing an inorganic colloid sol, and (b) mixing the fibres and/or particles are deagglomerated and substantially homogeneously distributed. The fibres and/or particles, e.g. SiC whiskers provided with an aluminum oxide coating by treatment with an aluminum hydroxide-based sol, are used for the preparation of metal matrix composite materials, e.g. based on aluminum or an aluminum alloy.